Abstract: This invention is achieved to provide a water-flow ultrasonic oral-cavity cleaning device. In the water-flow ultrasonic oral-cavity cleaning device (1), cleaning liquid (W1) from a cleaning-liquid supplying device (2) is supplied into a transducer case (21) through a supply port (26). Ultrasonic waves (S1) are propagated into the cleaning liquid W1 from an ultrasonic transducer (22) mounted in a transducer mounting part (23) inside the transducer case (21). The water-flow of the cleaning liquid (W1) is collected at the apical-part inside the transducer case (21), and then emitted from the issue (27) into the oral cavity, wherein power supply of 100W or less is supplied to the ultrasonic transducer (22) of 50 mm or less in diameter to propagate the ultrasonic waves (S1) of 100 kHz or more to 3 MHz or less in frequency into the cleaning liquid (W1).

Abstract: This invention is achieved to provide a water-flow ultrasonic oral-cavity cleaning device and a method for water-flow ultrasonic oral-cavity cleaning for surely and efficiently cleaning an oral cavity. In the water-flow ultrasonic oral-cavity cleaning device 1, cleaning liquid W1 from a cleaning-liquid supplying device 2 is supplied into a transducer case 21 through a supply port 26. Ultrasonic waves S1 are propagated into the cleaning liquid W1 from an ultrasonic transducer 22 mounted in a transducer mounting part 23 inside the transducer case 21. The water-flow of the cleaning liquid W1 is collected at the apical-part inside the transducer case 21, and then emitted from the issue 27 into the oral cavity, wherein power supply of 100W or less is supplied to the ultrasonic transducer 22 of 50 mm or less in diameter to propagate the ultrasonic waves S1 of 100 kHz or more to 3 MHz or less in frequency into the cleaning liquid W1.

Abstract: To provide an ultrasonic processing device that is capable of effectively carrying out a cleaning operation, a resist-stripping operation, etc. by projecting ultrasonic uniformly over an entirety of the ultrasonic processing target region by means of ultrasonic oscillation elements each having a width smaller than an ultrasonic processing target region of a processing object, as well as to provide an electronic parts fabrication method using the foregoing device, a plurality of ultrasonic oscillation elements are arranged so as to planarly extend in a glass substrate transport direction and in a glass substrate width direction, and projected figures obtained by projecting said ultrasonic oscillation elements to a plane perpendicular to the glass substrate transport direction form a single belt-like region of a width exceeding a width of the ultrasonic processing target region.

Abstract: To provide an ultrasonic processing device that is capable of effectively carrying out a cleaning operation, a resist-stripping operation, etc. by projecting ultrasonic uniformly over an entirety of the ultrasonic processing target region by means of ultrasonic oscillation elements each having a width smaller than an ultrasonic processing target region of a processing object, as well as to provide an electronic parts fabrication method using the foregoing device, a plurality of ultrasonic oscillation elements are arranged so as to planarly extend in a glass substrate transport direction and in a glass substrate width direction, and projected figures obtained by projecting said ultrasonic oscillation elements to a plane perpendicular to the glass substrate transport direction form a single belt-like region of a width exceeding a width of the ultrasonic processing target region.