Abstract: Provided is an additive for an electroplating solution, including a reaction product of at least one kind of epoxy compound (a1) represented by the general formula (1) and at least one kind of tertiary amine compound (a2): where L1 and L2 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a group represented by any one of the general formulae (L-1) to (L-3), and n represents an integer of from 1 to 5: where m1 to m3 each independently represent an integer of from 1 to 5, and * represents a bonding site.

Abstract: The present invention provides a copper electroplating solution including: (A) a sulfate ion; (B) a compound represented by the following general formula (1); and (C) a copper ion, wherein the copper electroplating solution has a content of the component (B) of from 0.3 part by mass to 50 parts by mass and a content of the component (C) of from 5 parts by mass to 50 parts by mass with respect to 100 parts by mass of a content of the component (A): where R1 and R2 each independently represent a hydrogen atom, a sodium atom, a potassium atom, or an alkyl group having 1 to 5 carbon atoms, and “n” represents 1 or 2, a method of producing the copper electroplating solution, and a copper electroplating method including using the copper electroplating solution.

Abstract: Provided is an additive for an electroplating solution, including a compound represented by the following general formula (1): where R1 to R3 each independently represent a group represented by the following general formula (2), A1 represents an alkanediyl group having 2 to 4 carbon atoms, and “n” represents 0 or 1: where R4 and R5 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, A2 and A3 each independently represent an alkanediyl group having 2 to 4 carbon atoms, “m” represents an integer of from 1 to 4, and * represents a bonding site.

Abstract: When copper is filled in a fine groove or hole (hereinafter sometimes referred to as a “trench”) of a base to be plated, which has formed therein the trench, by copper electroplating, the occurrence of voids and the deposition of copper on a region other than the trench have heretofore been problems. To solve the problems, the present invention provides an additive for a copper electroplating bath, consisting of at least one polymer compound selected from polymer compounds each represented by the following general formula (1) or the following general formula (2), each of the polymer compounds having a weight-average molecular weight of from 20,000 to 10,000,000. (In the formulae, X represents at least one unit selected from units represented by specific structures, and a ratio of a to b, i.e. “a:b” falls within the range of from 10:90 to 99:1.

Abstract: The present invention relates to an additive for a copper electroplating bath, including at least one polymer compound selected from polymer compounds each represented by the following general formula (1) or the following general formula (2), each of the polymer compounds having a weight-average molecular weight of from 20,000 to 10,000,000; a copper electroplating bath including the additive; and a copper electroplating method using the copper electroplating bath. (In the formulae, X represents at least one unit selected from units represented by specific structures, and a ratio of a to b, i.e. “a:b” falls within the range of from 10:90 to 99:1.