Patents by Inventor Tomoo Iijima
Tomoo Iijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10270321Abstract: An electric motor includes: brushes (31) that are brought into sliding contact with a commutator of an armature that is fixed to a rotation shaft and feeds electric power; a brush holder stay (33) that supports the brushes (31) via brush holders (41); noise prevention elements (110) that are electrically connected to the brushes (31); and terminals (130) and jump wires (141) that electrically connect between the brush holders (41) and the noise prevention elements (110), wherein first connection portions, which connect between the noise prevention elements (110) and the terminals (130), and second connection portions, which connect between the terminals (130) and the jump wires (141), are both disposed only on a first surface (S1) of the brush holder stay (33).Type: GrantFiled: May 13, 2015Date of Patent: April 23, 2019Assignee: Mitsuba CorporationInventors: Natsumi Tamura, Tomoo Iijima, Teppei Tokizaki, Satoshi Tamura
-
Patent number: 10128720Abstract: This electric motor includes: a brushless motor (20); and a control device (50) that is coupled integrally to an end of a motor case (11) in an axial direction. The control device (50) includes: a bus bar unit main body (53) that has a base unit (54) with a plurality of bus bars wired thereinside and has a connector unit (58) provided integrally on the base unit (54) and led out to an outside of a housing (10); a motor drive unit (66) that drives the brushless motor (20); and a motor control unit (71) that controls the motor drive unit (66). The motor drive unit (66) is attached to a first main surface (51) of the base unit (54) while the motor control unit (71) is attached to a second main surface (52) of the base unit (54).Type: GrantFiled: December 25, 2013Date of Patent: November 13, 2018Assignee: Mitsuba CorporationInventors: Masaki Ishizeki, Yoichi Shindo, Shinji Shibuya, Ken Hirota, Atsushi Takahashi, Yuzuru Masuyama, Tomoo Iijima, Ken Yamamoto, Nobuyasu Sadakata, Shigeyuki Enkaku
-
Patent number: 10104785Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.Type: GrantFiled: December 9, 2016Date of Patent: October 16, 2018Assignee: Invensas CorporationInventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Publication number: 20170171986Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.Type: ApplicationFiled: December 9, 2016Publication date: June 15, 2017Inventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Publication number: 20170104395Abstract: An electric motor includes: brushes (31) that are brought into sliding contact with a commutator of an armature that is fixed to a rotation shaft and feeds electric power; a brush holder stay (33) that supports the brushes (31) via brush holders (41); noise prevention elements (110) that are electrically connected to the brushes (31); and terminals (130) and jump wires (141) that electrically connect between the brush holders (41) and the noise prevention elements (110), wherein first connection portions, which connect between the noise prevention elements (110) and the terminals (130), and second connection portions, which connect between the terminals (130) and the jump wires (141), are both disposed only on a first surface (S1) of the brush holder stay (33).Type: ApplicationFiled: May 13, 2015Publication date: April 13, 2017Inventors: Natsumi TAMURA, Tomoo IIJIMA, Teppei TOKIZAKI, Satoshi TAMURA
-
Patent number: 9521755Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.Type: GrantFiled: May 7, 2014Date of Patent: December 13, 2016Assignee: Invensas CorporationInventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Publication number: 20150357886Abstract: This electric motor includes: a brushless motor (20); and a control device (50) that is coupled integrally to an end of a motor case (11) in an axial direction. The control device (50) includes: a bus bar unit main body (53) that has a base unit (54) with a plurality of bus bars wired thereinside and has a connector unit (58) provided integrally on the base unit (54) and led out to an outside of a housing (10); a motor drive unit (66) that drives the brushless motor (20); and a motor control unit (71) that controls the motor drive unit (66). The motor drive unit (66) is attached to a first main surface (51) of the base unit (54) while the motor control unit (71) is attached to a second main surface (52) of the base unit (54).Type: ApplicationFiled: December 25, 2013Publication date: December 10, 2015Applicant: MITSUBA CorporationInventors: Masaki Ishizeki, Yoichi Shindo, Shinji Shibuya, Ken Hirota, Atsushi Takahashi, Yuzuru Masuyama, Tomoo Iijima, Ken Yamamoto, Nobuyasu Sadakata, Shigeyuki Enkaku
-
Publication number: 20140240934Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.Type: ApplicationFiled: May 7, 2014Publication date: August 28, 2014Applicant: Invensas CorporationInventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Patent number: 8736064Abstract: An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.Type: GrantFiled: November 8, 2010Date of Patent: May 27, 2014Assignee: Invensas CorporationInventors: Hideki Kotake, Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino, Tomoo Iijima
-
Publication number: 20130247372Abstract: To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the interlayer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 ?m or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.Type: ApplicationFiled: May 17, 2013Publication date: September 26, 2013Applicant: Invensas CorporationInventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Patent number: 8112881Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.Type: GrantFiled: September 29, 2005Date of Patent: February 14, 2012Assignees: Tessera Interconnect Materials, Inc., Sony Chemical & Information Device CorporationInventors: Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai, Tomoo Iijima
-
Publication number: 20110057324Abstract: An interconnect element is provided. A monolithic dielectric element has a first exposed major surface, a plurality of first recesses extending inwardly from the first major surface, and a second exposed major surface remote from the first major surface, a plurality of second recesses extending inwardly from the second major surface. A plurality of first metal interconnect patterns are embedded in the plurality of first recesses and extend in one or more directions along the first major surface. A plurality of second metal interconnect patterns are embedded in the plurality of second recesses and extend in one or more directions along the second major surface. A plurality of non-hollow metal posts extend through the dielectric element between at least some of the plurality of first metal interconnect patterns and at least some of the plurality of second metal interconnect patterns.Type: ApplicationFiled: November 8, 2010Publication date: March 10, 2011Applicant: Tessera Interconnect Materials, Inc.Inventors: Hideki Kotake, Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino, Tomoo Iijima
-
Publication number: 20100242270Abstract: A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.Type: ApplicationFiled: February 16, 2010Publication date: September 30, 2010Inventors: Tomoo Iijima, Kimitaka Endo, Kazuo Ikenaga, Hiroshi Odaira, Naoto Minari, Takashi Kato
-
Patent number: 7721422Abstract: A method of making a microelectronic assembly includes providing a conductive metal layer having a first surface and a second surface, and etching the first surface of the conductive metal layer to form conductive protrusions, whereby after the etching step, the second surface of the conductive metal layer defines a substantially flat, continuous surface. The method includes juxtaposing a layer of an insulating material with tips of the conductive protrusions, and pressing the conductive protrusions through the layer of an insulating material so that the tips of the conductive protrusions are accessible at a first surface of the layer of an insulating material.Type: GrantFiled: April 10, 2007Date of Patent: May 25, 2010Assignee: Tessera Interconnect Materials, Inc.Inventors: Tomoo Iijima, Masayuki Ohsawa
-
Patent number: 7546681Abstract: A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top surface of the metal layer and forming openings in the dielectric layer to expose portions of the top surface of the metal layer. The method includes providing conductive elements atop the dielectric layer, at least some of the conductive elements extending through the openings in the dielectric layer and being in contact with the metal layer, and plating first conductive protrusions atop the at least some of the conductive elements extending through the openings in the dielectric layer, the first conductive protrusions extending away from the metal layer. The method includes selectively removing portions of the metal layer from the bottom surface of the metal layer to form second conductive protrusions that extend away from the first conductive protrusions.Type: GrantFiled: July 17, 2006Date of Patent: June 16, 2009Assignee: Tessera Interconnect Materials, Inc.Inventors: Tomoo Iijima, Masayuki Ohsawa
-
Patent number: 7505281Abstract: A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned metal wiring film extending along a second major surface thereof. The wiring board includes solid metal interconnects connecting the first patterned metal wiring film to the second patterned metal wiring film, the interconnects extending through at least one of the first and second insulating films, and a microelectronic element disposed between the first and second patterned wiring films, the microelectronic element having bond pads conductively connected to the first patterned metal wiring films. The wiring board also includes a plurality of external contacts exposed at one or more external surfaces of the multilayer wiring board, the contacts being conductively connected to at least one of the first and second patterned metal wiring films.Type: GrantFiled: January 24, 2007Date of Patent: March 17, 2009Assignee: Tessera Interconnect Materials, Inc.Inventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Publication number: 20080296254Abstract: To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an inter layer insulating film allows for inter layer connection between plural wiring films insulated from one another with plural inter layer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the inter layer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 ?m or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.Type: ApplicationFiled: January 11, 2008Publication date: December 4, 2008Applicant: Tessera Interconnect Materials, Inc.Inventors: Tomoo Iijima, Yoshitaka Fukuoka
-
Publication number: 20080169568Abstract: A multilayer interconnect element is provided which includes at least one dielectric element in which metal interconnect patterns are exposed at an outer surface thereof, the metal interconnect patterns having outer surfaces which are co-planar with an exposed outer surface of the dielectric element. In addition, multilayer interconnect elements are provided in which second interconnect elements which do not have co-planar interconnect patterns are integrated therewith as intermediate elements, and the resulting multilayer interconnect element has co-planar interconnect patterns.Type: ApplicationFiled: August 29, 2007Publication date: July 17, 2008Applicant: Tessera Interconnect Materials, Inc.Inventors: Hideki Kotake, Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino, Tomoo Iijima
-
Publication number: 20080136041Abstract: An interconnect element is provided which includes a dielectric element having a major surface. Metal interconnect patterns are embedded in recesses which extend inwardly from the major surface, the outer surfaces of the interconnect patterns being substantially co-planar with the major surface and extending in one or more directions of the major surface. A projecting conductive film extends over the major surface in at least one direction parallel to a plane defined by the major surface such that it contacts the dielectric element along at least a portion of the major surface and conductively contacts an outer surface of at least one of the metal interconnect patterns.Type: ApplicationFiled: May 23, 2007Publication date: June 12, 2008Applicant: Tessera Interconnect Materials, Inc.Inventors: Hideki Kotake, Kiyoshi Hyodo, Inetaro Kurosawa, Yukio Hashimoto, Toku Yoshino, Tomoo Iijima
-
Publication number: 20080110018Abstract: A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.Type: ApplicationFiled: September 29, 2005Publication date: May 15, 2008Applicants: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, TESSERA INTERCONNECT MATERIALS, INC.Inventors: Kazuhiro Shimizu, Masanobu Yagi, Kenichiro Hanamura, Mitsuyuki Takayasu, Kiyoe Nagai, Tomoo Iijima