Patents by Inventor Tomoki Hamajima

Tomoki Hamajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10976648
    Abstract: A technology that allows a user to view image information more comfortably has been demanded. The present disclosure provides an information processing apparatus including a control unit that controls a person detection unit on the basis of an irradiation direction in which an irradiation unit capable of irradiating various image information irradiates the image information, the person detection unit forming a detection area in a direction opposite to the irradiation direction. According to the present disclosure, the person detection unit is controlled on the basis of the irradiation direction, whereby an operation unintended by a user is less likely to be performed. The user can thus view the image information more comfortably.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: April 13, 2021
    Assignee: SONY MOBILE COMMUNICATIONS INC.
    Inventors: Yuichiro Saito, Shinji Matsuda, Tomoki Hamajima
  • Patent number: 10955960
    Abstract: There is provided a control device including: a projection control unit configured to control projection of an image on a projection plane by a projector; and a UI control unit configured to switch a mode of a user interface (UI) related to the projected image between two or more UI modes based on a positional relationship of the projector with respect to the projection plane.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: March 23, 2021
    Assignee: SONY CORPORATION
    Inventors: Yuichiro Saito, Tomoki Hamajima, Hirotsugu Kitamori, Shinji Matsuda, Hiroya Kudo
  • Patent number: 10815349
    Abstract: It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: October 27, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya Tomizawa, Tomoki Hamajima, Shohei Yamaguchi, Eisuke Shiga, Meguru Ito
  • Publication number: 20200325292
    Abstract: A resin composition comprising at least an organic resin, wherein physical property parameters specified by a storage modulus at a predetermined temperature and a glass transition temperature satisfy their respective predetermined ranges.
    Type: Application
    Filed: December 25, 2018
    Publication date: October 15, 2020
    Applicant: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tomoki HAMAJIMA, Meguru ITO, Takashi KUBO, Tomoe MORISHITA, Eisuke SHIGA
  • Patent number: 10791626
    Abstract: A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated or coated with the thermosetting resin composition (C); wherein the glass cloth (D) satisfies the following expressions (I) to (III), (x+y)?95??(I) 1.9<(X+Y)/(x+y)??(II) t<20??(III) wherein the glass cloth (D) is defined by X (threads/inch) representing number of warp yarn per inch; Y (threads/inch) representing number of weft yarn per inch; x (threads) representing number of filament per the warp yarn; y (threads) representing number of filament per the weft yarn; and t (?m) representing a thickness, and wherein the content of the inorganic filler (B) in the thermosetting resin composition (C) is from 110 to 700 parts by mass based on 100 parts by mass of the thermosetting resin (A).
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: September 29, 2020
    Assignee: MITSUBISHI GAS CHEMCIAL COMPANY, INC.
    Inventors: Tomoki Hamajima, Meguru Ito, Eisuke Shiga, Yoshihiro Kato
  • Patent number: 10550228
    Abstract: The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: February 4, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Naoki Kashima, Katsuya Tomizawa, Meguru Ito, Tomoki Hamajima, Eisuke Shiga, Kentaro Takano, Shota Koga
  • Publication number: 20190310538
    Abstract: A technology that allows a user to view image information more comfortably has been demanded. The present disclosure provides an information processing apparatus including a control unit that controls a person detection unit on the basis of an irradiation direction in which an irradiation unit capable of irradiating various image information irradiates the image information, the person detection unit forming a detection area in a direction opposite to the irradiation direction. According to the present disclosure, the person detection unit is controlled on the basis of the irradiation direction, whereby an operation unintended by a user is less likely to be performed. The user can thus view the image information more comfortably.
    Type: Application
    Filed: December 22, 2017
    Publication date: October 10, 2019
    Applicant: Sony Mobile Communications Inc.
    Inventors: Yuichiro SAITO, Shinji MATSUDA, Tomoki HAMAJIMA
  • Publication number: 20180186933
    Abstract: The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.
    Type: Application
    Filed: July 4, 2016
    Publication date: July 5, 2018
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Naoki KASHIMA, Katsuya TOMIZAWA, Meguru ITO, Tomoki HAMAJIMA, Eisuke SHIGA, Kentaro TAKANO, Shota KOGA
  • Publication number: 20180179355
    Abstract: It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.
    Type: Application
    Filed: July 4, 2016
    Publication date: June 28, 2018
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Katsuya TOMIZAWA, Tomoki HAMAJIMA, Shohei YAMAGUCHI, Eisuke SHIGA, Meguru ITO
  • Publication number: 20170244943
    Abstract: There is provided a control device including: a projection control unit configured to control projection of an image on a projection plane by a projector; and a UI control unit configured to switch a mode of a user interface (UI) related to the projected image between two or more UI modes based on a positional relationship of the projector with respect to the projection plane.
    Type: Application
    Filed: January 30, 2017
    Publication date: August 24, 2017
    Applicant: SONY MOBILE COMMUNICATIONS INC.
    Inventors: Yuichiro SAITO, Tomoki Hamajima, Hirotsugu Kitamori, Shinji Matsuda, Hiroya Kudo
  • Patent number: 9512329
    Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: December 6, 2016
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takeshi Nobukuni, Yoshihiro Kato, Meguru Ito, Tomoki Hamajima
  • Publication number: 20160219700
    Abstract: A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated or coated with the thermosetting resin composition (C); wherein the glass cloth (D) satisfies the following expressions (I) to (III), (x+y)?95??(I) 1.9<(X+Y)/(x+y)??(II) t<20??(III) wherein the glass cloth (D) is defined by X (threads/inch) representing number of warp yarn per inch; Y (threads/inch) representing number of weft yarn per inch; x (threads) representing number of filament per the warp yarn; y (threads) representing number of filament per the weft yarn; and t (?m) representing a thickness, and wherein the content of the inorganic filler (B) in the thermosetting resin composition (C) is from 110 to 700 parts by mass based on 100 parts by mass of the thermosetting resin (A).
    Type: Application
    Filed: August 6, 2014
    Publication date: July 28, 2016
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Tomoki HAMAJIMA, Meguru ITO, Eisuke SHIGA, Yoshihiro KATO
  • Publication number: 20140227924
    Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.
    Type: Application
    Filed: May 23, 2012
    Publication date: August 14, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takeshi Nobukuni, Yoshihiro Kato, Meguru Ito, Tomoki Hamajima