Abstract: A method for manufacturing a circuit connection structure includes: disposing a circuit connection material including a solder connection material and an adhesive on a surface of a first circuit member having the first electrode; disposing a second circuit member having a second electrode on the first circuit member thermally compressing the first and the second circuit member at a temperature equal to or higher than a melting point of the solder connection material in a state in which the solder connection material is interposed between the first and the second electrode; and cooling while applying a pressure between the first and the second electrode until a temperature between the first and the second electrode becomes a temperature equal to or lower than the above melting point from a temperature equal to or higher than the above melting point.

Abstract: A film manufacturing method includes a removing step of removing at least one removal target adhesive film piece from an original film having a plurality of adhesive film pieces provided on a long release film. A film includes a long release film, a plurality of adhesive film pieces, and a non-adhesive region, the plurality of adhesive film pieces include a first adhesive film piece and a second adhesive film piece which are adjacent to each other through the non-adhesive region and a adhesive film piece and a fourth adhesive film piece which are adjacent to each other through a non-adhesive region, and a separation distance between the first adhesive film piece and the second adhesive film piece is different from a separation distance between the third adhesive film piece and the fourth adhesive film piece.

Abstract: A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.

Abstract: A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.