Abstract: A power module has a semiconductor module and a cooling device. The cooling device has a cooling unit provided in the semiconductor module so as to be capable of conducting heat, a supply pipe configured to supply refrigerant to an interior of the cooling unit, and a discharge pipe configured to discharge the refrigerant that is flowed inside the cooling unit. The semiconductor module and the cooling unit are arranged in a z-direction. The supply pipe and the discharge pipe are spaced apart in a x-direction. Each of the supply pipe and the discharge pipe faces the semiconductor module in a y-direction.