Patents by Inventor Tomoki Kawasaki

Tomoki Kawasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads
    Patent number: 7952177
    Abstract: A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: May 31, 2011
    Assignee: Panasonic Corporation
    Inventors: Tomoki Kawasaki, Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata
  • RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MANUFACTURING METHOD FOR LEADFRAME WITH DIE PADS
    Publication number: 20090008754
    Abstract: A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
    Type: Application
    Filed: September 11, 2008
    Publication date: January 8, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Tomoki KAWASAKI, Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata
  • Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads
    Publication number: 20060097371
    Abstract: A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
    Type: Application
    Filed: August 2, 2005
    Publication date: May 11, 2006
    Inventors: Tomoki Kawasaki, Yuichiro Yamada, Toshiyuki Fukuda, Shuichi Ogata