Patents by Inventor Tomokazu Nakashima
Tomokazu Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12136337Abstract: An information processing apparatus capable of communicating with a vehicle includes a control unit and a communication unit. The control unit is configured to acquire, from the vehicle via the communication unit, vehicle information including at least one of open-close information of a door of the vehicle and location information of the vehicle, and determine a personality of a driver of the vehicle based on the vehicle information.Type: GrantFiled: May 24, 2022Date of Patent: November 5, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Toyokazu Nakashima, Ryuichi Kamaga, Mitsuhiro Miura, Yasuhiro Baba, Tomokazu Maya, Ryosuke Kobayashi, Genshi Kuno
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Patent number: 12083357Abstract: A radiation therapy apparatus that enhances the reliability and ease of use of a treatment is provided. A radiation therapy apparatus includes: a treatment bed moving a top plate with an object to be treated placed on the top plate to a predetermined treatment location; an imaging apparatus moving to the predetermined treatment location from a direction different from the direction of movement of the top plate and picking up an image of the object to be treated; and an irradiation apparatus provided between the treatment bed and the imaging apparatus, extensible, and applying a radioactive ray to the object to be treated. When the CT apparatus moves to the treatment location, the irradiation apparatus moves to a predetermined waiting position. When applying a radioactive ray to an object to be treated, the irradiation apparatus moves to a predetermined irradiation position.Type: GrantFiled: October 24, 2019Date of Patent: September 10, 2024Assignee: HITACHI HIGH-TECH CORPORATIONInventors: Taizo Honda, Tatsuya Fujisawa, Chihiro Nakashima, Tomokazu Shimakura
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Publication number: 20200090120Abstract: An apparatus refers to information indicating relationships between conditions when a part is transported, transportation times of the part, and characteristic changes of the part, and makes a determination of whether or not a characteristic change of the part corresponding to a transportation time required when a first transportation route is passed through exceeds a threshold value based on conditions when the first transportation route is used for transporting the part. When it has been determined that the threshold value is not exceeded, the apparatus outputs information for identifying the first transportation route, and when it has been determined that the threshold value is exceeded, the apparatus makes the determination with respect to a second transportation route different from the first transportation route.Type: ApplicationFiled: August 14, 2019Publication date: March 19, 2020Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, MICHIKO NARITA, Masayuki ITOH
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Patent number: 10395832Abstract: A method of manufacturing an electronic component includes forming a component body into which elements are built; and a metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements, the metal plate electrode exceeding in size a surface of the component body onto which the conductive paste is deposited.Type: GrantFiled: February 15, 2019Date of Patent: August 27, 2019Assignee: FUJITSU LIMITEDInventors: Tomokazu Nakashima, Masayuki Itoh, Yoshinori Mesaki
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Publication number: 20190180939Abstract: A method of manufacturing an electronic component includes forming a component body into which elements are built; and a metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements, the metal plate electrode exceeding in size a surface of the component body onto which the conductive paste is deposited.Type: ApplicationFiled: February 15, 2019Publication date: June 13, 2019Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH, YOSHINORI MESAKI
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Patent number: 10283270Abstract: An electronic component includes: a component body into which elements are built; and a metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements, wherein the metal plate electrode exceeds in size a surface of the component body onto which the conductive paste is deposited.Type: GrantFiled: June 14, 2016Date of Patent: May 7, 2019Assignee: FUJITSU LIMITEDInventors: Tomokazu Nakashima, Masayuki Itoh, Yoshinori Mesaki
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Publication number: 20180240605Abstract: An electronic component includes a main body mounted over a board, a case that houses the main body, a base member that is arranged between the case and the board, a lead that extends out from the main body and penetrates through the base member to be joined onto the board, and a leg that extends out from the case and penetrates through the base member to be joined to the board.Type: ApplicationFiled: February 9, 2018Publication date: August 23, 2018Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH, Yoshinori MESAKI
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Patent number: 9865396Abstract: A capacitor includes: dielectric layers including a first dielectric layer, a second dielectric layer, and at least one intermediate dielectric layer laminated between the first dielectric layer and the second dielectric layer; first interlayer electrode and second interlayer electrode arranged alternately with each other between at least two layers among the dielectric layers; a first external electrode disposed on lateral surfaces of the dielectric layers and coupled to the first interlayer electrode; and a second external electrode disposed on lateral surfaces of the dielectric layers and coupled to the second interlayer electrode, wherein the intermediate dielectric layer includes first internal electrodes coupled to the first interlayer electrode, arranged in a plane direction of the intermediate dielectric layer and spaced apart from each other, and second internal electrodes coupled to the second interlayer electrode, arranged alternately with the first internal electrodes and spaced apart from the firType: GrantFiled: November 4, 2015Date of Patent: January 9, 2018Assignee: FUJITSU LIMITEDInventors: Tomokazu Nakashima, Masayuki Itoh
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Publication number: 20170019999Abstract: An electronic component includes: a component body into which elements are built; and a metal plate electrode that is joined to the component body by conductive paste so as to be electrically coupled to the elements, wherein the metal plate electrode exceeds in size a surface of the component body onto which the conductive paste is deposited.Type: ApplicationFiled: June 14, 2016Publication date: January 19, 2017Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH, YOSHINORI MESAKI
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Patent number: 9384900Abstract: An electronic component includes a metal case with an opening at one end, a metal foil placed in an internal space of the metal case, a packing made of an elastic material and fit into the opening of the metal case, the packing having a through-bore, a cap made of a foamed material and provided at an outer side of the packing, a conductive tab inserted in the through-bore of the packing and connected at one end to the metal foil in the internal space of the metal case, and a lead with a first end connected to another end of the conductive tab and a second end projecting externally from the metal case.Type: GrantFiled: February 21, 2014Date of Patent: July 5, 2016Assignee: FUJITSU LIMITEDInventors: Tomokazu Nakashima, Masayuki Itoh
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Publication number: 20160155089Abstract: A computer-readable recording medium stores therein a program that causes a computer to execute a process. The process includes receiving a condition for using a component; referring to a stored content of a first storage unit that stores a characteristic value of the component for each condition for using the component, thereby acquiring a characteristic value that is related to the received condition; referring to a stored content of a second storage unit that stores a price of the component, thereby acquiring the price that is related to the component; normalizing the acquired price by using the acquired characteristic value; and outputting the normalized price.Type: ApplicationFiled: February 3, 2016Publication date: June 2, 2016Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH, Kiyokazu MORIIZUMI
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Publication number: 20160055977Abstract: A capacitor includes: dielectric layers including a first dielectric layer, a second dielectric layer, and at least one intermediate dielectric layer laminated between the first dielectric layer and the second dielectric layer; first interlayer electrode and second interlayer electrode arranged alternately with each other between at least two layers among the dielectric layers; a first external electrode disposed on lateral surfaces of the dielectric layers and coupled to the first interlayer electrode; and a second external electrode disposed on lateral surfaces of the dielectric layers and coupled to the second interlayer electrode, wherein the intermediate dielectric layer includes first internal electrodes coupled to the first interlayer electrode, arranged in a plane direction of the intermediate dielectric layer and spaced apart from each other, and second internal electrodes coupled to the second interlayer electrode, arranged alternately with the first internal electrodes and spaced apart from the firType: ApplicationFiled: November 4, 2015Publication date: February 25, 2016Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH
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Patent number: 9208951Abstract: A capacitor includes: dielectric layers including a first dielectric layer, a second dielectric layer, and at least one intermediate dielectric layer laminated between the first dielectric layer and the second dielectric layer; first interlayer electrode and second interlayer electrode arranged alternately with each other between at least two layers among the dielectric layers; a first external electrode disposed on lateral surfaces of the dielectric layers and coupled to the first interlayer electrode; and a second external electrode disposed on lateral surfaces of the dielectric layers and coupled to the second interlayer electrode, wherein the intermediate dielectric layer includes first internal electrodes coupled to the first interlayer electrode, arranged in a plane direction of the intermediate dielectric layer and spaced apart from each other, and second internal electrodes coupled to the second interlayer electrode, arranged alternately with the first internal electrodes and spaced apart from the firType: GrantFiled: November 25, 2014Date of Patent: December 8, 2015Assignee: FUJITSU LIMITEDInventors: Tomokazu Nakashima, Masayuki Itoh
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Publication number: 20150213958Abstract: A capacitor includes: dielectric layers including a first dielectric layer, a second dielectric layer, and at least one intermediate dielectric layer laminated between the first dielectric layer and the second dielectric layer; first interlayer electrode and second interlayer electrode arranged alternately with each other between at least two layers among the dielectric layers; a first external electrode disposed on lateral surfaces of the dielectric layers and coupled to the first interlayer electrode; and a second external electrode disposed on lateral surfaces of the dielectric layers and coupled to the second interlayer electrode, wherein the intermediate dielectric layer includes first internal electrodes coupled to the first interlayer electrode, arranged in a plane direction of the intermediate dielectric layer and spaced apart from each other, and second internal electrodes coupled to the second interlayer electrode, arranged alternately with the first internal electrodes and spaced apart from the firType: ApplicationFiled: November 25, 2014Publication date: July 30, 2015Applicant: Fujitsu LimitedInventors: Tomokazu Nakashima, Masayuki Itoh
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Publication number: 20140168860Abstract: An electronic component includes a metal case with an opening at one end, a metal foil placed in an internal space of the metal case, a packing made of an elastic material and fit into the opening of the metal case, the packing having a through-bore, a cap made of a foamed material and provided at an outer side of the packing, a conductive tab inserted in the through-bore of the packing and connected at one end to the metal foil in the internal space of the metal case, and a lead with a first end connected to another end of the conductive tab and a second end projecting externally from the metal case.Type: ApplicationFiled: February 21, 2014Publication date: June 19, 2014Applicant: FUJITSU LIMITEDInventors: Tomokazu NAKASHIMA, Masayuki ITOH
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Patent number: 8446708Abstract: A solid electrolytic capacitor includes a capacitor element having two opposite cathode surfaces, a cathode terminal metal plate having a first cathode connecting portion electrically connected to one of the two opposite cathode surfaces, and an auxiliary cathode metal plate having a second cathode connecting portion electrically connected to the other one of the two opposite cathode surfaces of the capacitor element. The cathode terminal metal plate includes a groove electrically connected to the first cathode connecting portion. The auxiliary cathode metal plate includes an end portion that is electrically connected to the second cathode connecting portion and engages with the groove. The cathode terminal metal plate further includes an outer terminal portion.Type: GrantFiled: June 2, 2011Date of Patent: May 21, 2013Assignee: Fujitsu LimitedInventors: Tomokazu Nakashima, Masayuki Itoh
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Patent number: 8440481Abstract: Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.Type: GrantFiled: December 7, 2011Date of Patent: May 14, 2013Assignee: Fujitsu LimitedInventors: Masayuki Itoh, Takao Ishikawa, Tomokazu Nakashima
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Patent number: 8196278Abstract: A method for taking an electronic component out of a carrier tape configured to house the electronic component in a concave that is defined by a sidewall and a bottom surface reduces a binding force applied by the concave to the electronic component by stretching the sidewall to outside near a perforation hole that is formed at least one of the sidewall and a portion of the bottom surface adjacent to the sidewall.Type: GrantFiled: December 10, 2009Date of Patent: June 12, 2012Assignee: Fujitsu LimitedInventors: Tomokazu Nakashima, Masako Okazaki, Masayuki Itoh
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Publication number: 20120088335Abstract: Manufacturing method of an electronic component including connecting one lead of a pair of leads to a surface parallel with a pn connection layer of an electronic element having a structure where the p-type layer and the n-type layer are connected by the pn connection layer provided between the p-type layer and the n-type layer, connecting another lead to another surface parallel with the pn connection layer; and forming a supporting part of the pair of the leads that is connected to and supporting the electronic element, and an electrode part functioning as an electrode, by bending the pair of the leads to an outside.Type: ApplicationFiled: December 7, 2011Publication date: April 12, 2012Applicant: FUJITSU LIMITEDInventors: Masayuki ITOH, Takao ISHIKAWA, Tomokazu NAKASHIMA
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Patent number: 8093616Abstract: An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end connected to a pad formed on the board; wherein the main body part is provided with the leads so that a functional surface of the main body part is positioned at a side connected to the pads of the board.Type: GrantFiled: August 20, 2007Date of Patent: January 10, 2012Assignee: Fujitsu LimitedInventors: Masayuki Itoh, Takao Ishikawa, Tomokazu Nakashima