Patents by Inventor Tomomitsu Satake

Tomomitsu Satake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5818109
    Abstract: A wiring structure incorporated is formed on an insulating layer, and includes an aluminum-based metal strip extending on the insulating layer and a barrier layer of refractory metal covering the aluminum-based metal strip so as to prevent the aluminum-based metal layer from electro-migration; the two-level barrier layer has fin portions extending on both sides of the aluminum-based metal layer therealong, and the fin portions prevent the wiring structure from increase of contact resistance due to a mis-alignment.
    Type: Grant
    Filed: December 22, 1995
    Date of Patent: October 6, 1998
    Assignee: NEC Corporation
    Inventor: Tomomitsu Satake