Abstract: A connector assembly includes a first connector and a second connector. The second connector is engageable with the first connector along a downward direction in a state where the first connector is below the second connector. The second connector includes a second contact, a second holding member and an operating portion. The operating portion is held by the second holding member so that a positional relation therebetween is kept when a force is applied to the operating portion along an upward direction and when a force is applied to the operating portion along a first horizontal direction perpendicular to the upward direction or a second horizontal direction opposite to the first horizontal direction. The second connector is removable from the first connector when a force is applied to the operating portion either along the upward direction or along the first or second horizontal direction.

Abstract: A MEMS device includes a mirror substrate (200), an electrode substrate (301) arranged so as to face the mirror substrate (200), a mirror (230) serving as a movable member rotatably supported in an opening portion of the mirror substrate (200) via support members, a driving electrode (101) arranged on an insulating film (104) on a surface of the electrode substrate (301) facing the mirror substrate (200) so as to face the mirror (230) across a gap and drive the mirror (230), and a lower electrode (103) made of a metal or a semiconductor and formed under the insulating film (104) exposed to the gap so as to be in contact with the insulating film (104).

Abstract: A connector assembly comprises a first connector and a second connector. The first connector is configured to be mounted on a connection object. The first connector includes a first contact and a first holding member. The first holding member holds the first contact. The second connector is configured to be engaged with the first connector along a downward direction in a state where the first connector is positioned below the second connector. The second connector includes a second contact, a second holding member and an operated portion. The second holding member holds the second contact. The second contact is configured to be connected to the first contact under an engaged state where the second connector is engaged with the first connector.

Abstract: A connector assembly has a first connector and a second connector matable with the first connector. The first connector includes a first contact having a first contact portion and a first housing configured to hold the first contact. The second connector includes a second contact having a second contact portion that is brought into contact with the first contact portion and a second housing configured to hold the second contact. The connector assembly further includes a positioner operable to position the second contact portion in a first direction so that the second contact portion corresponds to the first contact portion when the second connector is moved relative to the first connector along the first direction.

Abstract: A MEMS device includes a mirror substrate (200), an electrode substrate (301) arranged so as to face the mirror substrate (200), a mirror (230) serving as a movable member rotatably supported in an opening portion of the mirror substrate (200) via support members, a driving electrode (101) arranged on an insulating film (104) on a surface of the electrode substrate (301) facing the mirror substrate (200) so as to face the mirror (230) across a gap and drive the mirror (230), and a lower electrode (103) made of a metal or a semiconductor and formed under the insulating film (104) exposed to the gap so as to be in contact with the insulating film (104).

Abstract: A connector assembly has a first connector and a second connector matable with the first connector. The first connector includes a first contact having a first contact portion and a first housing configured to hold the first contact. The second connector includes a second contact having a second contact portion that is brought into contact with the first contact portion and a second housing configured to hold the second contact. The connector assembly further includes a positioner operable to position the second contact portion in a first direction so that the second contact portion corresponds to the first contact portion when the second connector is moved relative to the first connector along the first direction.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: In a semiconductor device having a MEMS according to this invention, a plurality of units having movable portions for constituting a MEMS are monolithically mounted on a semiconductor substrate on which an integrated circuit including a driving circuit, sensor circuit, memory, and processor is formed. Each unit has a processor, memory, driving circuit, and sensor circuit.

Abstract: In a micromachine according to this invention, a polyimide film is formed on the surface of each electrode. The polyimide film is formed as follows. A substrate having each electrode and a counterelectrode are dipped in an electrodeposition polyimide solution, and a positive voltage is applied to the electrode. A material dissolved in the electrodeposition polyimide solution is deposited on a surface of the positive-voltage-applied electrode that is exposed in the solution, thus forming a polyimide film on the surface.

Abstract: An optical switch for switching a light path between two optical waveguides is provided. The switch has a slit formed diagonally cutting across the crossing point of crossing optical waveguides and a substance in the slit has a function of transmitting or reflecting an optical signal is selectively held in the slit. The slit is narrower than cores of the optical waveguides, and has a center line formed on a bisection of an interior angle between optical axes of the crossing optical waveguides. Thus, the substance in the slit serves to make optical intensity reflected to each of the optical waveguides uniform. Further, a crossing optical waveguide consists of a reflecting structure having its interior filled with air during reflection and the intersecting angle between the first group of optical waveguides is between 0 to 90 degrees and preferably substantially between 73 and 74 degrees.