Abstract: An information processing apparatus includes: a first control device that controls, in accordance with an operation mode, power reception/delivery from/to an external device connected to the information processing apparatus; a battery that is recharged by an external power supply or the external device; a second control device that acquires a power supply state of the information processing apparatus; and a third control device that determines whether power is being delivered from the external power supply to the information processing apparatus; and sets the operation mode of the first control device to a first mode based on the power supply state and on a result of the determination. The first mode is an operation mode in which the power reception alone is enabled between the power reception from the external device and the power delivery to the external device.

Abstract: A charge control apparatus includes a memory and a first hardware processor coupled to the memory. The first hardware processor: acquires, from one or more terminal devices, charge information relating to a charge of the one or more terminal devices; and controls charging of the one or more terminal devices based on the charge information.

Abstract: A touch sensor includes a sensor and a processor. The sensor detects touch operations on first, second, and third regions of a sensor region disposed along a longitudinal direction of an outer edge portion of a terminal device. The second and third regions are on opposite sides of the first region. The processor identifies the orientation of the terminal device as a first orientation where the sensor region is located at the top or bottom of the terminal device or a second orientation where the sensor region is located at the right or left of the terminal device, and makes a different determination as to whether the first region is depressed based on whether the identified orientation is the first or second orientation, in response to detection of the touch operation on at least one of the second and third regions together with the touch operation on the first region.

Abstract: An information processing apparatus includes: a first control device that controls, in accordance with an operation mode, power reception/delivery from/to an external device connected to the information processing apparatus; a battery that is recharged by an external power supply or the external device; a second control device that acquires a power supply state of the information processing apparatus; and a third control device that determines whether power is being delivered from the external power supply to the information processing apparatus; and sets the operation mode of the first control device to a first mode based on the power supply state and on a result of the determination. The first mode is an operation mode in which the power reception alone is enabled between the power reception from the external device and the power delivery to the external device.

Abstract: A function enhancement apparatus according to an embodiment includes: a connector to which an information processing device is connected; and a first processor that acquires a power source state of the information processing device connected to the connector, and causes, based on the acquired power source state, the information processing device to perform activation by power source control when an activation command to the information processing device is received from an external network.

Abstract: A touch sensor includes a sensor and a processor. The sensor detects touch operations on first, second, and third regions of a sensor region disposed along a longitudinal direction of an outer edge portion of a terminal device. The second and third regions are on opposite sides of the first region. The processor identifies the orientation of the terminal device as a first orientation where the sensor region is located at the top or bottom of the terminal device or a second orientation where the sensor region is located at the right or left of the terminal device, and makes a different determination as to whether the first region is depressed based on whether the identified orientation is the first or second orientation, in response to detection of the touch operation on at least one of the second and third regions together with the touch operation on the first region.

Abstract: A touch detection device includes: a first sensor having a first capacitance; a monitoring unit configured to monitor the first capacitance of the first sensor at a first period; a determining unit configured to determine whether the first capacitance monitored by the monitoring unit exceeds a first threshold; and a period changing unit configured to change the first period into a second period that is shorter than the first period when the determining unit determines that the first capacitance exceeds the first threshold.

Abstract: A touch detection device includes: a first sensor having a first capacitance; a monitoring unit configured to monitor the first capacitance of the first sensor at a first period; a determining unit configured to determine whether the first capacitance monitored by the monitoring unit exceeds a first threshold; and a period changing unit configured to change the first period into a second period that is shorter than the first period when the determining unit determines that the first capacitance exceeds the first threshold.

Abstract: A method for manufacturing a semiconductor device can prevent defective products resulting from a plating liquid when surfaces of protruded portions of penetration electrodes are subjected to plating. An organic insulation film (14) is formed on one surface of a substrate proper (10), and a support member (16) is adhered to the organic insulation film (adhesion step). A rear side of the substrate proper is removed until protruded portions (6) of penetration electrodes (7) are exposed, thereby to form a semiconductor substrate (5). Plating films (8) are formed on the surfaces of the protruded portions (6), and the support member and the organic insulation film are removed from the semiconductor substrate. The organic insulation film has an adhesive property and chemical resistance to chemical substances used in respective steps after the adhesion step, and it is at least dissolved in or peeled off from a chemical substance used in the removal step.

Abstract: A method for manufacturing a semiconductor device can prevent defective products resulting from a plating liquid when surfaces of protruded portions of penetration electrodes are subjected to plating. An organic insulation film (14) is formed on one surface of a substrate proper (10), and a support member (16) is adhered to the organic insulation film (adhesion step). A rear side of the substrate proper is removed until protruded portions (6) of penetration electrodes (7) are exposed, thereby to form a semiconductor substrate (5). Plating films (8) are formed on the surfaces of the protruded portions (6), and the support member and the organic insulation film are removed from the semiconductor substrate. The organic insulation film has an adhesive property and chemical resistance to chemical substances used in respective steps after the adhesion step, and it is at least dissolved in or peeled off from a chemical substance used in the removal step.

Abstract: A mounting method and a mounting apparatus of an electronic part onto a substrate are provided, which enable inspection of a bond formed between an electronic part and a substrate when flip-chip bonding is executed by an ultrasonic wave and thermocompression bonding connecting method. The semiconductor chip has bumps which, when are compressed and subjected to ultrasonic vibration, enable formation of a connection between the semiconductor chip and a substrate conductor.

Abstract: A substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is cut while being supported on a sheet, and thereafter, chip components obtained by the cutting are handled while being supported on the sheet. That is, in the state in which the substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is supported on the sheet, a layer of a sealing material is formed on the substrate before cutting or the chip component after cutting. Each chip component is directly picked up from the sheet by being peeled off, and the chip components are successively stacked on the sheet. This enables the easy handling of even small-size thin chip components scarcely causing the damage and warp of the chip components and enables the correct stacking of the chip components.

Abstract: A substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is cut while being supported on a sheet, and thereafter, chip components obtained by the cutting are handled while being supported on the sheet. That is, in the state in which the substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is supported on the sheet, a layer of a sealing material is formed on the substrate before cutting or the chip component after cutting. Each chip component is directly picked up from the sheet by being peeled off, and the chip components are successively stacked on the sheet. This enables the easy handling of even small-size thin chip components scarcely causing the damage and warp of the chip components and enables the correct stacking of the chip components.