Abstract: A capacitor that includes: a capacitor element; an external electrode on an end face of the capacitor element; and a lead terminal bonded to the external electrode, wherein the external electrode has a porosity of 8% to 20%. The external electrode may be a metallikon electrode. The external electrode may also contain an alloy of zinc and aluminum.

Abstract: A film capacitor that includes: a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 ?m by 140 ?m of the first main surface of the dielectric film, a skewness of the first main surface of the dielectric film is 0.782 to 14.3.

Abstract: A film capacitor that includes a capacitor element having a laminate where a first metal layer is connected to a first external electrode, a second metal layer is connected to a second external electrode, a first dielectric film protrudes toward the first external electrode with respect to a second dielectric film, and a second dielectric film protrudes toward the second external electrode with respect to the first dielectric film. At an outer peripheral portion of the laminate in a thickness direction, a first protruding width of the first dielectric film increases toward an outermost periphery of the laminate in the thickness direction, and a second protruding width of the second dielectric film increases toward the outermost periphery of the laminate in the thickness direction.

Abstract: A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 ?m by 140 ?m of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 ?m or more and less than 0.20 ?m is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 ?m or more and less than 2.50 ?m is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 ?m or more is 0.100% or less.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface facing each other in a thickness direction of the dielectric resin film, wherein the first surface of the dielectric resin film includes 25 to 125 of first recesses each having a long diameter of 30 nm to 800 nm per an area of 5 ?m×5 ?m; and a metal layer on the first surface of the dielectric resin film.

Abstract: A film capacitor that includes: a capacitor element including an element body having a laminate including a metallized film having a metal layer on at least one main surface of a dielectric film, and an external electrode on the end surface of the element body and connected to the metal layer; and a lead-out terminal welded and electrically connected to the external electrode, in which the external electrode has a surface roughness Ra of 20 ?m to 45 ?m, and a bite depth of the lead-out terminal from a surface of the external electrode is 0.5 mm or more.

Abstract: A capacitor that includes: a capacitor element including an element body and an external electrode on an end surface of the element body; a lead-out terminal electrically connected to the external electrode; an outer case housing the capacitor element inside so that the lead-out terminal projects outward, the outer case having: a bottomed tubular shape, a guide groove constructed to regulate a position of the lead-out terminal on an inner surface of the outer case, the guide groove protruding from a side wall and extending between an opening part and a bottom wall, wherein a height of the guide groove proximal to the opening part is lower than a height of the side wall proximal to the opening part or a corner of an edge of the guide groove proximal to the opening part is chamfered.

Abstract: A metallized film manufacturing device that includes: a feeding unit that feeds a dielectric film in a longitudinal direction; a printing roll that has a rotation axis along a width direction of the dielectric film, and prints an insulation pattern on a surface of the dielectric film, the printing roll has a protrusion extending on an outer circumferential surface of the printing roll in an axial direction of the printing roll and that corresponds to the insulation pattern, and a reinforcing portion is at a first end of the protrusion, the first end being an end in the axial direction of the printing roll; and a vapor deposition unit that forms a metal vapor deposition electrode in a place on a surface of the dielectric film where the insulation pattern is not printed.

Abstract: A film capacitor including: a wound body comprising a pair of dielectric films each having a vapor-deposited metal on surface thereof, the pair of dielectric films being overlapped in a thickness direction of the wound body such that there is a gap between the pair of dielectric films, and the wound body having a pair of opposed ends; and a pair of end face electrodes at the opposed ends of the wound body, respectively, wherein the wound body has a shape in which a first dimension in a first direction is shorter than a second dimension in a second direction orthogonal to the first direction in a cross section in a third direction along an extending surface of each of the end face electrodes, and a ratio of a thickness of the gap to a thickness of the pair of dielectric films in the first direction is 0.003 to 0.029.

Abstract: A film capacitor that includes a wound body having a dielectric film and a metal layer, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the metal layer being disposed at least on a first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 ?m by 140 ?m of the first main surface of the dielectric film, the plurality of the protrusions have an average diameter of 0.58 ?m to 5.98 ?m and an average height of 0.11 ?m to 2.54 ?m, and a number of the plurality of the protrusions ranges from 50 to 450.

Abstract: A capacitor that includes: a capacitor element; an external electrode on an end face of the capacitor element; and a lead terminal bonded to the external electrode, wherein the external electrode has a porosity of 8% to 20%. The external electrode may be a metallikon electrode. The external electrode may also contain an alloy of zinc and aluminum.

Abstract: A film capacitor that includes a capacitor element having a laminate where a first metal layer is connected to a first external electrode, a second metal layer is connected to a second external electrode, a first dielectric film protrudes toward the first external electrode with respect to a second dielectric film, and a second dielectric film protrudes toward the second external electrode with respect to the first dielectric film. At an outer peripheral portion of the laminate in a thickness direction, a first protruding width of the first dielectric film increases toward an outermost periphery of the laminate in the thickness direction, and a second protruding width of the second dielectric film increases toward the outermost periphery of the laminate in the thickness direction.

Abstract: A film capacitor that includes a dielectric resin film containing a cured product of a first organic material and a second organic material; and a metal layer on at least one surface of the dielectric resin film. The first organic material contains an organic polymer having a hydroxy group and a benzene ring in a repeating unit; the second organic material contains 4,4?-diphenylmethane diisocyanate, a modified product of 4,4?-diphenylmethane diisocyanate, or a mixture thereof; and 400 ppm to 700 ppm of chlorine ions and 300 ppm to 500 ppm of phosphorus ions are present inside the dielectric resin film.

Abstract: A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm3 to 1.26 g/cm3; and a metal layer on at least one surface of the dielectric resin film.

Abstract: A film capacitor that includes a wound body having a dielectric film and a metal layer, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the metal layer being disposed at least on a first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 µm by 140 µm of the first main surface of the dielectric film, the plurality of the protrusions have an average diameter of 0.58 µm to 5.98 µm and an average height of 0.11 µm to 2.54 µm, and a number of the plurality of the protrusions ranges from 50 to 450.

Abstract: A film capacitor that includes a wound body having a dielectric film and a metal layer. When a film face positioned at an average height in the thickness direction is defined in an area range of 100 ?m by 140 ?m of the first main surface of the dielectric film, an area ratio of a region having a height higher than the film face by 0.05 ?m or more and less than 0.20 ?m is 6.04% or less, an area ratio of a region having a height higher than the film face by 0.20 ?m or more and less than 2.50 ?m is 0.0998% to 1.13%, and an area ratio of a region having a height higher than the film face by 2.50 ?m or more is 0.100% or less.

Abstract: A film capacitor that includes: a wound body in which a dielectric film and a metal layer are wound, the dielectric film including a cured product of a first organic material having a hydroxy group and a second organic material that is an aromatic compound having an isocyanate group, the dielectric film including a first main surface and a second main surface opposed to each other in a thickness direction, the metal layer being disposed at least on the first main surface of the dielectric film. The first main surface of the dielectric film includes a plurality of protrusions having the second organic material. In an area range of 100 µm by 140 µm of the first main surface of the dielectric film, a skewness of the first main surface of the dielectric film is 0.782 to 14.3.

Abstract: A film capacitor that includes a resin layer which has a first surface and a second surface and in which there are particles on at least one of the first surface and the second surface; and a metal layer on the first surface of the resin layer, wherein there are more particles in number on the at least one of the first surface and the second surface of the resin layer than inside the resin layer.

Abstract: A film capacitor that includes a metallized film having a metal layer on one surface of a dielectric resin film, in which, when a thermal expansion coefficient of the metallized film is ?P and a thermal expansion coefficient of the metal layer is ?M, a value of ?P/?M is 5.1 or less.

Abstract: A film capacitor that includes a laminate having a first resin film including a first metal layer on a surface thereof alternately laminated with a second resin film including a second metal layer on a surface thereof, the laminate having opposed first and second ends, a first external electrode on the first end of the laminate, and a second external electrode on the second end of the laminate, wherein the first resin film protrudes more than the second resin film by a first protruding length of 0.5 mm to 3 mm on the first end of the laminate, and the first resin film has a Young's modulus at 150° C. of 0.6 GPa or more in a direction perpendicular to a lamination direction of the laminate and parallel to a direction from the first end to the second end of the laminate.