Abstract: A method for manufacturing a semiconductor device includes preparing a lead frame that includes a die pad including a first plane and a second plane located on an opposite side of the first plane, and a plurality of leads arranged next to the die pad, mounting a semiconductor chip including a surface, a plurality of electrodes formed over the surface, and a reverse side located on an opposite side of the surface over a chip mounting area of the first plane of the die pad, electrically coupling parts of the electrodes of the semiconductor chip and the leads through a plurality of first wires and electrically coupling other parts of the electrodes and the die pad through a second wire after the mounting the semiconductor chip, and after the electrically coupling, sealing the semiconductor chip, the first wires, and the second wire with a resin.

Abstract: A semiconductor device, includes a die pad that has a first main surface and a second main surface located on the opposite side of the first main surface; a lead arranged next to the die pad; a semiconductor chip that has a surface, a first electrode and a second electrode formed on the surface, and a reverse side located on the opposite side of the surface, and is mounted on a chip mounting area of the first main of the die pad; a first wire that electrically couples the first electrode of the semiconductor chip and the lead; a second wire that electrically couples the second electrode of the semiconductor chip and the die pad; and a sealed body that seals the semiconductor chip, the first wire, and the second wire.

Abstract: A method for manufacturing a semiconductor device, includes: (a) preparing a lead frame that includes a die pad having a first plane and a second plane located on the opposite side of the first plane, and a plurality of leads arranged next to the die pad; (b) mounting a semiconductor chip having a surface, a plurality of electrodes formed over the surface, and a reverse side located on the opposite side of the surface over a chip mounting area of the first plane of the die pad; (c) electrically coupling parts of the electrodes of the semiconductor chip and the leads through a plurality of first wires and electrically coupling the other parts of the electrodes and the die pad through a second wire.

Abstract: A method for manufacturing a semiconductor device, includes: (a) preparing a lead frame that includes a die pad having a first plane and a second plane located on the opposite side of the first plane, and a plurality of leads arranged next to the die pad; (b) mounting a semiconductor chip having a surface, a plurality of electrodes formed over the surface, and a reverse side located on the opposite side of the surface over a chip mounting area of the first plane of the die pad; (c) electrically coupling parts of the electrodes of the semiconductor chip and the leads through a plurality of first wires and electrically coupling the other parts of the electrodes and the die pad through a second wire.

Abstract: A method according to the invention has a bonding process of mounting a semiconductor chip on an upper surface of a die pad that has the upper surface whose area is larger than a reverse side of the semiconductor chip. It also has a sealed body formation process of sealing the semiconductor chip so that an undersurface opposite to the upper surface of the die pad may be exposed after the bonding process. Here, the upper surface of the die pad is arranged around an area over which the semiconductor chip is mounted, and has a hollow part arrangement area in which a groove or multiple holes are formed. Moreover, surface roughness of the upper surface is made coarser than surface roughness of the undersurface.

Abstract: A method according to the invention has a bonding process of mounting a semiconductor chip on an upper surface of a die pad that has the upper surface whose area is larger than a reverse side of the semiconductor chip. It also has a sealed body formation process of sealing the semiconductor chip so that an undersurface opposite to the upper surface of the die pad may be exposed after the bonding process. Here, the upper surface of the die pad is arranged around an area over which the semiconductor chip is mounted, and has a hollow part arrangement area in which a groove or multiple holes are formed. Moreover, surface roughness of the upper surface is made coarser than surface roughness of the undersurface.

Abstract: A semiconductor device with a LOC structure having a semiconductor device lead frame, TAB leads, and an insulating TAB tape, wherein the semiconductor device lead frame has a plurality of leads and is formed by fixing a semiconductor element on one surface side of the leads through insulating tapes. The leads are arranged to correspond to electrodes of the semiconductor element, wherein the TAB leads electrically connect the leads of the semiconductor device lead frame and the electrodes on the semiconductor element, and wherein the insulating TAB tape has electrical insulating characteristics and is fixed on the other surface side of the leads of the semiconductor device lead frame to surround a group electrodes of the semiconductor element, the insulating TAB tape serving to hold the TAB leads to be isolated from each other.

Abstract: A semiconductor chip mounted on an island is electrically connected to inner leads through tape-automated bonding leads supported by an insulating suspender tape, and a support ring is connected between the insulating suspender tape and suspender pins connected to the island so as to maintain an original relative position between the semiconductor chip and the tape-automated bonding leads during a molding stage.