Abstract: A fine silver particle-containing composition includes a large number of fine silver particles 2 and a coating layer 4 that covers a surface of each silver particle 2. The silver particle 2 is a so-called nano particle. The silver particle 2 has a scale-like shape. The coating layer 4 consists of an organic compound. The organic compound binds to the silver particle 2. The organic compound suppresses aggregation of the silver particle 2. The composition is in a cake form. A weight ratio of the organic compound with regard to the total amount of the composition is not lower than 2% but not higher than 15%.

Abstract: A fine silver particle-containing composition includes a large number of fine silver particles 2 and a coating layer 4 that covers a surface of each silver particle 2. The silver particle 2 is a so-called nano particle. The silver particle 2 has a scale-like shape. The coating layer 4 consists of an organic compound. The organic compound binds to the silver particle 2. The organic compound suppresses aggregation of the silver particle 2. The composition is in a cake form. A weight ratio of the organic compound with regard to the total amount of the composition is not lower than 2% but not higher than 15%.

Abstract: A probe needle for a probe card which is characterized by applying a Ni plating containing PTFE to at least an end face of a tip portion thereof is disclosed. A Ni plating containing PTFE layer may preferably be formed on the tip portion of the probe needle by using a Ni plating layer as a substrate. The Ni plating may preferably have a thickness of 0.5-2 &mgr;m to ensure the adhesion of the Ni plating containing PTFE, while the Ni plating containing PTFE may preferably have a thickness of 0.5-2 &mgr;m to ensure the sliding property of the PTFE. In this probe needle, since the tip portion thereof is covered with the Ni plating containing PTFE layer, the wear resistance is not deteriorated, the favorable conductivity is obtained, and the oxidization of the end face which is brought into contact with an integrated circuit is prevented.