Abstract: A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers are laminated and bonded alternately, and external electrodes are formed on one end and the other end of the laminated chip. The laminated chip includes a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.

Abstract: A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers being laminated and bonded alternately, and external electrodes formed on one end and the other end of the laminated chip. The laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.

Abstract: A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers being laminated and bonded alternately, and external electrodes formed on one end and the other end of the laminated chip. The laminated chip having a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.

Abstract: In a method of manufacturing a thin-film polymer multi-layer capacitor, in a vacuum chamber, a resin thin film layer forming step of forming a resin thin film layer by forming a monomer layer by vapor-depositing a monomer and thereafter by curing the monomer layer by irradiating an electron beam onto the monomer layer, and a metal thin film layer forming step of forming a metal thin film layer by vapor-depositing a metal material are alternately performed on a rotary drum thus forming a multi-layer body in which the resin thin film layer and the metal thin film layer are alternately laminated on the rotary drum. In the resin thin film layer forming step, the monomer layer is formed using a dimethacrylate compound having an alicyclic hydrocarbon skeleton expressed by a following chemical formula (1) as the monomer. wherein, symbol A indicates an organic group containing alicyclic hydrocarbon.

Abstract: In a method of manufacturing a thin-film polymer multi-layer capacitor, in a vacuum chamber, a resin thin film layer forming step of forming a resin thin film layer by forming a monomer layer by vapor-depositing a monomer and thereafter by curing the monomer layer by irradiating an electron beam onto the monomer layer, and a metal thin film layer forming step of forming a metal thin film layer by vapor-depositing a metal material are alternately performed on a rotary drum thus forming a multi-layer body in which the resin thin film layer and the metal thin film layer are alternately laminated on the rotary drum. In the resin thin film layer forming step, the monomer layer is formed using a dimethacrylate compound having an alicyclic hydrocarbon skeleton expressed by a following chemical formula (1) as the monomer. wherein, symbol A indicates an organic group containing alicyclic hydrocarbon.

Abstract: Provided is a multilayer capacitor that can be manufactured with high yields and whose warpage is suppressed. The multilayer capacitor includes two or more laminated bodies which are bonded together, the two or more laminated bodies each including resin layers and metal layers which are alternately laminated a plurality of times in a thickness direction and each being warped and having front and rear surfaces covered with surface layers containing a resin material, one of the front and rear surfaces being formed of a first surface as a smooth surface having no recess portion, another of the front and rear surfaces being formed of a second surface having a recess portion, in which at least two adjacent laminated bodies are bonded together at the first surfaces or the second surfaces. Also provided are a manufacturing method for the multilayer capacitor, and a circuit board and an electronic device which use the multilayer capacitor.

Abstract: Provided is a multilayer capacitor that can be manufactured with a high yield, and wherein the warp thereof can be limited. The multilayer capacitor, manufacturing method thereof, circuit board, and electronic device are characterized by having resin layers and metal layers laminated alternately a plurality of times in the thickness direction, having the front and back faces thereof covered with surface layers containing resin material, having either the front face or the back face comprised of a first face (30) that is a gently sloping face without any recess section, having the other face comprised of a second face (32) with recess sections (34), and characterized by having two or more laminated bodies (20A, 20B), with warps, pasted together, and by further having at least two adjacent laminated bodies (20A, 20B) pasted together with either the first faces (30) thereof, or with the second faces (32) thereof.