Abstract: A robot system including a robot arm with a movable portion includes a first imaging device and a second imaging device attached to the robot arm, a control unit that controls the robot system, a distance information acquisition unit that acquires information on a distance to a target object, the control unit is capable of changing a baseline length that is a distance between the first imaging device and the second imaging device, and the distance information acquisition unit acquires the information on the distance to the target object on the basis of the baseline length.

Abstract: A soldering apparatus that applies a processing light for melting a solder disposed on a circuit board, includes: a light irradiation apparatus that includes a Galvano mirror and that applies the processing light through the Galvano mirror; a detection apparatus that detects a light from the circuit board and that generates at least one of image data and shape data; a robot arm that is provided with the light irradiation apparatus and the detection apparatus and that includes a driver that moves the light irradiation apparatus and the detection apparatus; and a control apparatus that controls a direction of the Galvano mirror such that the processing light from the light irradiation apparatus that is displaced with the detection apparatus is applied to a same position, on the basis of at least one of the data that are changed in accordance with a displacement of the detection apparatus.

Abstract: A beam processing apparatus is a beam processing apparatus that irradiates a workpiece with a processing beam, and performs a removal processing of a first part of the workpiece by irradiating a first surface of the workpiece with the processing beam while moving an irradiation position of the processing beam along a first direction, and performs a removal processing of a second part of the workpiece by irradiating a second surface, which is formed at the workpiece by the removal processing of the first part, with the processing beam while moving the irradiation position of the processing beam along the first direction. A moving range of the processing beam for the removal processing of the second part is smaller than a moving range of the processing beam for the removal processing of the first part.

Abstract: A holding apparatus includes a holding portion that includes a first member which contacts a portion of an object, a second member which at least a portion thereof is fixed to a base, and a connection member which is configured to connect the first and second members, and a driving unit which drives the holding portion to change at least a posture of the first member, wherein a relative positional relationship between the first member and the second member is changed via the connection member.

Abstract: A movable body apparatus includes a base member, a movable body that is movable at least two-dimensionally, parallel to a predetermined plane, on the base member, a planar motor using magnetic levitation and having a stator provided at the base member and a mover provided at the movable body, and a controller configured to control the planar motor so that when the movable body is accelerated or decelerated, the controller controls the planar motor to generate a driving force in a direction crossing the predetermined plane.

Abstract: A movable body apparatus includes a base member, a movable body that is movable at least two-dimensionally, parallel to a predetermined plane, on the base member, a planar motor of a magnetic levitation method having a stator provided at the base member and a mover provided at the movable body, a measurement system that measures a position of the movable body in a direction parallel to the predetermined plane, and a controller. The controller limits movement of the movable body in the direction parallel to the predetermined plane by applying, to the movable body, a driving force generated by the planar motor, directed from the movable body to the base member in a direction intersecting the predetermined plane.

Abstract: A movable body apparatus includes a base member, a movable body that is movable at least two-dimensionally, parallel to a predetermined plane, on the base member, a planar motor of a magnetic levitation method having a stator provided at the base member and a mover provided at the movable body, a measurement system that measures a position of the movable body in a direction parallel to the predetermined plane, and a controller. The controller limits movement of the movable body in the direction parallel to the predetermined plane by applying, to the movable body, a driving force generated by the planar motor, directed from the movable body to the base member in a direction intersecting the predetermined plane.

Abstract: A holding apparatus includes a holding portion that includes a first member which contacts a portion of an object, a second member which at least a portion thereof is fixed to a base, and a connection member which is configured to connect the first and second members, and a driving unit which drives the holding portion to change at least a posture of the first member, wherein a relative positional relationship between the first member and the second member is changed via the connection member.

Abstract: According to measurement results of an encoder system, a stage driving system that is a magnetic levitation type planar motor is controlled to drive and control a wafer stage, and in the case where an abnormality of the driving and control of the wafer stage has been detected, the stage driving system is controlled to apply a thrust in a vertical direction to the wafer stage. With this operation, the pitching of the wafer stage can be avoided, which makes it possible to prevent damage of the wafer stage and structures placed immediately above the stage upper surface.

Abstract: A holding apparatus includes a holding portion that includes a first member which contacts a portion of an object, a second member which at least a portion thereof is fixed to a base, and a connection member which is configured to connect the first and second members, and a driving unit which drives the holding portion to change at least a posture of the first member, wherein a relative positional relationship between the first member and the second member is changed via the connection member.

Abstract: According to measurement results of an encoder system, a stage driving system that is a magnetic levitation type planar motor is controlled to drive and control a wafer stage, and in the case where an abnormality of the driving and control of the wafer stage has been detected, the stage driving system is controlled to apply a thrust in a vertical direction to the wafer stage. With this operation, the pitching of the wafer stage can be avoided, which makes it possible to prevent damage of the wafer stage and structures placed immediately above the stage upper surface.

Abstract: A holding apparatus includes a holding portion that includes a first member which contacts a portion of an object, a second member which at least a portion thereof is fixed to a base, and a connection member which is configured to connect the first and second members, and a driving unit which drives the holding portion to change at least a posture of the first member, wherein a relative positional relationship between the first member and the second member is changed via the connection member.

Abstract: A pellicle is provided to one end surface of end surfaces of a frame. Another end surface of the end surfaces of the frame has an area that opposes a substrate. A configuration is adopted that prevents the deformation of the one end surface of the frame and the shape of the opposing area on the other end surface from affecting one another.

Abstract: A pellicle is provided to one end surface of end surfaces of a frame. Another end surface of the end surfaces of the frame has an area that opposes a substrate. A configuration is adopted that prevents the deformation of the one end surface of the frame and the shape of the opposing area on the other end surface from affecting one another.