Patents by Inventor Tomonori Ito

Tomonori Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958199
    Abstract: A robot control device that controls operation of a robot including a robot arm, a driving section configured to drive the robot arm, and a driving control section configured to receive electric power supplied to the driving section and output power to the driving section based on an input control signal, the robot control device including a logical operation circuit configured to perform a logical operation about a stop signal and output an operation result and a power interruption circuit configured to interrupt, based on the operation result, the electric power supplied to the driving control section or the control signal input to the driving control section to thereby interrupt the power of the driving section.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 16, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Daisuke Higashi, Takahiro Kamijo, Tomonori Yamada, Motoki Ito
  • Publication number: 20240118406
    Abstract: A sensor includes a complex-transfer-function calculator that calculates a complex transfer function from received signals, a reflection-coefficient calculator that calculates a reflection coefficient using a complex transfer function when an object to be detected is arranged at one of L positions and an ideal complex transfer function which is a theoretical value for the position at which the object to be detected is arranged, various normalizers that calculate a normalized reflection coefficient by normalizing the reflection coefficient, a reflection-coefficient interpolator that calculates an interpolated reflection coefficient by interpolation calculation of the reflection coefficient using the normalized reflection coefficient for each coordinates used in position estimation of the object to be detected, and a position estimator that corrects the position estimation, using a steering vector and the interpolated reflection coefficient that are determined based on the position of each of the transmitting a
    Type: Application
    Filed: December 14, 2021
    Publication date: April 11, 2024
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takeshi NAKAYAMA, Shoichi IIZUKA, Naoki HONMA, Tomonori ITO, Teppei HAYASHI, Nobuyuki SHIRAKI, Kentaro MURATA
  • Patent number: 11945336
    Abstract: An information creation apparatus includes a processor configured to, in a case where priorities of power supply are set to power supply targets, set upper limits of power storage remaining amounts of the power supply targets such that the upper limit of the power storage remaining amount of a power supply target with a lower priority is set to a value larger than a reference value.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: April 2, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yoshimasa Watanabe, Kizuku Yamada, Masaki Ito, Sakiko Yoshida, Yuki Takahashi, Tomonori Imamura
  • Patent number: 11942270
    Abstract: An electricity storage device includes an internal element that has a first main surface, a second main surface, a first side surface, a second side surface, a first end surface, and a second end surface, and that further includes a first internal electrode drawn out to the first end surface, a second internal electrode drawn out to the second end surface, a separator layer disposed between the first and second internal electrodes, and an electrolytic solution. Moreover, a first end surface electrode is disposed on the first end surface; and a second end surface electrode is disposed on the second end surface. The first internal electrode, the second internal electrode, the separator layer, the first end surface electrode, and the second end surface electrode are integrally sintered to form a sintered body.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: March 26, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masayuki Kouzu, Takeshi Sodeoka, Syouta Ikebe, Mami Aoki, Tomonori Ito, Tadahiro Minamikawa
  • Publication number: 20220148821
    Abstract: An electricity storage device includes an internal element that has a first main surface, a second main surface, a first side surface, a second side surface, a first end surface, and a second end surface, and that further includes a first internal electrode drawn out to the first end surface, a second internal electrode drawn out to the second end surface, a separator layer disposed between the first and second internal electrodes, and an electrolytic solution. Moreover, a first end surface electrode is disposed on the first end surface; and a second end surface electrode is disposed on the second end surface. The first internal electrode, the second internal electrode, the separator layer, the first end surface electrode, and the second end surface electrode are integrally sintered to form a sintered body.
    Type: Application
    Filed: January 21, 2022
    Publication date: May 12, 2022
    Inventors: Masayuki KOUZU, Takeshi SODEOKA, Syouta IKEBE, Mami AOKI, Tomonori ITO, Tadahiro MINAMIKAWA
  • Publication number: 20200130596
    Abstract: A hook apparatus comprises a base attachable to the opening of a member-to-be-attached workpiece and a hook rotatably attached to the base. The base has a shaft holding portion on a side surface so as to hold the hook. The hook has a hook portion for holding a load, and a hook shaft portion held by the shaft holding portion of the base. The hook is pivotable on the hook shaft portion as a central axis between a storage position stored in the base and a use position where the hook portion is exposed to hold the load. The hook is further equipped with a locking portion support surface, and a workpiece abutting portion which abuts the back side of the workpiece above the opening of the workpiece when the hook is in the use position.
    Type: Application
    Filed: October 31, 2019
    Publication date: April 30, 2020
    Inventors: Masashi DENDO, Tomonori ITO
  • Patent number: 9105322
    Abstract: Provided is a solid state drive suitable for an increase in capacity. The solid state drive includes a flash memory, and a capacitor electrically connected to the flash memory. The capacitor is composed of an electric double layer capacitor including an electrolyte solution containing propylene carbonate.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: August 11, 2015
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tomonori Ito
  • Publication number: 20140203402
    Abstract: Provided is a solid state drive suitable for an increase in capacity. The solid state drive includes a flash memory, and a capacitor electrically connected to the flash memory. The capacitor is composed of an electric double layer capacitor including an electrolyte solution containing propylene carbonate.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 24, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Tomonori Ito
  • Patent number: 8339800
    Abstract: A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: December 25, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshihiro Yamaguchi, Tomonori Ito
  • Publication number: 20110199744
    Abstract: A circuit module includes a substrate, a component land provided on the substrate, an electronic component bonded to the component land, a case land provided on the substrate, and a case bonded to the case land so as to cover the electronic component. The case includes a top plate, and a leg that extends from a peripheral edge of the top plate in a direction substantially perpendicular to the top plate and that includes a groove in an end surface thereof that is bonded to the case land.
    Type: Application
    Filed: February 10, 2011
    Publication date: August 18, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihiro YAMAGUCHI, Tomonori ITO
  • Patent number: 7009114
    Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: March 7, 2006
    Assignee: Murata Manufacturing Co., LTD
    Inventors: Jun Urakawa, Mitsuyoshi Nishide, Isao Kato, Norio Yoshida, Tomonori Ito
  • Patent number: 6937845
    Abstract: A high-frequency module includes first to fifth terminals, a high-pass filter, a high-frequency switch, a transmitter-side balun, and a receiver-side balun. The high-pass filter is connected to the high-frequency switch, and the high-frequency switch is also connected to the transmitter-side balun and to the receiver-side balun. The first terminal is connected to an antenna, the second and third terminals are connected to a transmitter circuit, and the fourth and fifth terminals are connected to a receiver circuit.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: August 30, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takahiro Watanabe, Norio Yoshida, Tomonori Ito
  • Patent number: 6867982
    Abstract: A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 15, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tomonori Ito, Norio Yoshida, Takahiro Watanabe
  • Publication number: 20030011999
    Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.
    Type: Application
    Filed: February 21, 2001
    Publication date: January 16, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Jun Urakawa, Mitsuyoshi Nishide, Isao Kato, Norio Yoshida, Tomonori Ito
  • Publication number: 20020034934
    Abstract: A high-frequency module includes first to fifth terminals, a high-pass filter, a high-frequency switch, a transmitter-side balun, and a receiver-side balun. The high-pass filter is connected to the high-frequency switch, and the high-frequency switch is also connected to the transmitter-side balun and to the receiver-side balun. The first terminal is connected to an antenna, the second and third terminals are connected to a transmitter circuit, and the fourth and fifth terminals are connected to a receiver circuit.
    Type: Application
    Filed: April 2, 2001
    Publication date: March 21, 2002
    Inventors: Takahiro Watanabe, Norio Yoshida, Tomonori Ito
  • Publication number: 20010050550
    Abstract: A high frequency component is constructed such that the characteristics of a high frequency circuit that cannot be measured only by an outwardly extending terminal electrode are easily measured at the final-product stage. In the high frequency component, a substrate has an electrode pattern provided including a signal measuring electrode pad. Additionally, chip components are mounted on the substrate. A metal cover has a hole provided near the signal measuring electrode pad. Through the hole, a probe of a measuring apparatus is inserted from the outside to abut with the electrode pad. With the arrangement, a voltage signal obtained at a predetermined point of the high frequency circuit is measured.
    Type: Application
    Filed: February 28, 2001
    Publication date: December 13, 2001
    Inventors: Norio Yoshida, Takahiro Watanabe, Tomonori Ito
  • Publication number: 20010026953
    Abstract: A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.
    Type: Application
    Filed: February 28, 2001
    Publication date: October 4, 2001
    Inventors: Tomonori Ito, Norio Yoshida, Takahiro Watanabe
  • Patent number: 6069538
    Abstract: An impedance stabilizing unit including an input port; an output port connected to the input unit; an inductance matching circuit connected to ground and at least one of the input port and the output port, the value of the impedance of the inductance matching circuit being adjusted in accordance with a change of the impedance on the side of said output port. The above unit can be made small, realizing a lowered insertion loss.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: May 30, 2000
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Norio Nakajima, Takahiro Watanabe, Tomonori Ito, Harufumi Mandai, Satoshi Ishino
  • Patent number: 5426170
    Abstract: 1. A method for preparing an aromatic polycarbonate having less content of a low molecular weight oligomer which comprises the steps of:(A) conducting an interfacial polymerization reaction in a reaction system comprising at least one aromatic dihydroxy compound, a carbonate precursor, an alkali metal or alkaline earth metal base, water and an organic solvent in the absence of an endcapping agent, and(B) conducting an interfacial polymerization reaction with the addition of an endcapping agent after at least one of the following parameters reaches a predetermined value:(1) a weight-average molecular weight of a prepolymer obtained in step A,(2) a residual amount of the aromatic dihydroxy compound which is contained in the reaction mixture obtained in step A,(3) an amount ratio of a bishaloformate compound to a prepolymer wherein the bishaloformate compound is a bishaloformate derivative of a dihydroxy compound and is contained in the reaction mixture obtained in step A.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: June 20, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Motokazu Hirao, Yoshiyuki Totani, Tomonori Ito, Masakatsu Nakatsuka, Akihiro Yamaguchi
  • Patent number: 5380814
    Abstract: A process for producing an aromatic polycarbonate by reacting an aromatic dihydroxy compound, an alkali or alkaline earth metal base and a carbonyl halide compound comprises feeding a polymerization catalyst as the carbonyl halide is fed to a mixture of the aromatic dihydroxy compound, the alkali metal or alkaline earth metal, water and an organic solvent. The molecular weight of the aromatic polycarbonate can be properly controlled, the rate of end capping is high, and coloration of the aromatic polycarbonate is less. Such aromatic polycarbonate can be produced while suppressing hydrolysis of the carbonyl halide compound and/or haloformate compound.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: January 10, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Yoshiyuki Totani, Motokazu Hirao, Tomonori Ito, Masakatsu Nakatsuka, Akihiro Yamaguchi