Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Abstract: A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short.

Abstract: A common mode choke coil includes two laminated coil conductors, a first magnetic substrate arranged on one of the coil conductors, and a second magnetic substrate arranged on the other coil conductor. When it is assumed that a distance from a conductor center of the one coil conductor to the surface of the first magnetic substrate is designated as A, a distance from a conductor center of the other coil conductor to the surface of the second magnetic substrate is designated as B, and a distance from the conductor center of the one coil conductor to the conductor center of the other coil conductor is designated as C, C<(A+B)/2 is satisfied. Accordingly, because a difference in the distances between the magnetic substrates and the coil conductors becomes relatively small, a leakage inductance due to the difference in the distance decreases, and the cut-off frequency with respect to a differential mode signal can be increased.

Abstract: A common mode choke coil is provided with first and second coil conductors that are magnetically coupled to each other, a third coil conductor that is electrically connected in series to the first coil conductor and substantially not magnetically coupled to the first coil conductor, a fourth coil conductor that is electrically connected in series to the second coil conductor and substantially not magnetically coupled to the second coil conductor, a first contact conductor for connecting the third coil conductor with the inner end of the first coil conductor, and a second contact conductor for connecting the fourth coil conductor with the inner end of the second coil conductor. The third coil conductor and the fourth coil conductor are substantially not magnetically coupled, and are in a linear symmetrical relationship based on a prescribed center line.

Abstract: A thin-film type common-mode choke coil includes a laminated structure having a magnetic substrate; and electrically insulating layers and conductor layers laminated on the magnetic substrate in a direction of thickness, wherein said conductor layers form at least two coil conductors; at least two of the conductor layers are provided as spiral conductor patterns; and the spiral conductor patterns satisfy the expression: 5 ?m?W1?36 ?m in which W1 is the conductor width of each of the spiral conductor patters. The spiral conductor patterns may also satisfy the expression: 100 ?m2?T*W1 in which T is the conductor thickness of each of said spiral conductor patterns or satisfy the expression: W2<T×2 in which W2 is the space between said spiral conductor patterns, and T is the conductor thickness of each of said spiral conductor patterns.

Abstract: There is disclosed a method for producing a film with use of aerosol which is capable of forming a film of satisfactory quality at a high film formation rate. In the method, first, a carrier gas is mixed into a particle mixture which comprises raw fine particles comprising a brittle material as a main component and having a 50% average particle diameter of 0.010 ?m to 1.0 ?m on a volume basis, and auxiliary particles comprising a brittle material of the same type as or a different type from the brittle material of the raw fine particles as a main component and having a 50% average particle diameter of 3.0 ?m to 100 ?m on a volume basis, to form an aerosol. The aerosol is ejected onto the surface of a substrate to make the particle mixture come into collision with the substrate, so that the collision crushes or deforms the raw fine particles to form a film on the substrate.

Abstract: A common mode choke coil has a first coil element and a second coil element. The first coil element is configured of a first coil pattern and a second coil pattern. Each of the first and second coil patterns has two ends and is spiral-shaped therebetween. The spirals of the two patterns are wound in the same direction. The second coil element has a shape identical to the first coil element and includes a third coil pattern corresponding to the first coil pattern and a fourth coil pattern corresponding to the second coil pattern.

Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

Abstract: The invention relates to a coil component used as a main component of a common mode choke coil or a transformer and a method of manufacturing the same, and the invention is aimed at providing a coil component with a small size and a low height having high differential transmission characteristics and a method of manufacturing the same. A common mode choke coil has a configuration in which an insulation film, a coil conductor, another insulation film, another coil conductor and another insulation film are stacked in the order listed between magnetic substrates provided opposite to each other. The coil conductors have a coil section which is in a trapezoidal general configuration. A top portion of the coil section is formed in a convex configuration such that it bulges in the form of a convex, and a bottom portion of the coil section is formed in a planar configuration.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

Abstract: A composite structure body obtained through a plurality of processes including forming composite fine particles by way of a process in which a surface of the fine particles of a brittle material is coated with another brittle material; then by bombarding the composite fine particles against a surface of a substrate at high velocities, an anchor portion biting the substrate surface is formed; the composite fine particles are simultaneously distorted and fractured by impact of the bombardment; mutual rejoining of the composite fine particles is made through intermediary of a newly generated active surface formed by the distortion or fracture; and thereby forming a structure body in which crystals and/or microstructures of the brittle materials are dispersed above the anchor portion; and a pre-processing which includes imparting internal distortion to the brittle material fine particles.

Abstract: A common-mode filter comprises a first conductor layer, a second conductor layer, and an insulating layer placed between the first and second conductor layers. The first conductor layer has a first spiral part formed such as to draw a convolution and a first lead electrode extending from one end of the first spiral part. The second conductor layer has a second spiral part formed such as to draw a convolution and a second lead electrode extending from one end of the second spiral part. The first conductor layer is formed with third and fourth lead electrodes. The second conductor layer is formed with a connecting conductor connecting the third lead electrode to the other end of the first spiral part. The fourth lead electrode is connected to the other end of the second spiral part through a contact hole formed in the insulating layer. The third lead electrode is connected to one end of the connecting conductor through a contact hole formed in the insulating layer.

Abstract: The present invention provides a composite structure body obtained through processes of forming composite fine particles by way of a process in which a surface of brittle material fine particles is coated with at least one type of ductile material, bombarding the composite fine particles at a high velocity against a surface of a substrate, mutual rejoining of the composite fine particles is made through intermediary of a newly generated active surface formed by distortion or fracture, and thereby forming a structure body, above an anchor portion, in which crystals of the brittle material and crystals and/or microstructures of the ductile material fine particles are dispersed, and imparting internal distortion to the brittle material fine particles.

Abstract: The present invention provides a composite structure body obtained through processes of forming composite fine particles by way of a process in which a surface of brittle material fine particles is coated with at least one type of ductile material, bombarding the composite fine particles at a high velocity against a surface of a substrate, mutual rejoining of the composite fine particles is made through intermediary of a newly generated active surface formed by distortion or fracture, and thereby forming a structure body, above an anchor portion, in which crystals of the brittle material and crystals and/or microstructures of the ductile material fine particles are dispersed, and imparting internal distortion to the brittle material fine particles.

Abstract: A composite structure body obtained through a plurality of processes including forming composite fine particles by way of a process in which a surface of the fine particles of a brittle material is coated with another brittle material; then by bombarding the composite fine particles against a surface of a substrate at high velocities, an anchor portion biting the substrate surface is formed; the composite fine particles are simultaneously distorted and fractured by impact of the bombardment; mutual rejoining of the composite fine particles is made through intermediary of a newly generated active surface formed by the distortion or fracture; and thereby forming a structure body in which crystals and/or microstructures of the brittle materials are dispersed above the anchor portion; and a pre-processing which includes imparting internal distortion to the brittle material fine particles.

Abstract: A common-mode filter comprises a first conductor layer, a second conductor layer, and an insulating layer placed between the first and second conductor layers. The first conductor layer has a first spiral part formed such as to draw a convolution and a first lead electrode extending from one end of the first spiral part. The second conductor layer has a second spiral part formed such as to draw a convolution and a second lead electrode extending from one end of the second spiral part. The first conductor layer is formed with third and fourth lead electrodes. The second conductor layer is formed with a connecting conductor connecting the third lead electrode to the other end of the first spiral part. The fourth lead electrode is connected to the other end of the second spiral part through a contact hole formed in the insulating layer. The third lead electrode is connected to one end of the connecting conductor through a contact hole formed in the insulating layer.

Abstract: Each of first and second coil conductors has a spiral form and is disposed between first and second magnetic substrates. The first and second coil conductors include first parts arranged so as to extend along each other with a predetermined gap therebetween on a first insulating layer, and second parts intersecting each other three-dimensionally. The first and second coil conductors intersect each other in their middle part as seen from a direction orthogonal to the principal face of the first magnetic substrate (second magnetic substrate).

Abstract: A structure body having the constitution in which the crystals of more than one types of brittle materials such as ceramics, metalloids, and the like are dispersed, a portion composed of the brittle materials is polycrystalline, the crystals constituting the polycrystalline portion substantially lacks the crystalline orientation, and boundary layers composed of glassy substances are substantially absent in the boundary face between the crystals. Accordingly, it is possible to obtain a structure body composed of more than one types of brittle materials and having novel properties without involving a heating/sintering process.