Patents by Inventor Tomoki Kunikawa

Tomoki Kunikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9382445
    Abstract: Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)?SP(B)) is not smaller than 0.5 but not larger than 3.5.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: July 5, 2016
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tatsushi Hayashi, Tomoki Kunikawa, Reona Yokota, Daisuke Tottori, Kazutaka Shirahase
  • Patent number: 9120293
    Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: September 1, 2015
    Assignee: SEIKU CHEMICAL CO., LTD.
    Inventors: Reona Yokota, Koichi Shibayama, Akihiro Uenishi, Hidenobu Deguchi, Tomoki Kunikawa, Tatsushi Hayashi
  • Publication number: 20150210884
    Abstract: Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)?SP(B)) is not smaller than 0.5 but not larger than 3.5.
    Type: Application
    Filed: September 3, 2013
    Publication date: July 30, 2015
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tatsushi Hayashi, Tomoki Kunikawa, Reona Yokota, Daisuke Tottori, Kazutaka Shirahase
  • Publication number: 20130108861
    Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 ?m but smaller than 0.5 ?m, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 ?m but not larger than 20 ?m. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.
    Type: Application
    Filed: March 31, 2011
    Publication date: May 2, 2013
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Reona Yokota, Koichi Shibayama, Akihiro Uenishi, Hidenobu Deguchi, Tomoki Kunikawa, Tatsushi Hayashi