Abstract: A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4?-diphenylmethane diisocyanate, a modified product of 4,4?-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

Abstract: A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm3 to 1.26 g/cm3; and a metal layer on at least one surface of the dielectric resin film.

Abstract: A film capacitor that includes a wound body having a dielectric film and a metal layer, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the metal layer being disposed at least on a first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 µm by 140 µm of the first main surface of the dielectric film, the plurality of the protrusions have an average diameter of 0.58 µm to 5.98 µm and an average height of 0.11 µm to 2.54 µm, and a number of the plurality of the protrusions ranges from 50 to 450.

Abstract: A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 ?m by 140 ?m of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 ?m or more and less than 0.20 ?m is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 ?m or more and less than 2.50 ?m is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 ?m or more is 0.100% or less.

Abstract: A film capacitor that includes: a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 µm by 140 µm of the first main surface of the dielectric film, a skewness of the first main surface of the dielectric film is 0.782 to 14.3.

Abstract: A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.

Abstract: A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150° C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.

Abstract: A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4?-diphenylmethane diisocyanate, a modified product of 4,4?-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

Abstract: A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m3 or more, or the dielectric resin film has a storage elastic modulus at 125° C. of 1.1 GPa or more.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.

Abstract: A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm3 to 1.26 g/cm3; and a metal layer on at least one surface of the dielectric resin film.

Abstract: A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cm2 is 3 m or less, and an average depth of the linear recess is 0.01 ?m to 1.3 ?m.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface facing each other in a thickness direction of the dielectric resin film, wherein the first surface of the dielectric resin film includes 25 to 125 of first recesses each having a long diameter of 30 nm to 800 nm per an area of 5 ?m×5 ?m; and a metal layer on the first surface of the dielectric resin film.

Abstract: A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

Abstract: A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150° C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.

Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.

Abstract: A film capacitor that includes a resin layer having a linear protrusion on a first surface thereof and a linear recess on a second surface thereof opposite the first surface, and a metal layer on the first surface of the resin layer. A total length of the linear recess per 1 cm2 is 3 m or less, and an average depth of the linear recess is 0.01 ?m to 1.3 ?m.

Abstract: A film capacitor that includes a dielectric resin film and a metal layer on one surface of the dielectric resin film. The dielectric resin film has a crosslink density at 225° C. of 2700 mol/m3 or more, or the dielectric resin film has a storage elastic modulus at 125° C. of 1.1 GPa or more.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface opposite to the first surface, the second surface having a silicone resin-containing layer; a first metal layer opposite to the first surface of the dielectric resin film; and a second metal layer opposed to the second surface of the dielectric resin film.