Abstract: In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.

Abstract: A method for manufacturing a laminated ceramic electronic component is provided in which a plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

Abstract: In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface.

Abstract: A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

Abstract: A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

Abstract: In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.

Abstract: In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface.

Abstract: A plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.

Abstract: A highly reliable multilayer ceramic electronic device is obtained while preventing crack defects generated in a ceramic laminate by application of a heat shock in a mounting step or the like. The multilayer ceramic electronic device is constructed such that the average value of continuities of internal electrodes located in two regions (f) is lower by 5% to 20% inclusive than the average value of continuities of internal electrodes located in the central portion in a lamination direction. The two regions (f) are the regions from the topmost internal electrode and the bottommost internal electrode located in the lamination direction to the inside, respectively, within 10% of the distance (d) therebetween. Continuity is defined by (X?Y)/X in which X is the length of a cross section of an internal electrode in one direction and Y indicates the sum of gaps (g) formed by pores in the cross section of the internal electrode.

Abstract: A highly reliable multilayer ceramic electronic device is obtained while preventing crack defects generated in a ceramic laminate by application of a heat shock in a mounting step or the like. The multilayer ceramic electronic device is constructed such that the average value of continuities of internal electrodes located in two regions (f) is lower by 5% to 20% inclusive than the average value of continuities of internal electrodes located in the central portion in a lamination direction. The two regions (f) are the regions from the topmost internal electrode and the bottommost internal electrode located in the lamination direction to the inside, respectively, within 10% of the distance (d) therebetween. Continuity is defined by (X?Y)/X in which X is the length of a cross section of an internal electrode in one direction and Y indicates the sum of gaps (g) formed by pores in the cross section of the internal electrode.