Patents by Inventor Tomokazu Komazaki

Tomokazu Komazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7893794
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: February 22, 2011
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 7859362
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: December 28, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 7679472
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: March 16, 2010
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Publication number: 20100007434
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Application
    Filed: October 30, 2007
    Publication date: January 14, 2010
    Applicant: Oki Electronic Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 7602263
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: October 13, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 7479845
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: January 20, 2009
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Publication number: 20080290964
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Application
    Filed: October 30, 2007
    Publication date: November 27, 2008
    Applicant: Oki Electronic Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 7420440
    Abstract: A surface acoustic wave filter includes an antenna terminal, a transmitting filter and a variable branching line both of which are coupled to the antenna terminal and a receiving filter coupled to the variable branching line. The transmitting filter has a first end series-arm SAW resonator, a second end series-arm SAW resonator, a middle series-arm SAW resonator coupled between the first and second end series-arm SAW resonators and parallel-arm SAW resonators. Each of the first and second end series-arm SAW resonator has a first resonance frequency. The middle series-arm SAW resonator has a second resonance frequency that is higher than the first resonance frequency.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: September 2, 2008
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Kenichi Anasako, Yoshiaki Fujita, Hisanori Ehara, Tomokazu Komazaki
  • Publication number: 20080136556
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Application
    Filed: October 30, 2007
    Publication date: June 12, 2008
    Applicant: Oki Electronic Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Publication number: 20080129413
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Application
    Filed: October 30, 2007
    Publication date: June 5, 2008
    Applicant: Oki Electronic Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 7242271
    Abstract: A SAW filter circuit has: a first circuit having first to fourth connecting points, a first SAW resonator electrically connected to the first and second connecting points, second SAW resonator electrically connected to the first and third connecting points, and third SAW resonator electrically connected to the second and fourth connecting points; and a second circuit made of a fifth connecting point electrically connected to the third connecting point, a sixth connecting point electrically connected to the fourth connecting point, seventh and eighth connecting points being electrically short-circuited, a first passive element electrically connected to the fifth and sixth connecting points, a second passive element electrically connected to the fifth and seventh connecting points, and a third passive element electrically connected to the sixth and eighth connecting points. Each passive elements is an inductor or capacitor, and at least one of the first to third passive elements is a capacitor.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: July 10, 2007
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Tomokazu Komazaki
  • Patent number: 7034392
    Abstract: A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode (235). The upper ground electrode (235) and a lower surface ground electrode (237) are connected to each other via through electrodes (261, 262, 263), ground wiring patterns (251, 252), first connecting lines (271 to 276), and second connecting lines (281, 282). The first connecting lines (271 to 276) are connected to the ground wiring patterns (251, 252), whereas the second connecting lines (281, 282) are not connected to the ground wiring patterns (251, 252), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns (251, 252) and the connecting lines unconnected to the ground wiring patterns (251, 252), the impedance between a multilayer package substrate and ground can be adjusted.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: April 25, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Akio Hirakawa, Yoshiaki Fujita, Tomokazu Komazaki
  • Patent number: 6960966
    Abstract: A high-performance SAW filter is to be provided which has lower insertion loss in a pass band and high attenuation in an attenuation band on the low frequency side of the pass band. In a SAW filter with attenuation poles configured of a two-port circuit for filtering for forming a ladder type SAW filter using a SAW resonator and a two-port circuit for impedance formed of an impedance serially connected, the impedance of the two-port circuit for impedance is configured so as to form an attenuation band of a predetermined width having a sufficient attenuation characteristic on the low frequency side of a pass band.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: November 1, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Kazushige Noguchi, Satoshi Terada, Wataru Ohashi, Tomokazu Komazaki
  • Publication number: 20050190015
    Abstract: A SAW filter circuit has: a first circuit having first to fourth connecting points, a first SAW resonator electrically connected to the first and second connecting points, second SAW resonator electrically connected to the first and third connecting points, and third SAW resonator electrically connected to the second and fourth connecting points; and a second circuit made of a fifth connecting point electrically connected to the third connecting point, a sixth connecting point electrically connected to the fourth connecting point, seventh and eighth connecting points being electrically short-circuited, a first passive element electrically connected to the fifth and sixth connecting points, a second passive element electrically connected to the fifth and seventh connecting points, and a third passive element electrically connected to the sixth and eighth connecting points. Each passive elements is an inductor or capacitor, and at least one of the first to third passive elements is a capacitor.
    Type: Application
    Filed: February 28, 2005
    Publication date: September 1, 2005
    Applicant: Oki Electric Industry Co., Ltd.
    Inventor: Tomokazu Komazaki
  • Patent number: 6937113
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Grant
    Filed: April 3, 2002
    Date of Patent: August 30, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Patent number: 6911878
    Abstract: A surface acoustic wave filter includes an antenna terminal, a transmitting filter and a variable branching line both of which are coupled to the antenna terminal and a receiving filter coupled to the variable branching line. The transmitting filter has a first end series-arm SAW resonator, a second end series-arm SAW resonator, a middle series-arm SAW resonator coupled between the first and second end series-arm SAW resonators and parallel-arm SAW resonators. Each of the first and second end series-arm SAW resonator has a first resonance frequency. The middle series-arm SAW resonator has a second resonance frequency that is higher than the first resonance frequency.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: June 28, 2005
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Kenichi Anasako, Yoshiaki Fujita, Hisanori Ehara, Tomokazu Komazaki
  • Publication number: 20050134407
    Abstract: A surface acoustic wave filter includes an antenna terminal, a transmitting filter and a variable branching line both of which are coupled to the antenna terminal and a receiving filter coupled to the variable branching line. The transmitting filter has a first end series-arm SAW resonator, a second end series-arm SAW resonator, a middle series-arm SAW resonator coupled between the first and second end series-arm SAW resonators and parallel-arm SAW resonators. Each of the first and second end series-arm SAW resonator has a first resonance frequency. The middle series-arm SAW resonator has a second resonance frequency that is higher than the first resonance frequency.
    Type: Application
    Filed: November 9, 2004
    Publication date: June 23, 2005
    Inventors: Kenichi Anasako, Yoshiaki Fujita, Hisanori Ehara, Tomokazu Komazaki
  • Publication number: 20050122187
    Abstract: A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
    Type: Application
    Filed: January 11, 2005
    Publication date: June 9, 2005
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Wataru Ohashi, Hajime Shimamura, Tomokazu Komazaki, Yoshiaki Fujita
  • Publication number: 20050104203
    Abstract: A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode (235). The upper ground electrode (235) and a lower surface ground electrode (237) are connected to each other via through electrodes (261, 262, 263), ground wiring patterns (251, 252), first connecting lines (271 to 276), and second connecting lines (281, 282). The first connecting lines (271 to 276) are connected to the ground wiring patterns (251, 252), whereas the second connecting lines (281, 282) are not connected to the ground wiring patterns (251, 252), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns (251, 252) and the connecting lines unconnected to the ground wiring patterns (251, 252), the impedance between a multilayer package substrate and ground can be adjusted.
    Type: Application
    Filed: July 8, 2004
    Publication date: May 19, 2005
    Applicant: Oki Electric Industry Co., Ltd.
    Inventors: Akio Hirakawa, Yoshiaki Fujita, Tomokazu Komazaki
  • Patent number: RE43958
    Abstract: A polar SAW (Surface Acoustic Wave) filter includes a band-pass ladder type SAW filter having a SAW resonator. A two-terminal pair circuit is serially connected to the band-pass ladder type SAW filter and includes a plurality of inductors. The polar SAW filter has attenuation poles in each of the higher-frequency and lower-frequency attenuation ranges of a pass band.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: February 5, 2013
    Assignee: Intellectual Ventures Fund 77 LLC
    Inventor: Tomokazu Komazaki