Patents by Inventor Tomoo Nishiyama

Tomoo Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210206906
    Abstract: A resin composition having, in a cured state, a thermal conductivity of 5 W/(m·K) or more and a storage elastic modulus of 8 GPa or less.
    Type: Application
    Filed: May 31, 2018
    Publication date: July 8, 2021
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Hidetoshi INOUE, Yoshihiro AMANO, Daisuke FUJIMOTO
  • Patent number: 10988585
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: April 27, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Tomoo Nishiyama, Yoshitaka Takezawa, Hideyuki Katagi, Kazuya Kiguchi
  • Publication number: 20210016546
    Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.
    Type: Application
    Filed: March 15, 2018
    Publication date: January 21, 2021
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Daisuke FUJIMOTO, Norihiko SAKAMOTO
  • Patent number: 10851200
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: December 1, 2020
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kazuya Kiguchi, Tomoo Nishiyama, Yoshitaka Takezawa
  • Publication number: 20200324538
    Abstract: Provided is a method of producing a laminate, the method including: a resin layer forming step of forming a resin layer on a first member; and a member arranging step of arranging a second member on the resin layer, in which at least one of the following conditions (1) and (2) is satisfied: (1) the surface roughness (Rz) of a surface of the first member that contacts the resin layer is larger than the surface roughness (Rz) of a surface of the second member that contacts the resin layer; and (2) the surface of the second member that contacts the resin layer has a surface roughness (Rz) of 20 ?m or less.
    Type: Application
    Filed: May 31, 2017
    Publication date: October 15, 2020
    Inventors: Tomoo NISHIYAMA, Kazuya KIGUCHI, Yoshitaka TAKEZAWA
  • Publication number: 20200223994
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Application
    Filed: August 25, 2016
    Publication date: July 16, 2020
    Inventors: Tomoo NISHIYAMA, Yoshitaka TAKEZAWA, Hideyuki KATAGI, Kazuya KIGUCHI
  • Publication number: 20200163221
    Abstract: A circuit board production method, the method comprising a process of disposing a circuit sheet on a substrate, the circuit sheet comprising circuits and a resin portion disposed at spaces between the circuits.
    Type: Application
    Filed: April 10, 2017
    Publication date: May 21, 2020
    Inventors: Tomoo NISHIYAMA, Mitsuo TOGAWA, Yoshitaka TAKEZAWA, Yuki NAKAMURA, Kazuya KIGUCHI, Yasuo MIYAZAKI, Shinji AMANUMA
  • Patent number: 10590232
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: March 17, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuya Kiguchi, Tomoo Nishiyama, Yoshitaka Takezawa
  • Publication number: 20200071455
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Yoshitaka TAKEZAWA
  • Publication number: 20190338069
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Application
    Filed: May 23, 2017
    Publication date: November 7, 2019
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Yoshitaka TAKEZAWA
  • Publication number: 20180009979
    Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
    Type: Application
    Filed: September 20, 2017
    Publication date: January 11, 2018
    Inventors: Tomoo NISHIYAMA, Haruaki SUE, Hideyuki KATAGI, Naoki HARA, Hiroyuki TAKAHASHI, Yasuo MIYAZAKI, Yoshitaka TAKEZAWA, Hiroyuki TANAKA, Kensuke YOSHIHARA, Masayoshi JOUMEN
  • Patent number: 9745411
    Abstract: A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 ?m and less than 1 ?m, not less than 1 ?m and less than 10 ?m, from 10 ?m to 50 ?m, and from 20 ?m to 100 ?m, and in which a peak present in a range of from 10 ?m to 50 ?m includes an aluminum oxide particle, and a peak present in a range of from 20 ?m to 100 ?m includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: August 29, 2017
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomoo Nishiyama, Shigemitsu Yoshie, Naoki Hara, Kazumasa Fukuda, Atsushi Kuwano, Yasuo Miyazaki
  • Publication number: 20160177024
    Abstract: A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 ?m and less than 1 ?m, not less than 1 ?m and less than 10 ?m, from 10 ?m to 50 ?m, and from 20 ?m to 100 ?m, and in which a peak present in a range of from 10 ?m to 50 ?m includes an aluminum oxide particle, and a peak present in a range of from 20 ?m to 100 ?m includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.
    Type: Application
    Filed: June 26, 2014
    Publication date: June 23, 2016
    Inventors: Tomoo NISHIYAMA, Shigemitsu YOSHIE, Naoki HARA, Kazumasa FUKUDA, Atsushi KUWANO, Yasuo MIYAZAKI
  • Patent number: 9349931
    Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: May 24, 2016
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Naoki Hara, Kensuke Yoshihara, Hideyuki Katagi
  • Publication number: 20140283972
    Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
    Type: Application
    Filed: June 5, 2014
    Publication date: September 25, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomoo NISHIYAMA, Haruaki SUE, Hideyuki KATAGI, Naoki HARA, Hiroyuki TAKAHASHI, Yasuo MIYAZAKI, Yoshitaka TAKEZAWA, Hiroyuki TANAKA, Kensuke YOSHIHARA, Masayoshi JOUMEN
  • Publication number: 20140079913
    Abstract: The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 ?m or less at a surface that does not face the resin composition layer.
    Type: Application
    Filed: February 24, 2012
    Publication date: March 20, 2014
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Yasuhiko Awano
  • Publication number: 20140015000
    Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 16, 2014
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Naoki Hara, Kensuke Yoshihara, Hideyuki Katagi
  • Publication number: 20130189514
    Abstract: A multilayer resin sheet including: a resin layer that includes an epoxy resin monomer, a curing agent, and a filler; and an adhesive layer positioned on at least one face of the resin layer, the filler having peaks in ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, respectively, in terms of particle size distribution as measured by laser diffractometry, and the filler having a particle size of from 10 ?m to 100 ?m including a boron nitride filler.
    Type: Application
    Filed: October 6, 2011
    Publication date: July 25, 2013
    Inventors: Tomoo Nishiyama, Yoshitaka Takezawa, Hideyuki Katagi, Naoki Hara, Yasuo Miyazaki, Kensuke Yoshihara
  • Publication number: 20120251830
    Abstract: A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. In the following general formula (I), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group, or an aralkyl group; m represents an integer of 0 to 2; and n an integer of 1 to 7.
    Type: Application
    Filed: September 28, 2010
    Publication date: October 4, 2012
    Applicant: Hitachi Chemical Company, LTD
    Inventors: Tomoo Nishiyama, Haruaki Sue, Hideyuki Katagi, Naoki Hara, Hiroyuki Takahashi, Yasuo Miyazaki, Yoshitaka Takezawa, Hiroyuki Tanaka, Kensuke Yoshihara, Masayoshi Joumen
  • Publication number: 20120244351
    Abstract: A multilayer resin sheet is constituted by including a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent and an inorganic filler, and an insulating adhesive layer formed on at least either of the surfaces of the resin layer. A cured multilayer resin sheet originated from the multilayer resin sheet has high thermal conductivity, good insulation and adhesive strength, and, further, superior thermal shock resistance, and is suitable as an electric insulating material to be used for an electric or electronic device.
    Type: Application
    Filed: September 28, 2010
    Publication date: September 27, 2012
    Inventors: Hideyuki Katagi, Yoshitaka Takezawa, Tomoo Nishiyama, Naoki Hara, Hiroyuki Tanaka, Kensuke Yoshihara, Masayoshi Joumen, Hiroyuki Takahashi