Patents by Inventor Tomoko Akashi

Tomoko Akashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6933613
    Abstract: A semiconductor device is disclosed, which comprises a package board in which pads are formed on the upper side of a wiring board, a semiconductor chip in which first bumps are formed on the device-forming surface of the semiconductor chip, second bumps are formed on the back surface of the semiconductor chip, and the semiconductor chip is flipchip-connected to the package board, a capacitor-mounted board in which capacitors are mounted on the upper surface of the capacitor-mounted board, pads are formed on the back surface of the capacitor-mounted board, and the capacitor-mounted board is flipchip-connected to the semiconductor chip, an adhesive resin filled between the semiconductor chip and the package substrate and between the semiconductor chip and the capacitor-mounting board, resin package formed on the package substrate, and a ball grid array comprising a plurality of external terminal balls formed on the back surface of the package substrate.
    Type: Grant
    Filed: January 6, 2004
    Date of Patent: August 23, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tomoko Akashi
  • Publication number: 20040188827
    Abstract: A semiconductor device is disclosed, which comprises a package board in which pads are formed on the upper side of a wiring board, a semiconductor chip in which first bumps are formed on the device-forming surface of the semiconductor chip, second bumps are formed on the back surface of the semiconductor chip, and the semiconductor chip is flipchip-connected to the package board, a capacitor-mounted board in which capacitors are mounted on the upper surface of the capacitor-mounted board, pads are formed on the back surface of the capacitor-mounted board, and the capacitor-mounted board is flipchip-connected to the semiconductor chip, an adhesive resin filled between the semiconductor chip and the package substrate and between the semiconductor chip and the capacitor-mounting board, resin package formed on the package substrate, and a ball grid array comprising a plurality of external terminal balls formed on the back surface of the package substrate.
    Type: Application
    Filed: January 6, 2004
    Publication date: September 30, 2004
    Inventor: Tomoko Akashi
  • Patent number: 5488428
    Abstract: In apparatus for generating a video special effect of making an image to see as if it were illuminated with light and changing the qualitative appearance of the image, an input video signal is stored in a video memory and read out by a reading address generated by a reading address generator. A video signal differentiating circuit differentiates the video signal read out from the video memory to obtain a dislocation quantity. An address dislocating circuits dislocates the reading address by using the dislocation quantity to produce a dislocation address. A region extracting circuit generates a region signal showing a positional relation of a pixel specified by the dislocation address and a predetermined specific region on the basis of the dislocation address. A luminance calculating circuit calculates a luminance correction value on the basis of the region signal.
    Type: Grant
    Filed: October 6, 1994
    Date of Patent: January 30, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tomoko Akashi, Norio Suzuki