Abstract: In caliper seal structure, region on one side of caliper main body in axial direction of cylinder with respect to piston seal is set as fluid pressure side where fluid pressure is received, region on other side of caliper main body in axial direction of cylinder with respect to piston seal is set as atmospheric side that opens to atmosphere, and groove forming portion includes holding portion that sets groove width of seal groove in axial direction as first groove width and that is configured to hold piston seal by making inner side surfaces of seal groove in axial direction contact with outer side surfaces of piston seal in axial direction, respectively, and enlarged portion that sets groove width of seal groove in axial direction as second groove width which is increased to one side in axial direction so as to be greater than first groove width.

Abstract: A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.

Abstract: A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.