Patents by Inventor Tomokuni MITSUI

Tomokuni MITSUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder
    Patent number: 11673214
    Abstract: A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: June 13, 2023
    Assignee: Uchihashi Estec Co., Ltd.
    Inventors: Yoshihiro Yoshioka, Kazuo Inada, Tomokuni Mitsui, Hitoshi Yamanaka
  • LEAD-FREE SOLDER
    Publication number: 20220379411
    Abstract: A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 1, 2022
    Applicant: Uchihashi Estec Co., Ltd.
    Inventors: Yoshihiro YOSHIOKA, Kazuo INADA, Tomokuni MITSUI, Hitoshi YAMANAKA