Patents by Inventor Tomoko Honda
Tomoko Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11866550Abstract: Provided are a fluoropolyether compound having high heat resistance and capable of maintaining a surface protection layer even under high temperature, and a lubricant and a magnetic disk that contain the fluoropolyether compound. The fluoropolyether compound includes: three groups whose main chain contains a perfluoropolyether chain; and a trivalent linking group represented by Formula (1) below, the three groups being bound together via the trivalent linking group: where R1 is a saturated hydrocarbon group having 1 to 3 carbon atoms, a perfluoroalkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, a hydroxyl group, or an amino group, and A1, A2, and A3 are each independently an aromatic group.Type: GrantFiled: July 13, 2022Date of Patent: January 9, 2024Assignee: Moresco CorporationInventors: Tomoko Honda, Ryosuke Sagata
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Publication number: 20230038701Abstract: Provided are a fluoropolyether compound having high heat resistance and capable of maintaining a surface protection layer even under high temperature, and a lubricant and a magnetic disk that contain the fluoropolyether compound. The fluoropolyether compound includes: three groups whose main chain contains a perfluoropolyether chain; and a trivalent linking group represented by Formula (1) below, the three groups being bound together via the trivalent linking group: where R1 is a saturated hydrocarbon group having 1 to 3 carbon atoms, a perfluoroalkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, a hydroxyl group, or an amino group, and A1, A2, and A3 are each independently an aromatic group.Type: ApplicationFiled: July 13, 2022Publication date: February 9, 2023Inventors: Tomoko HONDA, Ryosuke SAGATA
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Patent number: 8986575Abstract: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of ?50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.Type: GrantFiled: October 22, 2009Date of Patent: March 24, 2015Assignees: Toyo Boseki Kabushiki Kaisha, Kabushiki Kaisha ToshibaInventors: Yuichiro Akiba, Tomoko Honda, Fujio Takahashi, Shinji Nakata
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Publication number: 20140306849Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.Type: ApplicationFiled: June 27, 2014Publication date: October 16, 2014Inventors: Yoshikazu Hata, Tomoko Honda, Satoru Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Patent number: 8812062Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.Type: GrantFiled: September 21, 2007Date of Patent: August 19, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Yoshikazu Hata, Tomoko Honda, Satoru Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Patent number: 8130170Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.Type: GrantFiled: September 21, 2007Date of Patent: March 6, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Masaomi Nakahata, Tomoko Honda, Yoshikazu Hata, Satoru Honda, Jun Morimoto, Nobuyoshi Kuroiwa, Akihiro Tsujimura, Koichi Sato, Minoru Sakurai, Makoto Tabata, Shoji Kato
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Patent number: 8054240Abstract: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part.Type: GrantFiled: September 21, 2007Date of Patent: November 8, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Tomoko Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Satoru Honda, Yoshikazu Hata, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Patent number: 7907093Abstract: An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.Type: GrantFiled: June 5, 2008Date of Patent: March 15, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Satoru Honda, Tomoko Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Yoshikazu Hata, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Publication number: 20100101842Abstract: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of ?50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.Type: ApplicationFiled: October 22, 2009Publication date: April 29, 2010Applicants: Toyo Boseki Kabushiki Kaisha, Kabushiki Kaisha ToshibaInventors: Yuichiro AKIBA, Tomoko HONDA, Fujio TAKAHASHI, Shinji NAKATA
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Publication number: 20090082075Abstract: A casing includes a molded body provided with a recess, a conductive layer provided in the recess, and a protection film provided to cover at least a non-recessed region in a surface of the molded body provided with the recess and a surface of the conductive layer. The protection film extends generally evenly over the non-recessed region and the surface of the conductive layer. A method manufacturing the same and an electronic device including the casing are provided.Type: ApplicationFiled: September 16, 2008Publication date: March 26, 2009Inventors: Tomoko Honda, Fujio Takahashi
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Publication number: 20090015490Abstract: An electronic device includes: a first molded body having a recessed cross section and made of resin; a second molded body having a recessed cross section and made of resin, the second molded body being fitted inside the first molded body; and an antenna pattern sandwiched between the first and second molded body. Among the surfaces of the first molded body, the surface on the side not adjacent to the antenna pattern constitutes an outer surface.Type: ApplicationFiled: July 11, 2008Publication date: January 15, 2009Inventors: Satoru HONDA, Tomoko Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Yoshikazu Hata, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Publication number: 20080303737Abstract: An electronic device includes a first molded body having a first frame, the first molded body being provided with a conductive pattern on its outer surface, a second molded body having a second frame, the second molded body being joined to the first molded body, a wiring sheet made of an insulative sheet provided with an interconnection pattern, a circuit board having a feed point, and a feed line having a first end extended to a mating surface of the first frame opposed to the second frame and a second end connected to the conductive pattern. The interconnection pattern has a first end connected to the one end of the feed line. The interconnection pattern has a second end connected to the feed point.Type: ApplicationFiled: June 5, 2008Publication date: December 11, 2008Inventors: Satoru HONDA, Tomoko Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Yoshikazu Hata, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Publication number: 20080182539Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes housing with the first molded body; a first conductive pattern provided in the housing; a second conductive pattern provided on an outer surface of the housing; and a first conductive member. The first conductive member passes through a gap of a mating face between the first molded body and the second molded body. The first conductive member connects the first conductive pattern and the second conductive pattern.Type: ApplicationFiled: September 21, 2007Publication date: July 31, 2008Inventors: Yoshikazu Hata, Tomoko Honda, Satoru Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Publication number: 20080150815Abstract: An electronic apparatus includes: a first molded body; a second molded body which composes a housing with the first molded body; a first conductive pattern provided on an outer surface of the first molded body; a second conductive pattern provided in the housing; and a first conductive pin. The first conductive pin passes through the first molded body and connects the first conductive pattern and the second conductive pattern.Type: ApplicationFiled: September 21, 2007Publication date: June 26, 2008Inventors: Masaomi Nakahata, Tomoko Honda, Yoshikazu Hata, Satoru Honda, Jun Morimoto, Nobuyoshi Kuroiwa, Akihiro Tsujimura, Koichi Sato, Minoru Sakurai, Makoto Tabata, Shoji Kato
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Publication number: 20080150811Abstract: An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part.Type: ApplicationFiled: September 21, 2007Publication date: June 26, 2008Inventors: Tomoko Honda, Nobuyoshi Kuroiwa, Masaomi Nakahata, Jun Morimoto, Satoru Honda, Yoshikazu Hata, Koichi Sato, Akihiro Tsujimura, Makoto Tabata, Minoru Sakurai, Shoji Kato
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Patent number: 6201309Abstract: A reusable packaging material for semiconductor devices. The semiconductor device package is formed from a thermoplastic resin. The resin has good fluidity and good adhesion. The new package is recyclable because the thermoplastic resin hardening process is reversible. The new package has sufficient mechanical strength and adhesion to seal a semiconductor device. A thermoplastic material for sealing a semiconductor element is characterized by 4.5×10−5[1/.degree.C.] or less linear thermal expansivity at about 150-200 .degree.C.Type: GrantFiled: June 8, 1998Date of Patent: March 13, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Tomoko Honda, Masaki Adachi