Patents by Inventor Tomonobu Sugimoto

Tomonobu Sugimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor output device, sound output device, and musical instrument
    Patent number: 10659888
    Abstract: A sensor output device includes a sensor and an output circuit. The sensor includes a piezoelectric element and an output terminal. The piezoelectric element includes porous resin. The output circuit is connected to the output terminal of the sensor and includes a thermistor.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: May 19, 2020
    Assignee: YAMAHA CORPORATION
    Inventors: Susumu Ishibashi, Masao Noro, Yohei Ohtani, Tomonobu Sugimoto
  • SENSOR OUTPUT DEVICE, SOUND OUPUT DEVICE, AND MUSICAL INSTRUMENT
    Publication number: 20190141455
    Abstract: A sensor output device includes a sensor and an output circuit. The sensor includes a piezoelectric element and an output terminal. The piezoelectric element includes porous resin. The output circuit is connected to the output terminal of the sensor and includes a thermistor.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 9, 2019
    Inventors: Susumu ISHIBASHI, Masao NORO, Yohei OHTANI, Tomonobu SUGIMOTO
  • Solid-state imaging apparatus, manufacturing method therefor and electronic equipment using the same
    Publication number: 20080197437
    Abstract: Provided is a solid-state imaging apparatus having excellent reading accuracy. The solid-state imaging apparatus of the present invention includes a solid-state imaging element (light receiving element portion) (1a) of a solid-state imaging element chip (1) mounted on a film (11), and a resin (2b) having fluidity between the solid-state imaging element chip (1) and the film (11), in which the periphery of the resin having the fluidity is sealed with solid-state resins (2a, 14, etc.) that are said to be sealing members. The resin (2b) having the fluidity eliminates an adverse influence on reading due to waviness on the film surface, and realizes the solid-state imaging apparatus having the excellent reading accuracy.
    Type: Application
    Filed: February 13, 2008
    Publication date: August 21, 2008
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Tomonobu Sugimoto, Takashi Magoi
  • Electronic component and fabrication method thereof
    Patent number: 6794762
    Abstract: An electronic component, in which an electronic element 9 fixed onto a first electrically conductive film 7 is electrically connected to second electrically conductive films 8 arranged in substantially the same plane as that of the first electrically conductive film 7 and the electronic element 9 including peripheries of the first and second electrically conductive films 7 and 8 is covered by an encapsulation resin portion 11, has electrically conductive protrusions 13 formed on an exposed surface of the first and second electrically conductive films exposed from the encapsulation resin portion 11.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: September 21, 2004
    Assignee: NEC Electronics Corporation
    Inventors: Gorou Ikegami, Tomonobu Sugimoto
  • Electronic component and fabrication method thereof
    Publication number: 20030160339
    Abstract: An electronic component, in which an electronic element 9 fixed onto a first electrically conductive film 7 is electrically connected to second electrically conductive films 8 arranged in substantially the same plane as that of the first electrically conductive film 7 and the electronic element 9 including peripheries of the first and second electrically conductive films 7 and 8 is covered by an encapsulation resin portion 11, has electrically conductive protrusions 13 formed on an exposed surface of the first and second electrically conductive films exposed from the encapsulation resin portion 11.
    Type: Application
    Filed: February 20, 2003
    Publication date: August 28, 2003
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Gorou Ikegami, Tomonobu Sugimoto