Abstract: Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

Abstract: Provided is a method that is for manufacturing a conductive pattern-provided structure, that involves simple manufacturing steps, and that enables formation of a conductive pattern-provided structure having excellent interlayer adhesion. One mode of the present invention provides a method for manufacturing a conductive pattern-provided structure, the method comprising: a coating film formation step for obtaining a coating film by printing, on a base material, a dispersion that contains copper oxide-containing particles; and a plating step for performing electroless plating on the coating film by using a plating solution. The plating solution contains EDTA (ethylenediaminetetraacetic acid).

Abstract: Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

Abstract: An electrorheological fluid which comprises a dispersion medium containing fluorine atoms in an amount larger than 0 wt % but not larger than 50.0 wt % and particles for electrorheological fluid use that are contained in the dispersion medium in an amount of 10-50 vol % of the total volume of the dispersion medium and the particles, the particles comprising a sulfonic-acid-group-containing polymer having a sulfonic acid group content of 30-70 wt %.

Abstract: An electrorheological fluid which comprises a dispersion medium containing fluorine atoms in an amount larger than 0 wt % but not larger than 50.0 wt % and particles for electrorheological fluid use that are contained in the dispersion medium in an amount of 10-50 vol % of the total volume of the dispersion medium and the particles, the particles comprising a sulfonic-acid-group-containing polymer having a sulfonic acid group content of 30-70 wt %.

Abstract: An electrorheological fluid which comprises a dispersion medium containing fluorine atoms in an amount larger than 0 wt % but not larger than 50.0 wt % and particles for electrorheological fluid use that are contained in the dispersion medium in an amount of 10-50 vol % of the total volume of the dispersion medium and the particles, the particles comprising a sulfonic-acid-group-containing polymer having a sulfonic acid group content of 30-70 wt %.