Abstract: A determination apparatus includes circuitry to receive operation information corresponding to an action being performed by a machine to be diagnosed and a detection signal of a physical quantity that changes according to the action of the machine; take out, from the detection signal, an operation detection signal indicating that the machine is operating, based on the operation information; extract feature information of the operation detection signal; select, from the feature information, particular feature information to be compared with a plurality of reference feature information; and determine a machining section of the machine in the feature information, based on the plurality of reference feature information and the particular feature information.

Abstract: An information processing apparatus includes a detection result acquisition unit configured to acquire a detection result of a physical quantity that changes as a movable body moves while being in contact with a subject; an image data acquisition unit configured to acquire image data of the subject; and a display control unit configured to control a display to display likelihood information indicating a likelihood of abnormality of the subject and the image data in association with each other. The likelihood is determined based on the detection result.

Abstract: An information processing apparatus includes a detection result acquisition unit to acquire, for each of processes performed on a plurality of workpieces, a detection result of a physical quantity that changes according to processing applied to a workpiece; an identification information acquisition unit to acquire process identification information identifying one of the processes performed on the same workpiece and workpiece identification information identifying one of the workpieces subjected to the same process; and a display control unit to display, on a display, the process identification information and the workpiece identification information; and display, on the display, abnormality likelihood information indicating likelihood of abnormality, determined based on the detection result, of the particular process or the particular workpiece, in association with at least one of the process identification information and the workpiece identification information.

Abstract: A determination apparatus includes circuitry to receive operation information corresponding to an action being performed by a machine to be diagnosed and a detection signal of a physical quantity that changes according to the action of the machine; take out, from the detection signal, an operation detection signal indicating that the machine is operating, based on the operation information; extract feature information of the operation detection signal; select, from the feature information, particular feature information to be compared with a plurality of reference feature information; and determine a machining section of the machine in the feature information, based on the plurality of reference feature information and the particular feature information.

Abstract: A device includes: a first acquiring unit to acquire context information corresponding to running operation among pieces of context information; a second acquiring unit to acquire detection information output from a detecting unit detecting a physical quantity of a target device; an extracting unit to extract, from the detection information, feature information indicating a feature of the detection information in an interval including a specific operation interval of the target device; a selecting unit to select reference feature information used as reference based on the feature information, and sequentially select pieces of target feature information; a calculating unit to calculate a likelihood of a process interval based on a comparison between the reference feature information and each piece of target feature information; a determining unit to determine whether the target feature information corresponding to the likelihood is included in the process interval based on the likelihood; and an estimating uni

Abstract: A device includes: a first acquiring unit to acquire context information corresponding to running operation among pieces of context information; a second acquiring unit to acquire detection information output from a detecting unit detecting a physical quantity of a target device; an extracting unit to extract, from the detection information, feature information indicating a feature of the detection information in an interval including a specific operation interval of the target device; a selecting unit to select reference feature information used as reference based on the feature information, and sequentially select pieces of target feature information; a calculating unit to calculate a likelihood of a process interval based on a comparison between the reference feature information and each piece of target feature information; a determining unit to determine whether the target feature information corresponding to the likelihood is included in the process interval based on the likelihood; and an estimating uni

Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.

Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.

Abstract: An optical module comprises: an optical element array comprising plural optical elements that emits or receives light; and an optical waveguide comprising a clad and plural cores respectively with optical path changing portions, the cores being disposed in the clad with an interval. The optical path changing portions are optically connected to the optical elements. The optical path changing portions are arranged in a first direction having an angle with respect to a formation direction of the cores, the first direction being corresponding to an arrangement direction of said plurality of optical elements.

Abstract: An optical module comprises: an optical element array comprising plural optical elements that emits or receives light; and an optical waveguide comprising a clad and plural cores respectively with optical path changing portions, the cores being disposed in the clad with an interval. The optical path changing portions are optically connected to the optical elements. The optical path changing portions are arranged in a first direction having an angle with respect to a formation direction of the cores, the first direction being corresponding to an arrangement direction of said plurality of optical elements.

Abstract: An arrangement device including: a photography section, which photographs a first mark and a second mark in a state in which a semiconductor integrated circuit to which the first mark is applied and a member to which the second mark is applied, which member is to be used in combination with the semiconductor integrated circuit, overlap; and a movement section, which relatively moves at least one of the semiconductor integrated circuit and the member with respect to the other thereof on the basis of positions of the first mark and the second mark which have been photographed by the photography section.

Abstract: A multichannel optical communication module includes: a board, and a signal-converting element having optical-action points aligned with a first pitch to emit and receive signal light. The element performs conversion between an optical signal and an electric signal at each of the optical-action points. The module further includes an optical waveguide that includes optical waveguide cores each having a first and a second optical-signal ends that are opposed to each other. The first optical-signal ends are aligned with the first pitch and optically connected to the respective optical-action points, while the second optical-signal ends are aligned with a second pitch longer than the first pitch. The module further includes a coupling component fixed on the board and coupling, to the module, an optical connector that holds ends of optical fibers aligned with a pitch equal to the second pitch, thereby optically connecting the second optical-signal ends to the optical fibers.

Abstract: A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plate-like member, forming a combined body, in which the inclined surfaces and the openings correspond to each other, by bonding the wafer and the plate-like member, and dividing the combined body into small pieces each of which includes the inclined surface and the opening.

Abstract: An optical connector includes: a board having a first signal-light propagation medium with a first optical signal end; and a chassis disposed on the board. The chassis includes: an insertion-and-removal section having an insertion-hole forming wall that defines an insertion hole, into which a second optical signal end of a second signal-light propagation medium is removably inserted. The wall has: a support surface. supporting a side face portion of the second signal end; and an abutting surface on which abuts a front-end portion of the second signal end. The chassis further includes an optical connection section provided with a through-hole forming wall defining a through hole optically connecting the first signal end with the inserted second signal. The optical connector further includes a biasing member that positions the second signal end inserted into the insertion-and-removal section by biasing the second signal end to both the abutting and support surfaces.

Abstract: An optical module mounting method for mounting an optical module including a plurality of light emitting points onto a substrate including an optical waveguide is provided. The method includes mounting the optical module on the substrate such that a surface of the optical module including the plurality of light emitting points faces one end of the optical waveguide; measuring optical coupling efficiency between each of the light emitting points and the optical waveguide; and selecting a light emitting point to be used based on the optical coupling efficiency measurements.

Abstract: A multichannel optical communication module includes: a board, and a signal-converting element having optical-action points aligned with a first pitch to emit and receive signal light. The element performs conversion between an optical signal and an electric signal at each of the optical-action points. The module further includes an optical waveguide that includes optical waveguide cores each having a first and a second optical-signal ends that are opposed to each other. The first optical-signal ends are aligned with the first pitch and optically connected to the respective optical-action points, while the second optical-signal ends are aligned with a second pitch longer than the first pitch. The module further includes a coupling component fixed on the board and coupling, to the module, an optical connector that holds ends of optical fibers aligned with a pitch equal to the second pitch, thereby optically connecting the second optical-signal ends to the optical fibers.

Abstract: An optical connector includes: a board having a first signal-light propagation medium with a first optical signal end; and a chassis disposed on the board. The chassis includes: an insertion-and-removal section having an insertion-hole forming wall that defines an insertion hole, into which a second optical signal end of a second signal-light propagation medium is removably inserted. The wall has: a support surface. supporting a side face portion of the second signal end; and an abutting surface on which abuts a front-end portion of the second signal end. The chassis further includes an optical connection section provided with a through-hole forming wall defining a through hole optically connecting the first signal end with the inserted second signal. The optical connector further includes a biasing member that positions the second signal end inserted into the insertion-and-removal section by biasing the second signal end to both the abutting and support surfaces.

Abstract: A light transmitting/receiving element includes a first base member, a second base member, an exiting window, and a transmitting portion. A surface light-emitting element is formed on a top surface of the first base member. The second base member is provided on the first base member, and a light-receiving element is formed on a top surface of the second base member. The exiting window is provided at the light-receiving element. Light, which the surface light-emitting element emits, exits from the exiting window. The transmitting portion is provided between the exiting window and the surface light-emitting element, and the light passes through the transmitting portion.

Abstract: A manufacturing method of an optical member for optical path conversion to be connected to an optical waveguide provided in a substrate includes forming plural inclined surfaces on a wafer by etching, forming openings corresponding to the inclined surfaces in a plate-like member, forming a combined body, in which the inclined surfaces and the openings correspond to each other, by bonding the wafer and the plate-like member, and dividing the combined body into small pieces each of which includes the inclined surface and the opening.

Abstract: An optical module mounting method for mounting an optical module including a plurality of light emitting points onto a substrate including an optical waveguide is provided. The method includes mounting the optical module on the substrate such that a surface of the optical module including the plurality of light emitting points faces one end of the optical waveguide; measuring optical coupling efficiency between each of the light emitting points and the optical waveguide; and selecting a light emitting point to be used based on the optical coupling efficiency measurements.