Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: A resin composition having, in a cured state, a thermal conductivity of 5 W/(m·K) or more and a storage elastic modulus of 8 GPa or less.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided is a method of producing a laminate, the method including: a resin layer forming step of forming a resin layer on a first member; and a member arranging step of arranging a second member on the resin layer, in which at least one of the following conditions (1) and (2) is satisfied: (1) the surface roughness (Rz) of a surface of the first member that contacts the resin layer is larger than the surface roughness (Rz) of a surface of the second member that contacts the resin layer; and (2) the surface of the second member that contacts the resin layer has a surface roughness (Rz) of 20 ?m or less.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: A circuit board production method, the method comprising a process of disposing a circuit sheet on a substrate, the circuit sheet comprising circuits and a resin portion disposed at spaces between the circuits.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract: A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 ?m and less than 1 ?m, not less than 1 ?m and less than 10 ?m, from 10 ?m to 50 ?m, and from 20 ?m to 100 ?m, and in which a peak present in a range of from 10 ?m to 50 ?m includes an aluminum oxide particle, and a peak present in a range of from 20 ?m to 100 ?m includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.

Abstract: A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 ?m and less than 1 ?m, not less than 1 ?m and less than 10 ?m, from 10 ?m to 50 ?m, and from 20 ?m to 100 ?m, and in which a peak present in a range of from 10 ?m to 50 ?m includes an aluminum oxide particle, and a peak present in a range of from 20 ?m to 100 ?m includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.

Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.

Abstract: The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 ?m or less at a surface that does not face the resin composition layer.

Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.

Abstract: A multilayer resin sheet including: a resin layer that includes an epoxy resin monomer, a curing agent, and a filler; and an adhesive layer positioned on at least one face of the resin layer, the filler having peaks in ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, respectively, in terms of particle size distribution as measured by laser diffractometry, and the filler having a particle size of from 10 ?m to 100 ?m including a boron nitride filler.

Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.