Abstract: Provided are a solder alloy, a solder powder, a solder paste, and a solder joint having a low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217° C.

Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

Abstract: A solder paste is adopted, the solder paste containing: a solder alloy powder in which a content of solder alloy particles having a particle size of 8 ?m or less is 99% by mass or more with respect to a total mass of the solder alloy powder; and a flux. This flux contains an acid-modified rosin, a solvent, an activator, and a thixotropic agent, in which the activator contains a halogenated aliphatic compound, and a dicarboxylic acid represented by General Formula (2).

Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

Abstract: Provided are a solder alloy, a solder powder, a solder paste, and a solder joint having a low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217° C.

Abstract: To provide a method of reducing power consumption of an electronic apparatus including a display unit, and an electronic apparatus with a display control function that set a predetermined time, execute a power-saving mode when the predetermined time has elapsed, and return to an original state automatically when the user simply performs a particular operation. An electronic apparatus with a display control function includes an operation instructing unit 4 that instructs an operation instructed by operating plural input keys 3 arranged on a remote control 2, an operation control unit 5 that controls an operation, a timer 6 that performs timer setting and measurement of time, a setting holding memory 7 that holds a setting for a power-saving mode, a screen display control unit 8 that controls the display screen 9, and the display screen 9 that performs blinking display.