Patents by Inventor Tomoko Kishimoto

Tomoko Kishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190077123
    Abstract: A translucent material according to this invention includes a base made of a glass-based material, and an oxide layer layered in an upper direction (or on an upper surface) of the base. Examples of the base may include tempered glass using soda lime glass or aluminosilicate glass, heat-resistant glass mostly using borosilicate glass, and quartz glass. The oxide layer includes yttrium oxide (Y2O3) as a base material thereof and further includes nitrogen and a Group 4A element. The translucent material having such a composition is qualified to constitute a low-adhesion material and a molding member. When quartz glass is selected and used as the base material, an intermediate layer may be interposed between the base and the oxide layer.
    Type: Application
    Filed: March 13, 2017
    Publication date: March 14, 2019
    Inventors: Kunihiko FUJIWARA, Daisuke HIGASHI, Tomoko KISHIMOTO
  • Patent number: 9453255
    Abstract: A sample analysis chip of the present invention includes a base, a plurality of wells that are disposed on the base, a main channel, a first buffer portion that is in communication with a first end of the main channel and is capable of accommodating a portion of the solution, a second buffer portion that is in communication with a second end of the main channel and is capable of accommodating a portion of the solution, a solution supply channel a first end of which is in communication with the first buffer portion and a second end of which is opened to the atmosphere, an air vent channel a first end of which is in communication with the second buffer portion and a second end of which is opened to the atmosphere, and the channel that is disposed on the base and connected to the plurality of wells.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: September 27, 2016
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Tomoyuki Ozawa, Tomoko Kishimoto
  • Publication number: 20140255933
    Abstract: A sample analysis chip of the present invention includes a base, a plurality of wells that are disposed on the base, a main channel, a first buffer portion that is in communication with a first end of the main channel and is capable of accommodating a portion of the solution, a second buffer portion that is in communication with a second end of the main channel and is capable of accommodating a portion of the solution, a solution supply channel a first end of which is in communication with the first buffer portion and a second end of which is opened to the atmosphere, an air vent channel a first end of which is in communication with the second buffer portion and a second end of which is opened to the atmosphere, and the channel that is disposed on the base and connected to the plurality of wells.
    Type: Application
    Filed: May 21, 2014
    Publication date: September 11, 2014
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Tomoyuki OZAWA, Tomoko KISHIMOTO
  • Publication number: 20110200744
    Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 18, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Kazuyuki Kiuchi, Masaaki Sato, Yukio Arimitsu, Daisuke Shimokawa, Tomoko Kishimoto
  • Patent number: 7811647
    Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: October 12, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Yukio Arimitsu, Akihisa Murata, Tomoko Kishimoto
  • Publication number: 20100119816
    Abstract: Provided is a heat-peelable pressure-sensitive adhesive sheet which is resistant to deformation caused by pressurization, excels in cohesive strength, maintains an adequate adhesive strength until the temperature reaches a heating-peeling treatment temperature, and can be easily removed by heating. Also provided is a process for the production of electronic components using the above-mentioned sheet. The heat-peelable pressure-sensitive adhesive sheet includes a substrate and, arranged on or above at least one side thereof, a heat-peelable pressure-sensitive adhesive layer containing heat-expandable microspheres and a layered silicate. The silicate is preferably present in a content of 1 to 200 parts by weight per 100 parts by weight of a base polymer constituting the heat-peelable pressure-sensitive adhesive layer.
    Type: Application
    Filed: April 15, 2008
    Publication date: May 13, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Shimokawa, Hiroyuki Kondo, Yukio Arimitsu, Tomoko Kishimoto
  • Patent number: 7691225
    Abstract: Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20 mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23±2° C., and a relative humidity of 65±5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165° C. and a pressure of one atmosphere for one hour.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: April 6, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Tomoko Kishimoto, Yukio Arimitsu
  • Publication number: 20080169062
    Abstract: Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20 mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23±° C., and a relative humidity of 65±5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165° C. and a pressure of one atmosphere for one hour.
    Type: Application
    Filed: January 7, 2008
    Publication date: July 17, 2008
    Applicant: Nitto Denko Corporation
    Inventors: Tomoko Kishimoto, Yukio Arimitsu
  • Publication number: 20080038540
    Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
    Type: Application
    Filed: August 14, 2007
    Publication date: February 14, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Kazuyuki KIUCHI, Masaaki SATO, Yukio ARIMITSU, Daisuke SHIMOKAWA, Tomoko KISHIMOTO
  • Publication number: 20080019078
    Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.
    Type: Application
    Filed: February 18, 2005
    Publication date: January 24, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yukio Arimitsu, Akihisa Murata, Tomoko Kishimoto
  • Publication number: 20080008831
    Abstract: A heat-peelable pressure-sensitive adhesive sheet, which comprises a substrate, a heat-expandable adhesive layer formed on at least one surface thereof, and a surfactant, wherein the surfactant is contained in the heat-expandable adhesive layer as an adhesive surface.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 10, 2008
    Inventors: Tomoko Kishimoto, Masakazu Tanimoto, Yukio Arimitsu, Michirou Kawanishi
  • Publication number: 20050136251
    Abstract: A heat-peelable pressure-sensitive adhesive sheet, which comprises a substrate, a heat-expandable adhesive layer formed on at least one surface thereof, and a surfactant, wherein the surfactant is contained in the heat-expandable adhesive layer as an adhesive surface.
    Type: Application
    Filed: December 6, 2004
    Publication date: June 23, 2005
    Inventors: Tomoko Kishimoto, Masakazu Tanimoto, Yukio Arimitsu, Michirou Kawanishi