Patents by Inventor Tomokazu OHSHIRO

Tomokazu OHSHIRO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic guide, ceramic guide device, and cermic guide module
    Patent number: 11944456
    Abstract: A ceramic guide device includes a columnar ceramic guide including a first portion including a first end, a second portion including a second end and having a smaller diameter than a diameter of the first portion, and a third portion disposed between the first portion and the second portion, the columnar ceramic guide provided with an insertion hole through which a long wire electrode can be inserted from the first end to the second end; and the long wire electrode that penetrates through the insertion hole, the long wire electrode including a first protruding portion projecting from the first end, and a second protruding portion projecting from the second end.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: April 2, 2024
    Assignees: KYOCERA Corporation, TOHOKU UNIVERSITY
    Inventors: Daisuke Komada, Hajime Mushiake, Tomokazu Ohshiro
  • CERAMIC GUIDE, CERAMIC GUIDE DEVICE, AND CERMIC GUIDE MODULE
    Publication number: 20210045688
    Abstract: A ceramic guide device includes a columnar ceramic guide including a first portion including a first end, a second portion including a second end and having a smaller diameter than a diameter of the first portion, and a third portion disposed between the first portion and the second portion, the columnar ceramic guide provided with an insertion hole through which a long wire electrode can be inserted from the first end to the second end; and the long wire electrode that penetrates through the insertion hole, the long wire electrode including a first protruding portion projecting from the first end, and a second protruding portion projecting from the second end.
    Type: Application
    Filed: January 31, 2019
    Publication date: February 18, 2021
    Applicants: KYOCERA Corporation, TOHOKU UNIVERSITY
    Inventors: Daisuke KOMADA, Hajime MUSHIAKE, Tomokazu OHSHIRO