Patents by Inventor Tomoki Inudo

Tomoki Inudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire to conductive metal plate laser welding structure
    Patent number: 8759679
    Abstract: A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: June 24, 2014
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takushi Yoshida, Tomoki Inudo, Hiroshi Akimoto
  • WIRE TO CONDUCTIVE METAL PLATE LASER WELDING STRUCTURE
    Publication number: 20120237787
    Abstract: A laser welding structure that is formed by joining a stranded wire (wire) of a signal line and a welding portion (conductive metal plate) by locally applying a laser beam and thereby melting and solidifying the stranded wire of the signal line and the welding portion has the following features. That is, the melting point of the stranded wire of the signal line and the melting point of the welding portion are different. The laser welding structure is obtained by applying a laser beam to one of the stranded wire of the signal line and the welding portion that has a higher melting point, i.e., to the welding portion having a higher melting point.
    Type: Application
    Filed: September 21, 2011
    Publication date: September 20, 2012
    Applicant: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takushi YOSHIDA, Tomoki Inudo, Hiroshi Akimoto