Patents by Inventor Tomoki AKIBA

Tomoki AKIBA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11142612
    Abstract: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH2) or —Si(CH3)2(CH2—CH?CH2).
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: October 12, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Kumiko Hayashi, Tomoki Akiba
  • Publication number: 20200392338
    Abstract: Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof (where R2 is a monovalent hydrocarbon group, R3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa·s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.
    Type: Application
    Filed: November 28, 2018
    Publication date: December 17, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tadashi ARAKI, Sawako SHODA, Takahiro YAMAGUCHI, Tomoki AKIBA
  • Patent number: 10858518
    Abstract: Provided is a curable organopolysiloxane composition from which highly heat-resistant cured products can be obtained, the curable organopolysiloxane composition comprising: (A) 100 parts by mass of a novel organopolysiloxane represented by formula (1) (R1 is an alkyl group or an alkoxy substituted alkyl group having 1 to 6 carbon atoms, R2 is a group selected from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and a group in which a portion of the hydrogen atoms of those groups is substituted with a halogen atom, Ar is an arylene group having 6 carbon atoms or more, a is 1 to 1,000, b is 1 to 5,000, and n is 1 to 3, the total of n in an unsubstituted or substituted alkoxysilyl group on both ends of the molecular chain being 3 or more); and (B) 0.01 to 10 parts by mass of a curing catalyst. Also provided are electrical and electronic components, a vehicle oil seal, a building sealant, etc. which use the cured product of the composition.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: December 8, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tomoki Akiba, Tadashi Araki, Takafumi Sakamoto
  • Publication number: 20190352466
    Abstract: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH?CH2) or —Si(CH3)2(CH2—CH?CH2).
    Type: Application
    Filed: January 16, 2018
    Publication date: November 21, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Akira Uta, Kumiko Hayashi, Tomoki Akiba
  • Publication number: 20190338126
    Abstract: Provided is a curable organopolysiloxane composition from which highly heat-resistant cured products can be obtained, the curable organopolysiloxane composition comprising: (A) 100 parts by mass of a novel organopolysiloxane represented by formula (1) (R1 is an alkyl group or an alkoxy substituted alkyl group having 1 to 6 carbon atoms, R2 is a group selected from an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, and a group in which a portion of the hydrogen atoms of those groups is substituted with a halogen atom, Ar is an arylene group having 6 carbon atoms or more, a is 1 to 1,000, b is 1 to 5,000, and n is 1 to 3, the total of n in an unsubstituted or substituted alkoxysilyl group on both ends of the molecular chain being 3 or more); and (B) 0.01 to 10 parts by mass of a curing catalyst. Also provided are electrical and electronic components, a vehicle oil seal, a building sealant, etc. which use the cured product of the composition.
    Type: Application
    Filed: November 6, 2017
    Publication date: November 7, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tomoki AKIBA, Tadashi ARAKI, Takafumi SAKAMOTO