Abstract: A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10?6 to 30×10?6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.

Abstract: A resin film, in which at least one of polyimide layers is a non-thermoplastic polyimide layer having a linear thermal expansion coefficient of 1×10?6 to 30×10?6 (1/K), is shown. The non-thermoplastic polyimide layer is composed of a polyimide which is produced by reacting an anhydride component containing an aromatic tetracarboxylic anhydride with a diamine component, wherein the diamine component contains both a dimer acid-type diamine produced by replacing each of two terminal carboxyl groups in a dimer acid with a primary aminomethyl or amino group and an aromatic diamine, and the dimer acid-type diamine is contained in an amount of 1 to 15 mol % relative to the whole diamine component.

Abstract: This invention relates to a curable resin composition suitable for use in the applications of casting material, coating material, putty, adhesives, various types of linings and FRP, said curable resin composition being characterized in that an unsaturated acrylic urethane prepared by addition reaction of a hydroxyl-terminated polymer, a polyisocyanate and a monohydroxylalkyl monoacrylate or a monohydroxylalkyl monomethacrylate, substantially free from an isocyanate group and having a weight-average extension of molecular chain of 100 A or more is added to at least one of an unsaturated polyester resin and an epoxy acrylate resin in an amount effective for the development of toughness, thus the toughness of the conventional unsaturated polyester or epoxyacrylate ester being improved by admixing said unsaturated acrylic urethane therewith.