Patents by Inventor Tomomi Hiramoto

Tomomi Hiramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220242981
    Abstract: This is a resin composition for a film containing an ionomer which comprises, in a copolymer (P) containing a structural unit (A) derived from ethylene and/or an ?-olefin having 3 to 20 carbon atoms, and a structural unit (B) derived from a monomer having a carboxyl group(s) and/or a dicarboxylic anhydride group(s) as essential constitutional units, at least a part of the carboxyl groups and/or the dicarboxylic anhydride groups in the copolymer (P) being converted into a metal-containing carboxylic acid salt(s) containing at least one kind of a metal ion(s) selected from Group 1, Group 2 or Group 12 of the periodic table, and having a phase angle ? at an absolute value G*=0.1 MPa of a complex modulus of elasticity measured by a rotary rheometer of 50 degrees to 75 degrees, and a molded body molded by using the same.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 4, 2022
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Shin AOKI, Tomomi HIRAMOTO, Kohei TAKAMITSU, Hiroaki KONISHI, Masahiro UEMATSU
  • Patent number: 10377886
    Abstract: A polyethylene for a pipe and a joint of the present invention satisfies the following characteristics (1) to (5): Characteristic (1): a melt flow rate at a temperature of 190° C. and a load of 21.6 kg (HLMFR) is 5 to 20 g/10 minutes, Characteristic (2): a density (D) is 0.954 to 0.960 g/cm3, Characteristic (3): a ratio of weight-average molecular weight (Mw) and number-average molecular weight (Mn) (Mw/Mn) measured by gel permeation chromatography (GPC) is 15 to 27, Characteristic (4): a rupture time at 80° C. and 5 MPa by a full notch creep test (FNCT) is 150 hours or more, and Characteristic (5): a Charpy impact strength (CIS) measured at ?20° C. is 8.5 kJ/m2 or more.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 13, 2019
    Assignee: Japan Polyethylene Corporation
    Inventors: Tomomi Hiramoto, Tetsurou Fukuda
  • Publication number: 20180112070
    Abstract: A polyethylene for a pipe and a joint of the present invention satisfies the following characteristics (1) to (5): Characteristic (1): a melt flow rate at a temperature of 190° C. and a load of 21.6 kg (HLMFR) is 5 to 20 g/10 minutes, Characteristic (2): a density (D) is 0.954 to 0.960 g/cm3, Characteristic (3): a ratio of weight-average molecular weight (Mw) and number-average molecular weight (Mn) (Mw/Mn) measured by gel permeation chromatography (GPC) is 15 to 27, Characteristic (4): a rupture time at 80° C. and 5 MPa by a full notch creep test (FNCT) is 150 hours or more, and Characteristic (5): a Charpy impact strength (CIS) measured at ?20° C. is 8.5 kJ/m2 or more.
    Type: Application
    Filed: March 30, 2016
    Publication date: April 26, 2018
    Applicant: Japan Polyethylene Corporation
    Inventors: Tomomi HIRAMOTO, Tetsurou FUKUDA
  • Publication number: 20080011709
    Abstract: A polyethylene-based resin molding material having an ethylene-based polymer in an amount from ?20% to <30% by weight that has a high load melt flow rate (HLMFR) at a temperature of 190° C. under a load of 21.6 kg of 0.1 to 1.0 g/l0 min and a density of 0.910 to 0.930 g/cm3; and an ethylene-based polymer in an amount from >70% to ?80% by weight that has a melt flow rate (MFR) at a temperature of 190° C. under a load of 2.16 kg of ?150 g/10 min to <400 g/10 min and a density of ?0.960 g/cm3; and wherein the polyethylene-based resin molding material has an MFR from ?0.4 g/10 min to <2.0 g/10 min, an HLMFR from ?70 g/10 min to <180 g/10 min, an HLMFR/MFR of 100 to 200, and a density from ?0.953 g/cm3 to <0.965 g/cm3.
    Type: Application
    Filed: June 22, 2007
    Publication date: January 17, 2008
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Kunihiko IBAYASHI, Ippei Kagaya, Tomomi Hiramoto, Kazuyuki Shimada