Patents by Inventor Tomoo OOTSUKI

Tomoo OOTSUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160064346
    Abstract: This invention provides a semiconductor device with improved reliability. A pad includes a slit portion formed so as to pass through the pad, and also includes a bonding portion positioned inside the slit portion in plan view, and an edge portion positioned outside the slit portion in plan view. In plan view, a via encloses the slit portion and is in contact with the bonding portion of the pad and the edge portion of the pad.
    Type: Application
    Filed: June 10, 2015
    Publication date: March 3, 2016
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: Tomoo OOTSUKI