Patents by Inventor Tomoki Nakano

Tomoki Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140023566
    Abstract: The present invention relates to a microchannel chip capable of preventing fluid leakage caused by a lamination defect. Bottomed first regions, second regions, and third regions are formed by joining a film to a lower surface of the chip main body of a microchannel chip. The third regions are in communication with the second regions and are formed on carbon inks. The third regions are formed wider than the carbon inks are. The third regions are filled with an electroconductive adhesive.
    Type: Application
    Filed: March 12, 2012
    Publication date: January 23, 2014
    Applicant: ENPLAS CORPORATION
    Inventors: Tomoki Nakano, Koichi Ono