Abstract: A semiconductor device includes: a first circuit pattern, a second circuit pattern, a third circuit pattern, and a fourth circuit pattern; a semiconductor chip and a first electrode arranged on the first circuit pattern; a second electrode disposed on the second circuit pattern; a third electrode disposed on the third circuit pattern; and a fourth electrode disposed on the fourth circuit pattern, a pad disposed on the semiconductor chip and the second circuit pattern are connected via first wiring, a surface of the semiconductor chip and the third circuit pattern are connected via second wiring, the surface of the semiconductor chip and the fourth circuit pattern are connected via third wiring, the second wiring and the third wiring are arranged on the same side of the surface of the semiconductor chip and in parallel with each other, and the first wiring is disposed on an opposite side from the third wiring.