Abstract: Disclosed is a nickel electroplating bath or a nickel alloy electroplating bath used for electroplating a conductor partially masked with an organic high-molecular resist layer, wherein the nickel electroplating bath contains a water-soluble nickel salt, and the nickel alloy electroplating bath contains both a water-soluble nickel salt and a water-soluble salt of a metal capable of being alloyed with nickel. The above electroplating bath is incorporated with an electrical conductive salt containing at least one cation selected from the group consisting of an ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion. Further, the electrical conductive salt substantially does not contain a sodium ion and a potassium ion as cations. Such an electroplating bath is capable of electroplating a conductor partially masked with an organic high-molecular resist layer without floating of the resist layer.

Abstract: To a neutral electroless gold plating bath comprising a gold sulfite, a sulfite, and a reducing agent, there are added an organic phosphonic acid or a salt thereof and an optional stabilizer in the form of a non-ionic surfactant or non-ionic polymer. A gold plating film having an aesthetic lemon yellow color tone and susceptible to bonding deposits on an article from the bath without attacking the base material of the article and without plating spread.