Patents by Inventor Tomoko Oyama
Tomoko Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10952320Abstract: A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.Type: GrantFiled: March 23, 2017Date of Patent: March 16, 2021Assignee: Kyocera CorporationInventors: Tadashi Watanabe, Masakazu Nakamura, Hiroshi Omodera, Tomoko Oyama
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Patent number: 10815263Abstract: To provide an easy and practical iron ion removal method, as a method for purifying P1,P4-di(uridine 5?-)tetraphosphate from a solution containing iron ions. Purification is performed by a purification method including a method for purifying P1,P4-di(uridine 5?-)tetraphosphate by removing iron ions from an aqueous solution or hydrophilic solvent solution containing P1,P4-di(uridine 5?-)tetraphosphate and iron ions, including (1) a step of purification using a chelating resin packed column, and (2) a step of adjusting the pH of the solution after said purification step using the chelating resin packed column to 5.5 or less, and then crystallizing P1,P4-di(uridine 5?-)tetraphosphate, or a step of treating the solution after said purification step using the chelating resin packed column with zinc chloride-activated activated carbon.Type: GrantFiled: October 24, 2017Date of Patent: October 27, 2020Assignee: YAMASA CORPORATIONInventors: Yusuke Ohba, Tomoko Oyama, Fumitaka Kano, Asuka Uchino
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Publication number: 20200231924Abstract: Provided are a substrate for test use that is preferable for use in a test such as a culture test, and a method for manufacturing the substrate for test use. The substrate for test use, in which a solution retaining part for retaining water or an aqueous solution, is formed at a surface of a substrate of polydimethylsiloxane (PDMS). The solution retaining part is a concave part having a hydrophilic surface layer. The surface layer has a maximum thickness of 1 ?m or larger.Type: ApplicationFiled: May 17, 2018Publication date: July 23, 2020Applicants: IWASAKI ELECTRIC CO., LTD., NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECHNOLOGYInventors: Shinobu KINOSHITA, Takashi IDE, Tomoko OYAMA, Mitsumasa TAGUCHI, Bin Jeremiah Duenas BARBA
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Publication number: 20190233462Abstract: To provide an easy and practical iron ion removal method, as a method for purifying P1,P4-di(uridine 5?-)tetraphosphate from a solution containing iron ions. Purification is performed by a purification method including a method for purifying P1,P4-di(uridine 5?-)tetraphosphate by removing iron ions from an aqueous solution or hydrophilic solvent solution containing P1,P4-di(uridine 5?-)tetraphosphate and iron ions, including (1) a step of purification using a chelating resin packed column, and (2) a step of adjusting the pH of the solution after said purification step using the chelating resin packed column to 5.5 or less, and then crystallizing P1,P4-di(uridine 5?-)tetraphosphate, or a step of treating the solution after said purification step using the chelating resin packed column with zinc chloride-activated activated carbon.Type: ApplicationFiled: October 24, 2017Publication date: August 1, 2019Applicant: YAMASA CORPORATIONInventors: Yusuke OHBA, Tomoko OYAMA, Fumitaka KANO, Asuka UCHINO
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Publication number: 20190098755Abstract: A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.Type: ApplicationFiled: March 23, 2017Publication date: March 28, 2019Applicant: KYOCERA CorporationInventors: Tadashi WATANABE, Masakazu NAKAMURA, Hiroshi OMODERA, Tomoko OYAMA
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Publication number: 20160193756Abstract: There are provided a microstructural material allowing a concavo-convex pattern of a mold to be imprinted thereon by hardening a pattern formative layer through an unprecedented method, and a fabrication method thereof. A PTFE dispersion liquid is used in a pattern formative layer 2a forming an imprint section 2, thereby allowing such pattern formative layer 2a formed on a concavo-convex pattern of a mold 5 to be hardened when irradiated with an ionizing radiation. Accordingly, the fabrication method of a microstructural material 1 of the present invention employs an imprinting method allowing the pattern formative layer 2a to be hardened through an ionizing radiation R, which is completely different from a thermal imprinting and an optical imprinting. That is, the pattern formative layer 2a can be hardened, and the concavo-convex pattern of the mold 5 can thus be imprinted thereon, through an unprecedented method.Type: ApplicationFiled: March 17, 2016Publication date: July 7, 2016Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Akihiro OSHIMA, Seiichi TAGAWA, Masakazu WASHIO, Tomoko OYAMA, Tomohiro TAKAHASHI, Satoshi OKUBO, Akinobu KOBAYASHI, Naotsugu NAGASAWA, Mitsumasa TAGUCHI
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Publication number: 20120231220Abstract: There are provided a microstructural material allowing a concavo-convex pattern of a mold to be imprinted thereon by hardening a pattern formative layer through an unprecedented method, and a fabrication method thereof. A PTFE dispersion liquid is used in a pattern formative layer 2a forming an imprint section 2, thereby allowing such pattern formative layer 2a formed on a concavo-convex pattern of a mold 5 to be hardened when irradiated with an ionizing radiation. Accordingly, the fabrication method of a microstructural material 1 of the present invention employs an imprinting method allowing the pattern formative layer 2a to be hardened through an ionizing radiation R, which is completely different from a thermal imprinting and an optical imprinting. That is, the pattern formative layer 2a can be hardened, and the concavo-convex pattern of the mold 5 can thus be imprinted thereon, through an unprecedented method.Type: ApplicationFiled: December 29, 2011Publication date: September 13, 2012Applicant: JAPAN ATOMIC ENERGY AGENCYInventors: Akihiro Oshima, Seiichi Tagawa, Masakazu Washio, Tomoko Oyama, Tomohiro Takahashi, Satoshi Okubo, Akinobu Kobayashi, Naotsugu Nagasawa, Mitsumasa Taguchi
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Publication number: 20090246787Abstract: A method for determining chemosensitivity of a malignant tumor cell to anthracycline is described herein. According to this method, first tumor cell and second tumor sell are first prepared. The first tumor cell is not treated with anthracycline, and on the other the second tumor cell is treated with anthracycline. Secondly, first and second activity levels of CDK1 are measured. The first activity level is activity of CDK1 in the first tumor cell and the second activity level is that of CDK1 in the second tumor cell. Finally, chemosensitivity of the malignant tumor cell is determined. The determination is based on the first and second activity levels.Type: ApplicationFiled: March 19, 2009Publication date: October 1, 2009Applicant: SYSMEX CORPORATIONInventors: Tomoko Oyama, Tomokazu Yoshida, Satoshi Nakayama, Yumi Takinowaki
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Publication number: 20090098582Abstract: The invention provides a method for determining a risk of cancer relapse comprising a step of determining the risk of cancer relapse on the basis of a comprehensive activity value of a transmembrane tyrosine kinase of a tumor cell, as well as a computer program product for determining a risk of a cancer relapse.Type: ApplicationFiled: October 10, 2008Publication date: April 16, 2009Applicant: SYSMEX CORPORATIONInventors: Tomoko OYAMA, Michitaka Notoya, Tomokazu Yoshida, Hideki Ishihara