Patents by Inventor Tomonori Baba

Tomonori Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive film
    Patent number: 8852728
    Abstract: There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 ?m, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to ? of the designed width.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: October 7, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Toyomi Matsuda, Makoto Sutou, Tomonori Baba, Daisuke Mitsuhashi
  • Pattern exposure method, conductive film producing method, and conductive film
    Patent number: 8383329
    Abstract: There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 ?m, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to 1/6 of the designed width.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: February 26, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Toyomi Matsuda, Makoto Sutou, Tomonori Baba, Daisuke Mitsuhashi
  • PATTERN EXPOSURE METHOD, CONDUCTIVE FILM PRODUCING METHOD, AND CONDUCTIVE FILM
    Publication number: 20100300729
    Abstract: There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200 ?m, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to 1/6 of the designed width.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 2, 2010
    Applicant: FUJIFILM CORPORATION
    Inventors: Toyomi Matsuda, Makoto Sutou, Tomonori Baba, Daisuke Mitsuhashi