Abstract: According to one embodiment an electronic apparatus includes a housing, a heat generating element, a plurality of sensors, and an index calculator. The heat generating element is housed in the housing. The index calculator calculates an index corresponding to a physical quantity or an index indicating performance of the electronic apparatus, based on a correlation between detected values of the sensors and the index.

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: According to one embodiment, an electronic device includes a circuit board with an electronic component mounted thereon. The device, includes a measuring unit, a first database, a determination unit, and a presentation unit. The measuring unit measures an value of state of the electronic component. The first database stores data indicating correlation. The determination unit determines one of ways of applying a load to a junction, based on the value of state of the electronic component measured by the measuring unit, and referring to the first database. The presentation unit presents the determined way of applying the load to the junction.

Abstract: According to one embodiment an electronic apparatus includes a housing, a heat generating element, a plurality of sensors, and an index calculator. The heat generating element is housed in the housing. The index calculator calculates an index corresponding to a physical quantity or an index indicating performance of the electronic apparatus, based on a correlation between detected values of the sensors and the index.

Abstract: According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.

Abstract: A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.

Abstract: According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.

Abstract: A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss portion and the circuit board; a third conductive member that is disposed between the first boss portion and the first conductive member and between the first boss portion and the second conductive member to electrically connect the first conductive member to the second conductive member; and a measurement circuit that is electrically connected to a first wiring and a second wiring, which are respectively connected to the first conductive member and the second conductive member, and measures an electrical characteristic value of at least one of the first conductive member and the second conductive member.

Abstract: According to one embodiment, an electronic device includes a circuit board, an electronic component, a first pad formed on the circuit board, a second pad formed on the electronic component, a junction which connects the first pad and the second pad, and a detecting unit. The detecting unit detects an electric characteristic of a connection path that includes the junction and at least one of the first pad and the second pad. An insulator is formed in part of a contact area of at least one of the first pad and the second pad that is in contact with the junction.

Abstract: According to one embodiment, in an electronic apparatus, a first pair of electrodes has a first electrode and a second electrode. A second pair of electrodes is disposed in parallel with the first pair, and has a third electrode and a fourth electrode. A third pair of electrodes is disposed between the first pair and the second pair in parallel with the first pair and the second pair, and has a fifth electrode and a sixth electrode. A first wire electrically connects the first electrode and the second electrode. A second wire electrically connects the third electrode and the fourth electrode. A third wire electrically connects the fifth electrode and the sixth electrode. A gel covers the first wire, the second wire, and the third wire. A first detection unit detects a break status of the first wire or the second wire.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: According to an embodiment, an electronic apparatus includes a first member serving as a circuit board member; a second member serving as a circuit board member or a semiconductor device; a first electrode formed on the first member; a second electrode formed on a region, of the first member, around a region where the first electrode is formed; and a third electrode formed on the second member. The electronic apparatus also includes a electrical joint configured to bond the first electrode, the second electrode, and the third electrode; and a measuring module configured to measure an electrical characteristic value of a connection path including at least one of the first electrode and the second electrode.

Abstract: According to one embodiment, a semiconductor module comprises a substrate, a first wiring, an electrode pad, a junction, an oscillator, and a detector. The first wiring is disposed on the substrate, and has a characteristic impedance Z0. The electrode pad is connected to the first wiring. The junction is disposed on the electrode pad, and has an impedance Z1. The oscillator is disposed in contact with the first wiring, and oscillates a pulse wave of a voltage toward the junction via the first wiring. The detector is disposed in contact with the first wiring, and detects an output wave of the pulse wave from the junction. The characteristic impedance Z0 and the impedance Z1 satisfy a following relationship (1), ? Z ? ? 0 - Z ? ? 1 Z ? ? 0 ? ? 0.05 .

Abstract: According to one embodiment, an electronic device includes a circuit board with an electronic component mounted thereon. The device, includes a measuring unit, a first database, a determination unit, and a presentation unit. The measuring unit measures an value of state of the electronic component. The first database stores data indicating correlation. The determination unit determines one of ways of applying a load to a junction, based on the value of state of the electronic component measured by the measuring unit, and referring to the first database. The presentation unit presents the determined way of applying the load to the junction.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.