Abstract: A connector?substrate assembly can be disposed at a position where a tip portion of the connector is inserted into a connector hole simply and at a low cost without using an additional small substrate, an additional relay cable, and the like; an electronic device; and a method for assembling the same are provided. A connector is supported so as to be slidable with respect to a substrate, from a preparation position to a mounting position, and the tip of the connector projects outwardly from a right side of an end portion of the substrate at least at the mounting position. A chassis has a connector hole in the side surface. The connector does not interfere with a frame portion of the connector hole at the preparation position and the substrate can be properly attached to the chassis. The tip of the connector enters the connector hole at the mounting position.

Abstract: A connector?substrate assembly can be disposed at a position where a tip portion of the connector is inserted into a connector hole simply and at a low cost without using an additional small substrate, an additional relay cable, and the like; an electronic device; and a method for assembling the same are provided. A connector is supported so as to be slidable with respect to a substrate, from a preparation position to a mounting position, and the tip of the connector projects outwardly from a right side of an end portion of the substrate at least at the mounting position. A chassis has a connector hole in the side surface. The connector does not interfere with a frame portion of the connector hole at the preparation position and the substrate can be properly attached to the chassis. The tip of the connector enters the connector hole at the mounting position.

Abstract: A credit administration management system includes: a control card storage unit that stores a credit application number, a scheduled signing date, a scheduled credit issuance date, a status, and check completion flags for a plurality of bank rule items in each predetermined term, while associating them with a control card code; and a control card creation unit that registers a record in the control card storage unit in response to reception of the credit application number, a credit application condition part containing a condition for conditionally approving a credit application, and a fulfillment deadline, and a terms and conditions part containing a condition required for lending, the control card creation unit storing a value indicating incompletion in an item to be checked among the plurality of bank rule items based on the credit application condition part and the terms and conditions part.

Abstract: Tension members anchored to a wearer's body to resist femoral acetabular impingement (FAI)-causing movements. A first tension member is anchored to the body of a subject, and produces a force on the subject's body to primarily limit the ability of the subject's thigh to internally rotate and the ability of the subject's knee to adduct. Thus, this first tension member resists the tendency of the subject's leg to twist inward or deflect inward, each of which may contribute to FAI. A second tension member is anchored to the subject's body, and provides a force to the subject's body to primarily limit the ability of the subject's hip joint to move in flexion. Thus, the second tension member resists the tendency of the subject's leg to raise too high, which may also contribute to FAI.

Abstract: Tension members anchored to a wearer's body to resist femoral acetabular impingement (FAI)-causing movements. A first tension member is anchored to the body of a subject, and produces a force on the subject's body to primarily limit the ability of the subject's thigh to internally rotate and the ability of the subject's knee to adduct. Thus, this first tension member resists the tendency of the subject's leg to twist inward or deflect inward, each of which may contribute to FAI. A second tension member is anchored to the subject's body, and provides a force to the subject's body to primarily limit the ability of the subject's hip joint to move in flexion. Thus, the second tension member resists the tendency of the subject's leg to raise too high, which may also contribute to FAI.

Abstract: A nitride semiconductor light emitting element having a laminate S made of a semiconductor crystal layer, wherein the laminate S includes an n-type layer 2, a light emitting layer 3 and a p-type layer 4. The p-type layer 4 has a p-type contact layer 42 to be in contact with the p-side electrode P2. The p-type contact layer 42 comprises a first contact layer 42a and a second contact layer 42b. The first contact layer 42a is in contact with the p-side electrode P2 on one surface and in contact with the second contact layer 42b on the other surface. The first contact layer 42a is made of Alx1Iny1Gaz1N (0<x1?1, 0?y1?1, 0?z1?1), and the second contact layer 42b is made of Alx2Iny2Gaz2N (0?x2?1, 0?y2?1, 0?z2?1). 0?x2<x1, 0?y1?y2, and the first contact layer 42a has a thickness of 0.5 nm-2 nm.

Abstract: The present invention provides an inexpensive card connector assembly which is used for the connection with two cards having mutually different transmission speeds, which can maintain transmission characteristics, and which is therefore suitable for high-speed transmission. The card connector assembly comprises first and second card connectors that are stacked for the connection with two cards having mutually different transmission speeds, and transmission paths for connecting the first and second card connectors to a circuit board. The transmission paths comprise a plurality of first and second terminal parts that respectively extend from the first and second card connectors, and a rigid board to which the first and second terminal parts are connected.

Abstract: The present invention provides an inexpensive card connector assembly which is used for the connection with two cards having mutually different transmission speeds, which can maintain transmission characteristics, and which is therefore suitable for high-speed transmission. The card connector assembly comprises first and second card connectors that are stacked for the connection with two cards having mutually different transmission speeds, and transmission paths for connecting the first and second card connectors to a circuit board. The transmission paths comprise a plurality of first and second terminal parts that respectively extend from the first and second card connectors, and a rigid board to which the first and second terminal parts are connected.

Abstract: The present invention provides a cochineal pigment-containing beverage comprising nigerooligosaccharide and an anti-fading method for a cochineal pigment-containing beverage comprising adding thereto nigerooligosaccharide.

Abstract: A compact ZIF type socket is provided having the durability to withstand numerous movements of the slider. The ZIF type IC socket 1 consists of a base housing assembly 10 that accommodates numerous contacts, and a cover housing assembly 40 that can slide over the base housing assembly 10. The cover housing assembly 40 is caused to move in relative terms by inserting a plate-form tool 99 into tool insertion holes 65 and 85 respectively formed in a metal supporting plate 60 on the side of the base housing assembly 10 and a metal supporting plate 80 on the side of the cover housing assembly 40, and rotating this tool 99. The action points of the tool insertion holes 65 and 85 contacted by the tool 99 are formed as circular-arc-form projections 75, 76, 95 and 96. Accordingly, the force of the tool 99 can be transmitted to the base housing assembly 10 and cover housing assembly 40 without causing indentation or damage, etc.

Abstract: A semiconductor light emitting element comprising an n-type semiconductor substrate and a light emitting part comprising an n-type cladding layer composed of an InGaAlP compound semiconductor material, an active layer and a p-type cladding layer formed in that order from the substrate side by double heterojunction, wherein said semiconductor light emitting element satisfies at least one of the following conditions:A. the thickness of said active layer being greater than 0.75 .mu.m and not more than 1.5 .mu.m, andB. the thickness of said p-type cladding layer being 0.5 .mu.m-2.0 .mu.m. According to the light emitting element of the present invention, an overflow of electron into the p-type cladding layer can be suppressed by setting the thickness of the active layer and the p-type cladding layer to fall within the above-mentioned specific ranges, as a result of which the element shows luminous efficiency peaked within the specified range.

Abstract: In the light emitting element comprising an n-type semiconductor substrate, a lower electrode formed on the lower surface of the substrate, and a light emitting part having a pn junction, which is composed of an InGaAlP compound semiconductor material, a p-type current diffusing layer and an upper electrode which are laminated on the upper surface of the substrate in that order from the substrate side, the improvement wherein a carrier concentration of the current diffusing layer is lower on a light emitting part side thereof than that on an upper electrode side thereof, and at least the upper electrode side of the current diffusing layer is composed of GaP. By employing such structure, diffusion of the dopant to a light emitting part can be suppressed even when the carrier concentration of the upper part of the current diffusing layer is set to be higher, thereby affording a lower resistance of the current diffusing layer as a whole.

Abstract: A latching device (10) for a card edge connector (30) and auxiliary board (60) having a first arm (12) and a second arm (14), wherein the second arm includes a latching unit (20) and a latching release unit (26), when the latching device (10) is inserted into a receptacle compartment (46) in the connector (30), the first arm (12) is biased toward the second arm for fixing the latching device (10) in the receptacle compartment. The latching unit (20) includes round shoulders (22, 24) which are provided to fit into round recesses (62) of an auxiliary board (60). A directed pressure (A, B, C) placed on the release unit (26) causes the latching unit (20) to rotate away from an area in card edge connector (30) where an auxiliary board is disposed.

Abstract: The purpose of this invention is to offer an edge connector which requires less space for insertion of a card and has a reduced stress in the housing due to dissipation of mechanical stress. Accordingly, the invention comprises a C-shaped connector 1 having a housing that has a reception groove 8 and guiding grooves 10, 10' for a memory card 100. In the upper walls forming the guiding grooves 10, 10' protrusions 12, 14 are formed. These protrusions match indentations 108, 110 in the memory card. The memory card 100 can be inserted into the guiding grooves 10, 10; only when the protrusions 12, 14 and indentations 108, 110 are properly aligned. After that the memory card is moved along the grooves 10, 10' toward the contacts 70, 70' arranged in the main body 4 of the housing.

Abstract: An improved board-to-board electrical connector includes opposite guide posts whose height can be reduced before the connector is placed into an automated soldering apparatus for soldering the connector terminals to selected conductors of a printed circuit board. Each guide post includes an upper and a lower section and the height adjustment of the guide posts is effected by pivotally mounting the upper sections of the guide posts such that they can be rotated into a vertical or horizontal position.

Abstract: Disclosed is a surface-mounted component's contact having an inverted "T"-shaped soldering portion. The contact is to be mounted to the surface of a printed circuit board, and is to be electrically connected to a conductor on the printed circuit board by soldering its soldering portion to the conductor. The soldering portion comprises a flat foot and a leg, which is integrally connected to and rising from the midportion of said foot. The relatively large foot has an effect of causing substantial reduction of the load per unit of solder upon application of an undesired force to the terminal, and of increasing the resistivity of the solder against removal from the conductor of the printed circuit board.