Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.

Abstract: A distal end frame includes: a first distal end frame member that includes a resin molded product which constitutes a molded interconnect device; a housing chamber that is provided on a distal end side of the first distal end frame member, and is formed of a recessed portion a distal end and one side of which are opened; a second distal end frame member that is composed of the resin molded product constituting the molded interconnect device, and is configured to close the one side of the housing chamber; a signal pattern that is the metal pattern formed in a region including a first joining surface which is a joining surface with the second distal end frame member, on a surface of the first distal end frame member; and a solder material which is configured to join the first distal end frame member and the second distal end frame member.

Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

Abstract: An endoscope device includes: an imaging unit including a semiconductor chip including an image sensor formed thereon, and a protective glass adhered on the image sensor with an adhesive layer; and a holder configured to hold the imaging unit by fitting the protective glass therein. The semiconductor chip includes: a light-receiving section; a peripheral circuit section; a guard ring surrounding the light-receiving section and the peripheral circuit section; and a plurality of metal dots formed on an outer circumference of the guard ring. The protective glass is adhered to the semiconductor chip by the adhesive layer so as to cover the light-receiving section, the peripheral circuit section, the guard ring, and the metal dots, and the metal dots are formed at a same interval from the outer circumference of the guard ring to a connection end portion of a connecting surface between the semiconductor chip and the protective glass.

Abstract: An endoscope includes: an imaging unit disposed at a distal end portion of an insertion section inserted into a body of a subject; and a built-in component provided parallel with the imaging unit at the distal end portion, and extending substantially parallel with an axial direction of the insertion section. The imaging unit includes: a solid state image sensor including a light receiving unit; a flexible circuit board electrically connecting the solid state image sensor; and a rigid circuit board at least partially disposed on a proximal end side of the endoscope relative to the solid state image sensor, and electrically connected to the flexible circuit board.

Abstract: An imaging unit includes: a flexible substrate including one end connected to a light receiving surface of a solid state image sensor, the flexible substrate extending to a surface side opposite to the light receiving surface; a multi-layer substrate connected to a surface of the flexible substrate, the surface of the flexible substrate being a surface to which the solid state image sensor is connected, the multi-layer substrate including a plurality of electronic components mounted thereon; and a connection layer configured to electrically and mechanically connect to connection members provided on the surface of the flexible substrate and a surface of the multi-layer substrate facing the surface of the flexible substrate.

Abstract: An imaging module includes: a solid-state imaging element including a light receiving face for receiving light; a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction and which is connected to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction; and a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate.

Abstract: A CBN grinding particle included in a CBN grinding wheel has a single crystal CBN grinding particle having a tetrahedron construction and a multi crystal CBN grinding particle. The single crystal CBN grinding particle is blended with a ratio of equal to or more than 50% to a total summed volume of the single and multi CBN grinding particles. A CBN grinding wheel having the CBN grinding particle is especially suitable for rough grinding.

Abstract: An imaging module includes: a solid-state imaging element including a light receiving face for receiving light; a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction and which is connected to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction; and a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate.

Abstract: A cutting tip including a cutting edge portion made of a high-hardness material to take a thin-plate shape; and a support portion made of a material which is more worn in contact with a workpiece than the cutting edge portion not to exert a machining action on the workpiece even in contact with the workpiece, and securing and supporting the cutting edge portion on a reverse side of a rake face of the cutting edge portion. Thus, the width of flank wear is prevented from increasing and chipping of the cutting edge is prevented, so that the life of the cutting tip can be extended.

Abstract: In a vitrified bonded grinding wheel that is formed so that superabrasives formed of cubic boron nitride (CBN) grains or diamond grains are bonded and held with a vitrified binder, the vitrified binder is formed of oxide particles and amorphous glass, and the vitrified binder has no open pore that is in fluid communication with outside air.

Abstract: It is an object of the present invention to provide a cubic boron nitride grinding wheel especially suitable for a rough grinding. A CBN grinding particle included in a CBN grinding wheel has a single crystal CBN grinding particle having a tetrahedron construction and a multi crystal CBN grinding particle. The single crystal CBN grinding particle is blended with a ratio of equal to or more than 50% to a total summed volume of the single and multi CBN grinding particles.

Abstract: An image capturing unit for an electronic endoscope, including a solid-state image capturing element, a metallic housing member, which hermetically encloses a circumference of an insulated base and is arranged to cover a front-end portion of the insulated base, at least one connection land, which is connected to at least one signal conductor at a position in vicinity to a rear-end portion of the insulated base outside the housing member, and a conductive cylindrical shield, which surrounds the at least one connection land and the at least one signal conductor and is spaced from the at least one connection land and the at least one signal conductor in a radial direction, is provided. An outer periphery of the rear-end portion of the insulated base is formed to be smaller than the circumference of the insulated base enclosed by the housing member.

Abstract: A cutting tip including a cutting edge portion made of a high-hardness material to take a thin-plate shape; and a support portion made of a material which is more worn in contact with a workpiece than the cutting edge portion not to exert a machining action on the workpiece even in contact with the workpiece, and securing and supporting the cutting edge portion on a reverse side of a rake face of the cutting edge portion. Thus, the width of flank wear is prevented from increasing and chipping of the cutting edge is prevented, so that the life of the cutting tip can be extended.

Abstract: In a vitrified bonded grinding wheel that is formed so that superabrasives formed of cubic boron nitride (CBN) grains or diamond grains are bonded and held with a vitrified binder, the vitrified binder is formed of oxide particles and amorphous glass, and the vitrified binder has no open pore that is in fluid communication with outside air.

Abstract: An image capturing unit for an electronic endoscope is provided with a solid-state image capturing element having multiple boding wires arranged at peripheral positions on a front surface of the solid-state image capturing element, the bonding wires extending outward, an image capturing element holding frame in which the solid-state image capturing element is held and a transparent cover glass enclosing the front surface of the solid-state image capturing element from outside, together with a tip end portion of the image capturing element holding frame. The tip end portion of the image capturing element holding frame is formed to have a tubular section, the cover glass being fitted in the tubular section and located at a position where the cover glass does not contact the bonding wires, the cover glass being air-tightly cemented to the tubular section.

Abstract: An image capturing unit for an electronic endoscope, includes an image capturing element with an image capturing area, at least one bonding wire, which is extended curvedly and outwardly from at least one edge portion of a surface of the image capturing element to at least one conductor, and a transparent cover plate, which is fixed to a frame and is adapted to seal the image capturing element from an external environment. The cover plate is formed to have at least one bonding wire preventing portion, which is adapted to prevent the at least one bonding wire from being in contact with the cover plate. An edge portion on a front surface of the cover plate is hermetically sealed to the frame.

Abstract: An image capturing device for an electronic endoscope is provided with a solid-state image capturing element, an image capturing element holding frame, an objective lens barrel containing an objective optical system, an air-tight connection tube, a front end portion of the connection tube being air-tightly connected to the objective lens barrel, a rear end portion of the connection tube being air-tightly fitted on the image capturing element holding frame. Multiple connection lands to which multiple signal lines of a signal cable are connected are arranged on an outer circumferential surface, at a rear portion, of the image capturing element holding frame, the rear end portion of the connection tube being air-tightly connected to the outer circumference of the image capturing element holding frame on an front side, a size of an outline of the multiple signal lines being smaller than an outer shape of the connection tube.

Abstract: An image capturing element package for an electronic endoscope is provided with a solid-state image capturing element, an insulating base member made of electronically insulating material and configured to hold the image capturing element, a metallic package housing surrounding the solid-state image capturing element, a proximal end portion of the metallic package housing being air-tightly welded to the insulating base member, a window portion being formed on a front end surface of the metallic package housing, a cover glass air-tightly secured to the window portion, and a housing reinforcing member arranged along an inner surface of the metallic package housing, the housing reinforcing member being formed not to deform when a force exceeding strength at which the package housing is durable against deformation.

Abstract: An image capturing unit for an electronic endoscope is provided with a solid-state image capturing element having multiple boding wires arranged at peripheral positions on a front surface of the solid-state image capturing element, the bonding wires extending outward, an image capturing element holding frame in which the solid-state image capturing element is held and a transparent cover glass enclosing the front surface of the solid-state image capturing element from outside, together with a tip end portion of the image capturing element holding frame. The tip end portion of the image capturing element holding frame is formed to have a tubular section, the cover glass being fitted in the tubular section and located at a position where the cover glass does not contact the bonding wires, the cover glass being air-tightly cemented to the tubular section.