Abstract: A coating agent for a rubber-coated cylinder head gasket contains a lubricant and a urethane resin. The lubricant is unsintered polytetrafluoroethylene resin particles having an average primary particle size of 1 ?m or less. The amount of the unsintered polytetrafluoroethylene resin particles in a solid content is 30 to 80% by volume. The present invention provides a coating agent for a rubber-coated cylinder head gasket that can form a coat that is highly wear-resistant under high contact pressure and high temperature conditions and with which a rubber layer is less likely to stick to the seal face of the cylinder block or the cylinder head after the use under high contact pressure and high temperature conditions, and a cylinder head gasket obtained using the coating agent.

Abstract: A method of producing a rubber molded article, involving utilizing a compound different from a compound that has been used as a crosslinking agent. The method of producing a rubber molded article includes a crosslinking step of crosslinking a rubber component by decomposing a compound to be used as a crosslinking agent for the rubber component, the compound including a structure represented by the following formula (I), in a rubber composition containing the rubber component and the compound, the rubber composition including a sulfur content of 2.0 wt % or less: ?-?-? . . . (I) (in the formula (I), ? represents a monovalent organic group, ? represents —N?N—, and ? represents hydrogen or a monovalent organic group).

Abstract: A coating agent includes a polyurethane and a hydrocarbon-based synthetic wax.

Abstract: A coating agent contains a particulate fluorocarbon polymer, an acid-modified polyolefin, a urethane resin, and a curing agent. The present invention provides a coating agent capable of forming a coat with high wear resistance under high contact pressure and high temperature conditions, a surface-coated elastic body obtained using the same, and a surface-coated rubber metal laminate.

Abstract: A sheet including exfoliated clay minerals, having a density of 1.6 g/cm3 or less and a compression ratio of 20% or more.

Abstract: A gasket including a sheet part that includes exfoliated clay minerals, wherein the exfoliated clay minerals are irregularly dispersed in the sheet part without being oriented.

Abstract: A coating agent for a rubber-coated cylinder head gasket contains a lubricant and a urethane resin. The lubricant is unsintered polytetrafluoroethylene resin particles having an average primary particle size of 1 ?m or less. The amount of the unsintered polytetrafluoroethylene resin particles in a solid content is 30 to 80% by volume. The present invention provides a coating agent for a rubber-coated cylinder head gasket that can form a coat that is highly wear-resistant under high contact pressure and high temperature conditions and with which a rubber layer is less likely to stick to the seal face of the cylinder block or the cylinder head after the use under high contact pressure and high temperature conditions, and a cylinder head gasket obtained using the coating agent.

Abstract: A coating agent contains a particulate fluorocarbon polymer, an acid-modified polyolefin, a urethane resin, and a curing agent. The present invention provides a coating agent capable of forming a coat with high wear resistance under high contact pressure and high temperature conditions, a surface-coated elastic body obtained using the same, and a surface-coated rubber metal laminate.

Abstract: A heat storage member includes a honeycomb structure having a plurality of cells, each of which is filled with capsules and a heat conductive filler. Each capsule contains a heat storage material. The heat storage member is prepared by bringing a starting material that is a mixture of the capsules into contact with the honeycomb structure to cover at least one surface of the opening of the cells of the honeycomb structure, subjecting the same to uniaxial pressure molding under the pressure of 4 MPa to 10 MPa, and filling each cell with the starting material.

Abstract: A semiconductor module includes upper arms and lower arms for three phases, heat sinks, a main circuit side bus bar, an output terminal side bus bar, a control terminal, and a resin mold portion. The output terminal side bus bar includes U-phase to W-phase wiring layers disposed opposite to each other via an insulating layer and U to W terminals electrically connecting each of the U-phase to W-phase wiring layer and a load. A stacked layer number of the U-phase to W-phase wiring layer is set to be an even number.

Abstract: A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames, so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portions can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance.

Abstract: A sheet including exfoliated clay minerals, having a density of 1.6 g/cm3 or less and a compression ratio of 20% or more.

Abstract: In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.

Abstract: A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames, so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portion can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance.

Abstract: Provided is a method of producing a rubber molded article, including crosslinking a rubber compound at a temperature lower than a usual crosslinking temperature (150° C. or more). The method includes a crosslinking step of crosslinking a rubber compound at a temperature of 100° C. or less, the rubber compound having a nitrile structure represented by the following formula (I) and an olefin structure represented by the following formula (II), in a rubber composition containing the rubber compound and a thiol compound having at least two thiol groups in a molecule thereof: provided that R in the formula (II) represents a divalent organic group having 4 or more carbon atoms and having an unsaturated bond represented by —C?C— in a structure thereof.

Abstract: A method of producing a rubber molded article, involving utilizing a compound different from a compound that has been used as a crosslinking agent. The method of producing a rubber molded article includes a crosslinking step of crosslinking a rubber component by decomposing a compound to be used as a crosslinking agent for the rubber component, the compound including a structure represented by the following formula (I), in a rubber composition containing the rubber component and the compound, the rubber composition including a sulfur content of 2.0 wt % or less: ?-?-? . . . (I) (in the formula (I), ? represents a monovalent organic group, ? represents —N?N—, and ? represents hydrogen or a monovalent organic group).

Abstract: In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.

Abstract: A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portion can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance.

Abstract: A light and inexpensive heat storage member applicable to spacecrafts is provided. The heat storage member includes a honeycomb structural body having a plurality of cells. Each of the cells is filled with a capsule, which contains a heat storage material, and a heat conductive filler. The heat storage member is provided by bringing a starting material that is a mixture of the capsule containing the heat storage material and the heat conductive filler into contact with the honeycomb structural body to cover at least one surface of the opening of the cells of the honeycomb structure body, subjecting the same to uniaxial pressure molding under the pressure of 4 MPa or more and 10 MPa or less, and filling each cell with the starting material.