Patents by Inventor Tomomi Asakura
Tomomi Asakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7828190Abstract: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.Type: GrantFiled: April 6, 2009Date of Patent: November 9, 2010Assignee: TDK CorporationInventors: Yuji Saito, Tomomi Asakura, Mitsuyoshi Makida, Toru Mizuno, Toshinobu Miyagoshi
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Patent number: 7814645Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.Type: GrantFiled: July 18, 2008Date of Patent: October 19, 2010Assignee: TDK CorporationInventors: Toru Mizuno, Tomomi Asakura, Yuji Saito, Hiroyuki Takano, Toshinobu Miyagoshi
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Publication number: 20090255979Abstract: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.Type: ApplicationFiled: April 6, 2009Publication date: October 15, 2009Applicant: TDK CORPORATIONInventors: Yuji Saito, Tomomi Asakura, Mitsuyoshi Makida, Toru Mizuno, Toshinobu Miyagoshi
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Publication number: 20090031558Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.Type: ApplicationFiled: July 18, 2008Publication date: February 5, 2009Applicant: TDK CORPORATIONInventors: Toru MIZUNO, Tomomi ASAKURA, Yuji SAITO, Hiroyuki TAKANO, Toshinobu MIYAGOSHI
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Patent number: 7181833Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.Type: GrantFiled: November 2, 2004Date of Patent: February 27, 2007Assignee: TDK CorporationInventors: Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko, Toshinobu Miyagoshi
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Publication number: 20050272351Abstract: A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, and a grain size of a contact surface of the abrading unit ranges from P1000 to P5000, the contact surface of the abrading unit coming into contact with the suction surface of the mounting nozzle.Type: ApplicationFiled: May 27, 2005Publication date: December 8, 2005Applicant: TDK CorporationInventors: Toru Mizuno, Tomomi Asakura, Toshinobu Miyakoshi, Yuji Saito, Tsugihiro Hasebe
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Patent number: 6931717Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.Type: GrantFiled: October 10, 2003Date of Patent: August 23, 2005Assignee: TDK CorporationInventors: Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko, Toshinobu Miyagoshi
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Publication number: 20050076498Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.Type: ApplicationFiled: November 2, 2004Publication date: April 14, 2005Applicant: TDK CORPORATIONInventors: Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko, Toshinobu Miyagoshi
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Publication number: 20050076497Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.Type: ApplicationFiled: October 10, 2003Publication date: April 14, 2005Applicant: TDK CORPORATIONInventors: Toru Mizuno, Tomomi Asakura, Masatoshi Ito, Masaaki Kaneko, Toshinobu Miyagoshi
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Patent number: 4184323Abstract: Method and apparatus for recovering heat energy and kinetic energy of a gas discharged from the top of a blast furnace effectively as electric energy or other energy by a turbine and a control mechanism. An exhaust gas is supplied to a septum valve and then into a turbine connected in parallel, and the capacity or design value of the turbine is set at a mean value of the total flow rate of the exhaust gas varying with the lapse of time during the normal steady operation of the blast furnace. When the total flow rate of the exhaust gas is lower than the mean value, all the exhaust gas is supplied to the turbine to recover the energy of the exhaust gas and the top pressure of the furnace is controlled by a governor valve regulating the speed of the turbine.Type: GrantFiled: December 20, 1977Date of Patent: January 22, 1980Assignees: Mitsui Engineering & Shipbuilding Co., Ltd., Nippon Steel CorporationInventors: Setsuo Abe, Tomomi Asakura, Takeshi Shirato, Motomasa Miyake