Patents by Inventor Tomomi Ejima

Tomomi Ejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat treatment method and heat treatment system
    Patent number: 7135659
    Abstract: Upon performing a heat treatment by heating a semiconductor wafer positioned inside a reaction vessel with a heater provided outside the reaction vessel and supplying a processing gas into the reaction vessel, to increase the temperature inside the reaction vessel promptly to reach a processing temperature to be stabilized after the wafer is carried into the reaction vessel, and to reduce the burden to the operator caused in the heating control adjustment.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: November 14, 2006
    Assignee: Tokyo Electron Limited
    Inventor: Tomomi Ejima
  • Heat treatment method and heat treatment system
    Publication number: 20040087185
    Abstract: Upon performing a heat treatment by heating a semiconductor wafer positioned inside a reaction vessel with a heater provided outside the reaction vessel and supplying a processing gas into the reaction vessel, to increase the temperature inside the reaction vessel promptly to reach a processing temperature to be stabilized after the wafer is carried into the reaction vessel, and to reduce the burden to the operator caused in the heating control adjustment.
    Type: Application
    Filed: September 2, 2003
    Publication date: May 6, 2004
    Inventor: Tomomi Ejima