Abstract: A wiring board includes: a first insulating layer; a first pad region provided above the first insulating layer and having a first connection pad; a second insulating layer provided above the first connection pad and having a first opening to expose the first connection pad; a second pad region provided above the second insulating layer and having a second connection pad electrically connected to the first connection pad; and a third insulating layer provided above the second connection pad, and having a second opening to exposes the first and second connection pads. The first connection pad region is smaller than the second connection pad region.

Abstract: In one embodiment, there is provided a wiring substrate. The wiring substrate includes: a substrate body comprising a first surface and a second surface opposite to the first surface, wherein the substrate body has a plurality of first through holes; a plurality of first pads on the first surface of the substrate body; a plurality of second pads on the first surface of the substrate body, wherein the second pads are surrounded by the first pads. Each of the second pads has at least one second through hole, and the second pads are disposed on the first surface of the substrate body such that each of the second through holes is communicated with a corresponding one of the first through holes.