Patents by Inventor Tomoko Oyama

Tomoko Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10952320
    Abstract: A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 16, 2021
    Assignee: Kyocera Corporation
    Inventors: Tadashi Watanabe, Masakazu Nakamura, Hiroshi Omodera, Tomoko Oyama
  • Patent number: 10815263
    Abstract: To provide an easy and practical iron ion removal method, as a method for purifying P1,P4-di(uridine 5?-)tetraphosphate from a solution containing iron ions. Purification is performed by a purification method including a method for purifying P1,P4-di(uridine 5?-)tetraphosphate by removing iron ions from an aqueous solution or hydrophilic solvent solution containing P1,P4-di(uridine 5?-)tetraphosphate and iron ions, including (1) a step of purification using a chelating resin packed column, and (2) a step of adjusting the pH of the solution after said purification step using the chelating resin packed column to 5.5 or less, and then crystallizing P1,P4-di(uridine 5?-)tetraphosphate, or a step of treating the solution after said purification step using the chelating resin packed column with zinc chloride-activated activated carbon.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: October 27, 2020
    Assignee: YAMASA CORPORATION
    Inventors: Yusuke Ohba, Tomoko Oyama, Fumitaka Kano, Asuka Uchino
  • Publication number: 20200231924
    Abstract: Provided are a substrate for test use that is preferable for use in a test such as a culture test, and a method for manufacturing the substrate for test use. The substrate for test use, in which a solution retaining part for retaining water or an aqueous solution, is formed at a surface of a substrate of polydimethylsiloxane (PDMS). The solution retaining part is a concave part having a hydrophilic surface layer. The surface layer has a maximum thickness of 1 ?m or larger.
    Type: Application
    Filed: May 17, 2018
    Publication date: July 23, 2020
    Applicants: IWASAKI ELECTRIC CO., LTD., NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECHNOLOGY
    Inventors: Shinobu KINOSHITA, Takashi IDE, Tomoko OYAMA, Mitsumasa TAGUCHI, Bin Jeremiah Duenas BARBA
  • Publication number: 20190233462
    Abstract: To provide an easy and practical iron ion removal method, as a method for purifying P1,P4-di(uridine 5?-)tetraphosphate from a solution containing iron ions. Purification is performed by a purification method including a method for purifying P1,P4-di(uridine 5?-)tetraphosphate by removing iron ions from an aqueous solution or hydrophilic solvent solution containing P1,P4-di(uridine 5?-)tetraphosphate and iron ions, including (1) a step of purification using a chelating resin packed column, and (2) a step of adjusting the pH of the solution after said purification step using the chelating resin packed column to 5.5 or less, and then crystallizing P1,P4-di(uridine 5?-)tetraphosphate, or a step of treating the solution after said purification step using the chelating resin packed column with zinc chloride-activated activated carbon.
    Type: Application
    Filed: October 24, 2017
    Publication date: August 1, 2019
    Applicant: YAMASA CORPORATION
    Inventors: Yusuke OHBA, Tomoko OYAMA, Fumitaka KANO, Asuka UCHINO
  • Publication number: 20190098755
    Abstract: A printed wiring board in the present disclosure includes a core layer, a first buildup layer, a second buildup layer, and a through hole. The core layer has a conductor circuit located on a surface of an insulator. The first buildup layer containing a first resin is laminated on a surface of the core layer. The second buildup layer containing a second resin is laminated on a surface of the first buildup layer. The through hole extends through the core layer, the first buildup layer, and the second buildup layer. The first resin and the second resin are different from each other. The second buildup layer includes a plurality of filled vias filled with a conductor which are located around a circumference of an opening of the through hole.
    Type: Application
    Filed: March 23, 2017
    Publication date: March 28, 2019
    Applicant: KYOCERA Corporation
    Inventors: Tadashi WATANABE, Masakazu NAKAMURA, Hiroshi OMODERA, Tomoko OYAMA
  • Publication number: 20160193756
    Abstract: There are provided a microstructural material allowing a concavo-convex pattern of a mold to be imprinted thereon by hardening a pattern formative layer through an unprecedented method, and a fabrication method thereof. A PTFE dispersion liquid is used in a pattern formative layer 2a forming an imprint section 2, thereby allowing such pattern formative layer 2a formed on a concavo-convex pattern of a mold 5 to be hardened when irradiated with an ionizing radiation. Accordingly, the fabrication method of a microstructural material 1 of the present invention employs an imprinting method allowing the pattern formative layer 2a to be hardened through an ionizing radiation R, which is completely different from a thermal imprinting and an optical imprinting. That is, the pattern formative layer 2a can be hardened, and the concavo-convex pattern of the mold 5 can thus be imprinted thereon, through an unprecedented method.
    Type: Application
    Filed: March 17, 2016
    Publication date: July 7, 2016
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Akihiro OSHIMA, Seiichi TAGAWA, Masakazu WASHIO, Tomoko OYAMA, Tomohiro TAKAHASHI, Satoshi OKUBO, Akinobu KOBAYASHI, Naotsugu NAGASAWA, Mitsumasa TAGUCHI
  • Publication number: 20120231220
    Abstract: There are provided a microstructural material allowing a concavo-convex pattern of a mold to be imprinted thereon by hardening a pattern formative layer through an unprecedented method, and a fabrication method thereof. A PTFE dispersion liquid is used in a pattern formative layer 2a forming an imprint section 2, thereby allowing such pattern formative layer 2a formed on a concavo-convex pattern of a mold 5 to be hardened when irradiated with an ionizing radiation. Accordingly, the fabrication method of a microstructural material 1 of the present invention employs an imprinting method allowing the pattern formative layer 2a to be hardened through an ionizing radiation R, which is completely different from a thermal imprinting and an optical imprinting. That is, the pattern formative layer 2a can be hardened, and the concavo-convex pattern of the mold 5 can thus be imprinted thereon, through an unprecedented method.
    Type: Application
    Filed: December 29, 2011
    Publication date: September 13, 2012
    Applicant: JAPAN ATOMIC ENERGY AGENCY
    Inventors: Akihiro Oshima, Seiichi Tagawa, Masakazu Washio, Tomoko Oyama, Tomohiro Takahashi, Satoshi Okubo, Akinobu Kobayashi, Naotsugu Nagasawa, Mitsumasa Taguchi
  • Publication number: 20090246787
    Abstract: A method for determining chemosensitivity of a malignant tumor cell to anthracycline is described herein. According to this method, first tumor cell and second tumor sell are first prepared. The first tumor cell is not treated with anthracycline, and on the other the second tumor cell is treated with anthracycline. Secondly, first and second activity levels of CDK1 are measured. The first activity level is activity of CDK1 in the first tumor cell and the second activity level is that of CDK1 in the second tumor cell. Finally, chemosensitivity of the malignant tumor cell is determined. The determination is based on the first and second activity levels.
    Type: Application
    Filed: March 19, 2009
    Publication date: October 1, 2009
    Applicant: SYSMEX CORPORATION
    Inventors: Tomoko Oyama, Tomokazu Yoshida, Satoshi Nakayama, Yumi Takinowaki
  • Publication number: 20090098582
    Abstract: The invention provides a method for determining a risk of cancer relapse comprising a step of determining the risk of cancer relapse on the basis of a comprehensive activity value of a transmembrane tyrosine kinase of a tumor cell, as well as a computer program product for determining a risk of a cancer relapse.
    Type: Application
    Filed: October 10, 2008
    Publication date: April 16, 2009
    Applicant: SYSMEX CORPORATION
    Inventors: Tomoko OYAMA, Michitaka Notoya, Tomokazu Yoshida, Hideki Ishihara