Abstract: A method of manufacturing a semiconductor device having a silicon substrate containing an impurity diffusion layer is disclosed, that comprises the steps of doping impurities to the silicon substrate through a silicon oxide film with a thickness of 2.5 nm or less at an accelerating voltage of 3 keV or less, the silicon oxide film being formed on the silicon substrate and annealing the silicon substrate with the oxide film left.

Abstract: A fabrication method of a semiconductor device with an IGFET is provided, which makes it possible to decrease the current leakage due to electrical short-circuit between a gate electrode and source/drain regions of the IGFET through conductive grains deposited on its dielectric sidewalls. After the basic structure of the IGFET is formed, first and second single-crystal Si epitaxial layers are respectively formed on the first and second source/drain regions by a selective epitaxial growth process. Then, the surface areas of the first and second single-crystal Si epitaxial layers are oxidized, and the oxidized surface areas of the first and second single-crystal Si epitaxial layers are removed by etching.

Abstract: The present invention provides a method of forming gate side wall insulation films on side walls of a gate electrode on a gate insulation film over a silicon substrate surface. The method comprises The following steps. Gate side wall insulation films are selectively formed on side walls of a gate electrode. A silicon film is selectively grown on at least any one of a top of the gate electrode and on the silicon substrate surface. Surface regions of the gate side wall insulation films are etched.